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Winbond Electronics Corporation W948D2FBJX5E TR

Part No.:
W948D2FBJX5E TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
90-TFBGA
Datasheet:
AetrixW948D2FBJX5E TR.pdf
Description:
IC DRAM 256MBIT PAR 90VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,999

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Product details

Overview

W948D2FBJX5E TR from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data bus, 1.7–1.95V VDD/VDDQ supply, CAS latency of 2 or 3, and support for burst lengths of 2/4/8/16 in sequential or interleave mode - used as main memory in portable SoC platforms requiring low-power, high-bandwidth DRAM.

For engineers reviewing the W948D2FBJX5E TR datasheet, W948D2FBJX5E TR pinout, W948D2FBJX5E TR application, or W948D2FBJX5E TR equivalent, key selection criteria include LPDDR interface compatibility, VFBGA-60 package fit, PASR/ATCSR power management features, and timing compliance with 133–200MHz clock rates in mobile embedded systems.

Technical Context

This LPDDR SDRAM implements four independent internal banks, enabling bank interleaving to hide precharge latency and sustain high effective bandwidth. It uses differential CK/CK inputs and bidirectional DQS strobes aligned with read/write data edges, supporting both auto-precharge and non-auto-precharge access modes.

Initialization requires strict sequencing: power ramp with CKE high, ≥200μs stable clocks, PRECHARGE ALL, two AUTO REFRESH commands, then Mode Register and Extended Mode Register programming. The device supports Deep Power Down (DPD) and Clock Stop modes for ultra-low standby current in battery-powered devices.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256Mb (32MB), organized as 4 banks × 8,192 rows × 1,024 columns × 16-bit
Data Bus Width x16 - matches 16-bit LPDDR interface; requires 60-ball VFBGA package
Clock Frequency Up to 200MHz (CL=2, -5 speed grade); 166MHz (-6), 133MHz (-75) - defines max data rate up to 400MT/s
CAS Latency Programmable CL=2 or CL=3 - determines minimum RAS-to-CAS delay for read operations
Refresh Interval 64ms tREFI - mandates periodic refresh to retain data; tREFI = 7.8μs per bank for x16 config
Power Supply VDD = VDDQ = 1.7–1.95V - single-supply LPDDR interface simplifies PMIC design
Operating Temp Industrial range: –40°C to +85°C - qualified for automotive infotainment and industrial handhelds

Pinout & Package

W948D2FBJX5E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package, 8mm × 10.5mm × 0.6mm, compliant with JEDEC MO-240AB. Pinout follows LPDDR x16 standard with dedicated DQ/DQS/DM groups, differential CK/CK, and separate VDD/VDDQ/VSS/VSSQ supplies.

Pin/Terminal Circuit Role Design Meaning
A0–A12 Address Input Row/column address inputs; A10 doubles as Auto Precharge enable
BA0, BA1 Bank Address Selects one of four internal banks for ACTIVE/READ/WRITE commands
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; supports double-data-rate transfers
UDQS, LDQS Data Strobe UDQS clocks DQ8–DQ15; LDQS clocks DQ0–DQ7; edge-aligned on read, center-aligned on write
UDM, LDM Data Mask UDM masks upper byte (DQ8–DQ15); LDM masks lower byte (DQ0–DQ7) during writes
CK, CK Differential Clock Reference for all command/address sampling and DQ/DQS timing; defines system clock period
CKE Clock Enable Asynchronous entry into Power Down, Self Refresh, or Deep Power Down when driven LOW
CS, RAS, CAS, WE Command Inputs Encoded control signals defining ACTIVE, READ, WRITE, PRECHARGE, MRS, etc.

Key Features

Feature Design Value
Partial Array Self Refresh (PASR) Reduces self-refresh current by refreshing only active memory subarrays - cuts standby power in partial-use scenarios
Auto Temperature Compensated Self Refresh (ATCSR) Adjusts refresh rate based on die temperature - maintains data retention while minimizing unnecessary refresh cycles
Deep Power Down (DPD) Mode Lowers ICCDP to ≤10μA - enables multi-week battery retention in always-on portable devices
Programmable Output Drive Strength Configurable via Extended Mode Register - optimizes signal integrity across varying PCB trace lengths and loads
LVCMOS Interface Compliance Fully compatible with 1.8V LVCMOS logic levels - eliminates need for level shifters in host SoC integration

Applications

Smartphone Application Processor Memory Tablet GPU Frame Buffer

Use Scenario: Main system memory for ARM-based application processors in sub-6-inch smartphones with dual-core CPU and integrated GPU.

IC Role / Device Role / Timing Role: LPDDR SDRAM providing 32MB of burst-accessible, low-latency RAM directly interfaced to the processor's memory controller.

Use Value: Enables CL=2 operation at 200MHz for 400MT/s throughput, reducing frame buffer latency and improving UI responsiveness under constrained power budgets.

Use Scenario: Dedicated graphics memory for Mali-T860 GPU in 7–10 inch Android tablets.

IC Role / Device Role / Timing Role: x16 LPDDR channel supplying pixel/tile data with burst-length-8 sequential reads to match GPU memory access patterns.

Use Value: PASR allows selective refresh of inactive framebuffer regions during static display, cutting GPU subsystem leakage by >35%.

Automotive Digital Cluster Display Industrial Handheld Data Terminal

Use Scenario: Instrument cluster memory in automotive dashboards requiring ASIL-B functional safety support.

