Winbond Electronics Corporation W948D2FBJX5E TR
- Part No.:
- W948D2FBJX5E TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 90-TFBGA
- Datasheet:
-
W948D2FBJX5E TR.pdf
- Description:
- IC DRAM 256MBIT PAR 90VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,999
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W948D2FBJX5E TR from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data bus, 1.7–1.95V VDD/VDDQ supply, CAS latency of 2 or 3, and support for burst lengths of 2/4/8/16 in sequential or interleave mode - used as main memory in portable SoC platforms requiring low-power, high-bandwidth DRAM.
For engineers reviewing the W948D2FBJX5E TR datasheet, W948D2FBJX5E TR pinout, W948D2FBJX5E TR application, or W948D2FBJX5E TR equivalent, key selection criteria include LPDDR interface compatibility, VFBGA-60 package fit, PASR/ATCSR power management features, and timing compliance with 133–200MHz clock rates in mobile embedded systems.
Technical Context
This LPDDR SDRAM implements four independent internal banks, enabling bank interleaving to hide precharge latency and sustain high effective bandwidth. It uses differential CK/CK inputs and bidirectional DQS strobes aligned with read/write data edges, supporting both auto-precharge and non-auto-precharge access modes.
Initialization requires strict sequencing: power ramp with CKE high, ≥200μs stable clocks, PRECHARGE ALL, two AUTO REFRESH commands, then Mode Register and Extended Mode Register programming. The device supports Deep Power Down (DPD) and Clock Stop modes for ultra-low standby current in battery-powered devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256Mb (32MB), organized as 4 banks × 8,192 rows × 1,024 columns × 16-bit |
| Data Bus Width | x16 - matches 16-bit LPDDR interface; requires 60-ball VFBGA package |
| Clock Frequency | Up to 200MHz (CL=2, -5 speed grade); 166MHz (-6), 133MHz (-75) - defines max data rate up to 400MT/s |
| CAS Latency | Programmable CL=2 or CL=3 - determines minimum RAS-to-CAS delay for read operations |
| Refresh Interval | 64ms tREFI - mandates periodic refresh to retain data; tREFI = 7.8μs per bank for x16 config |
| Power Supply | VDD = VDDQ = 1.7–1.95V - single-supply LPDDR interface simplifies PMIC design |
| Operating Temp | Industrial range: –40°C to +85°C - qualified for automotive infotainment and industrial handhelds |
Pinout & Package
W948D2FBJX5E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package, 8mm × 10.5mm × 0.6mm, compliant with JEDEC MO-240AB. Pinout follows LPDDR x16 standard with dedicated DQ/DQS/DM groups, differential CK/CK, and separate VDD/VDDQ/VSS/VSSQ supplies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row/column address inputs; A10 doubles as Auto Precharge enable |
| BA0, BA1 | Bank Address | Selects one of four internal banks for ACTIVE/READ/WRITE commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports double-data-rate transfers |
| UDQS, LDQS | Data Strobe | UDQS clocks DQ8–DQ15; LDQS clocks DQ0–DQ7; edge-aligned on read, center-aligned on write |
| UDM, LDM | Data Mask | UDM masks upper byte (DQ8–DQ15); LDM masks lower byte (DQ0–DQ7) during writes |
| CK, CK | Differential Clock | Reference for all command/address sampling and DQ/DQS timing; defines system clock period |
| CKE | Clock Enable | Asynchronous entry into Power Down, Self Refresh, or Deep Power Down when driven LOW |
| CS, RAS, CAS, WE | Command Inputs | Encoded control signals defining ACTIVE, READ, WRITE, PRECHARGE, MRS, etc. |
Key Features
| Feature | Design Value |
|---|---|
| Partial Array Self Refresh (PASR) | Reduces self-refresh current by refreshing only active memory subarrays - cuts standby power in partial-use scenarios |
| Auto Temperature Compensated Self Refresh (ATCSR) | Adjusts refresh rate based on die temperature - maintains data retention while minimizing unnecessary refresh cycles |
| Deep Power Down (DPD) Mode | Lowers ICCDP to ≤10μA - enables multi-week battery retention in always-on portable devices |
| Programmable Output Drive Strength | Configurable via Extended Mode Register - optimizes signal integrity across varying PCB trace lengths and loads |
| LVCMOS Interface Compliance | Fully compatible with 1.8V LVCMOS logic levels - eliminates need for level shifters in host SoC integration |
Applications
| Smartphone Application Processor Memory | Tablet GPU Frame Buffer |
|---|---|
|
Use Scenario: Main system memory for ARM-based application processors in sub-6-inch smartphones with dual-core CPU and integrated GPU. IC Role / Device Role / Timing Role: LPDDR SDRAM providing 32MB of burst-accessible, low-latency RAM directly interfaced to the processor's memory controller. Use Value: Enables CL=2 operation at 200MHz for 400MT/s throughput, reducing frame buffer latency and improving UI responsiveness under constrained power budgets. |
Use Scenario: Dedicated graphics memory for Mali-T860 GPU in 7–10 inch Android tablets. IC Role / Device Role / Timing Role: x16 LPDDR channel supplying pixel/tile data with burst-length-8 sequential reads to match GPU memory access patterns. Use Value: PASR allows selective refresh of inactive framebuffer regions during static display, cutting GPU subsystem leakage by >35%. |
| Automotive Digital Cluster Display | Industrial Handheld Data Terminal |
|
Use Scenario: Instrument cluster memory in automotive dashboards requiring ASIL-B functional safety support. IC Role / Device Role / Timing Role: Non-volatile-critical DRAM storing rendered UI frames and real-time vehicle metrics with guaranteed refresh integrity. Use Value: ATCSR ensures reliable data retention across –40°C to +85°C ambient, eliminating thermal derating margins in ECU thermal design. |
Use Scenario: Ruggedized warehouse scanner running Linux with GUI and barcode processing firmware. IC Role / Device Role / Timing Role: Primary working memory supporting OS kernel, application stack, and image buffers in intermittent-use field equipment. Use Value: Deep Power Down mode extends battery life to >12 months in sleep state, with full restore in <100μs upon wake-up trigger. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46H32M16LFCK-6 IT:F | x16, 256Mb, CL=3 only, 1.8V, 166MHz max, 60-ball VFBGA - no PASR or ATCSR | Lacks dynamic power-saving features; requires external thermal monitoring for refresh tuning | Choose when cost sensitivity outweighs advanced power management needs |
| IS42S16160J-6BLI | x16, 256Mb, 3.3V supply, SDR SDRAM (not LPDDR), 14mm × 20mm TSOP - incompatible interface and voltage | Requires redesign of memory controller interface and PMIC; unsuitable for mobile LPDDR hosts | Only viable if migrating from legacy SDR designs without LPDDR support |
Compared with MT46H32M16LFCK-6 IT:F and IS42S16160J-6BLI, W948D2FBJX5E TR delivers unique low-power advantages via PASR and ATCSR - critical for battery runtime and thermal headroom - while maintaining pin-compatible x16 LPDDR functionality in the same 60-ball VFBGA footprint.
Availability
W948D2FBJX5E TR is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffer, automotive digital cluster display, and industrial handheld data terminal applications requiring stable component supply and long-term industrial temperature support.
Supply support for W948D2FBJX5E TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, DDR SDRAM, and mobile LPDDR products for consumer, industrial, and automotive markets.
W948D2FBJX5E TR belongs to Winbond's mobile LPDDR SDRAM product line, designed specifically for power-constrained portable SoC platforms needing high-density, low-voltage, low-standby-current DRAM with advanced refresh intelligence.
FAQ
What is the package type and ball count for W948D2FBJX5E TR?
W948D2FBJX5E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 8mm × 10.5mm × 0.6mm. This matches the LPDDR x16 configuration specified in the datasheet and is distinct from the 90-ball VFBGA used for x32 variants like W948D6FB. The ball layout complies with JEDEC MO-240AB and supports standard LPDDR x16 routing.
Does W948D2FBJX5E TR support CAS latency of 2 and 3?
Yes, W948D2FBJX5E TR supports programmable CAS latency of CL=2 and CL=3 via the Mode Register. CL=2 is supported at the highest speed grade (–5, 200MHz), while CL=3 applies to –6 (166MHz) and –75 (133MHz) grades. The selected CL value directly sets the minimum tRCD and tRP timing parameters and must be configured before normal operation begins.
What power-saving features does W948D2FBJX5E TR implement?
W948D2FBJX5E TR implements three key power-saving features: Partial Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh (ATCSR), and Deep Power Down (DPD) mode. PASR reduces refresh current by limiting refresh to active subarrays; ATCSR dynamically adjusts refresh rate based on die temperature; DPD lowers standby current to ≤10μA, enabling ultra-long battery retention.
Is W948D2FBJX5E TR compatible with standard LPDDR controllers?
Yes, W948D2FBJX5E TR is fully compliant with the JEDEC JESD209-2 LPDDR standard. It supports all required command protocols (ACTIVE, READ, WRITE, PRECHARGE, MRS, EMRS), timing parameters (tRCD, tRP, tRFC), and electrical signaling (LVCMOS 1.8V, differential CK/CK, bidirectional DQS). No controller firmware modification is needed beyond standard LPDDR initialization sequence configuration.
What is the operating temperature range for W948D2FBJX5E TR?
W948D2FBJX5E TR is rated for industrial temperature operation from –40°C to +85°C. This range is validated across all speed grades and power modes, including Deep Power Down and Self Refresh. The device meets industrial-grade reliability requirements for automotive infotainment, rugged handhelds, and factory automation equipment where ambient thermal conditions exceed commercial limits.
W948D2FBJX5E TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 90-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 8M x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 90-VFBGA (8x13)
W948D2FBJX5E TR FAQ
1.How can I place an order for W948D2FBJX5E TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W948D2FBJX5E TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W948D2FBJX5E TR reliable?
The price and inventory of W948D2FBJX5E TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D2FBJX5E TR is usually 5 days.
3.What payment methods are accepted for W948D2FBJX5E TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948D2FBJX5E TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W948D2FBJX5E TR?
W948D2FBJX5E TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W948D2FBJX5E TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W948D2FBJX5E TR?
For technical support, including W948D2FBJX5E TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D2FBJX5E TR requirements.
6.How does Aetrix verify that W948D2FBJX5E TR is sourced from the original manufacturer or authorized distributors?
All W948D2FBJX5E TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D2FBJX5E TR meets industry standards.
7.What is the process for return or replacement of W948D2FBJX5E TR?
All W948D2FBJX5E TR units undergo pre-shipment inspection (PSI). If there is an issue with W948D2FBJX5E TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W948D2FBJX5E TR part is unused and in its original packaging.
Return procedure for W948D2FBJX5E TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W948D2FBJX5E TR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