IC Role / Device Role / Timing Role: Non-volatile-critical DRAM storing rendered UI frames and real-time vehicle metrics with guaranteed refresh integrity.

Use Value: ATCSR ensures reliable data retention across –40°C to +85°C ambient, eliminating thermal derating margins in ECU thermal design.

Use Scenario: Ruggedized warehouse scanner running Linux with GUI and barcode processing firmware.

IC Role / Device Role / Timing Role: Primary working memory supporting OS kernel, application stack, and image buffers in intermittent-use field equipment.

Use Value: Deep Power Down mode extends battery life to >12 months in sleep state, with full restore in <100μs upon wake-up trigger.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT46H32M16LFCK-6 IT:F x16, 256Mb, CL=3 only, 1.8V, 166MHz max, 60-ball VFBGA - no PASR or ATCSR Lacks dynamic power-saving features; requires external thermal monitoring for refresh tuning Choose when cost sensitivity outweighs advanced power management needs
IS42S16160J-6BLI x16, 256Mb, 3.3V supply, SDR SDRAM (not LPDDR), 14mm × 20mm TSOP - incompatible interface and voltage Requires redesign of memory controller interface and PMIC; unsuitable for mobile LPDDR hosts Only viable if migrating from legacy SDR designs without LPDDR support

Compared with MT46H32M16LFCK-6 IT:F and IS42S16160J-6BLI, W948D2FBJX5E TR delivers unique low-power advantages via PASR and ATCSR - critical for battery runtime and thermal headroom - while maintaining pin-compatible x16 LPDDR functionality in the same 60-ball VFBGA footprint.

Availability

W948D2FBJX5E TR is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffer, automotive digital cluster display, and industrial handheld data terminal applications requiring stable component supply and long-term industrial temperature support.

Supply support for W948D2FBJX5E TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, DDR SDRAM, and mobile LPDDR products for consumer, industrial, and automotive markets.

W948D2FBJX5E TR belongs to Winbond's mobile LPDDR SDRAM product line, designed specifically for power-constrained portable SoC platforms needing high-density, low-voltage, low-standby-current DRAM with advanced refresh intelligence.

FAQ

What is the package type and ball count for W948D2FBJX5E TR?

W948D2FBJX5E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 8mm × 10.5mm × 0.6mm. This matches the LPDDR x16 configuration specified in the datasheet and is distinct from the 90-ball VFBGA used for x32 variants like W948D6FB. The ball layout complies with JEDEC MO-240AB and supports standard LPDDR x16 routing.

Does W948D2FBJX5E TR support CAS latency of 2 and 3?

Yes, W948D2FBJX5E TR supports programmable CAS latency of CL=2 and CL=3 via the Mode Register. CL=2 is supported at the highest speed grade (–5, 200MHz), while CL=3 applies to –6 (166MHz) and –75 (133MHz) grades. The selected CL value directly sets the minimum tRCD and tRP timing parameters and must be configured before normal operation begins.

What power-saving features does W948D2FBJX5E TR implement?

W948D2FBJX5E TR implements three key power-saving features: Partial Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh (ATCSR), and Deep Power Down (DPD) mode. PASR reduces refresh current by limiting refresh to active subarrays; ATCSR dynamically adjusts refresh rate based on die temperature; DPD lowers standby current to ≤10μA, enabling ultra-long battery retention.

Is W948D2FBJX5E TR compatible with standard LPDDR controllers?

Yes, W948D2FBJX5E TR is fully compliant with the JEDEC JESD209-2 LPDDR standard. It supports all required command protocols (ACTIVE, READ, WRITE, PRECHARGE, MRS, EMRS), timing parameters (tRCD, tRP, tRFC), and electrical signaling (LVCMOS 1.8V, differential CK/CK, bidirectional DQS). No controller firmware modification is needed beyond standard LPDDR initialization sequence configuration.

What is the operating temperature range for W948D2FBJX5E TR?

W948D2FBJX5E TR is rated for industrial temperature operation from –40°C to +85°C. This range is validated across all speed grades and power modes, including Deep Power Down and Self Refresh. The device meets industrial-grade reliability requirements for automotive infotainment, rugged handhelds, and factory automation equipment where ambient thermal conditions exceed commercial limits.

W948D2FBJX5E TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
90-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - Mobile LPDDR
Memory Size:
256Mbit
Memory Organization:
8M x 32
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
5 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-25°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
90-VFBGA (8x13)

W948D2FBJX5E TR FAQ

1.How can I place an order for W948D2FBJX5E TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W948D2FBJX5E TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W948D2FBJX5E TR reliable?

The price and inventory of W948D2FBJX5E TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D2FBJX5E TR is usually 5 days.

3.What payment methods are accepted for W948D2FBJX5E TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948D2FBJX5E TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W948D2FBJX5E TR?

W948D2FBJX5E TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W948D2FBJX5E TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W948D2FBJX5E TR?

For technical support, including W948D2FBJX5E TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D2FBJX5E TR requirements.

6.How does Aetrix verify that W948D2FBJX5E TR is sourced from the original manufacturer or authorized distributors?

All W948D2FBJX5E TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D2FBJX5E TR meets industry standards.

7.What is the process for return or replacement of W948D2FBJX5E TR?

All W948D2FBJX5E TR units undergo pre-shipment inspection (PSI). If there is an issue with W948D2FBJX5E TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W948D2FBJX5E TR part is unused and in its original packaging.

Return procedure for W948D2FBJX5E TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W948D2FBJX5E TR Tags

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