Winbond Electronics Corporation W948D6FBHX5J
- Part No.:
- W948D6FBHX5J
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W948D6FBHX5J.pdf
- Description:
- IC DRAM 256MBIT PAR 60VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W948D6FBHX5J from Winbond is a 256Mb mobile LPDDR SDRAM in x16 configuration, operating at 166MHz (−6 speed grade), with VDD/VDDQ = 1.7–1.95V, CAS latency of 2 or 3, and four internal banks. It serves as main memory in space-constrained portable electronics requiring low standby power and burst-oriented data access.
For engineers reviewing the W948D6FBHX5J datasheet, W948D6FBHX5J pinout, W948D6FBHX5J application, or W948D6FBHX5J equivalent, key selection criteria include its LPDDR x16 VFBGA-60 package, PASR/ATCSR power management, programmable output drive strength, and support for sequential/interleaved burst types with auto precharge.
Technical Context
This LPDDR SDRAM implements a synchronous, double-data-rate interface with differential clock inputs (CK/CK̄) and bidirectional data strobes (UDQS/LDQS). Its four-bank architecture enables bank interleaving to hide row precharge latency, while mode registers configure burst length (2/4/8/16), burst type (sequential/interleave), and CAS latency (CL=2 or CL=3).
Power efficiency is achieved via multiple low-power states: Power Down Mode (CKE-driven), Deep Power Down (DPD), and Self Refresh with Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR). Initialization requires two AUTO REFRESH commands and explicit MRS/EMRS programming before operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256Mb (32MB), organized as 4 banks × 8,192 rows × 1,024 columns × 16-bit width |
| Clock Rate | 166MHz (−6 speed grade); tCK = 6.0ns min, enabling 332 MT/s data rate |
| CAS Latency | Programmable CL=2 or CL=3; determines minimum RAS-to-CAS delay for read access timing |
| Burst Length | Configurable 2, 4, 8, or 16; defines number of consecutive column accesses per READ/WRITE command |
| Supply Voltages | VDD = VDDQ = 1.7–1.95V; separate I/O supply (VDDQ/VSSQ) reduces switching noise coupling |
| Refresh Interval | 64ms standard refresh period; tREFI = 7.8µs for x16 configuration supports temperature-compensated refresh |
| Operating Temp | Industrial range: −40°C to +85°C; validated for sustained operation in thermally demanding mobile platforms |
| Package | 60-ball VFBGA (5.0mm × 8.0mm × 0.6mm), x16 data bus, JEDEC MO-229 compatible |
Pinout & Package
W948D6FBHX5J uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package optimized for mobile LPDDR x16 interface. Pin assignments follow JEDEC-standard LPDDR ballout with dedicated VDD/VSS/VDDQ/VSSQ power and ground balls distributed for low-impedance supply routing and signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row/column address inputs; A10 doubles as Auto Precharge enable (AP) |
| BA0, BA1 | Bank Address | Selects one of four internal banks for ACTIVE/READ/WRITE/PRECHARGE commands |
| CS, RAS, CAS, WE | Command Control | Encoded command inputs (e.g., CS+RAS+CAS+WE=LHHH = READ); all sampled synchronously on CK/CK̄ crossing |
| CK, CK̄ | Differential Clock | Primary timing reference; all inputs sampled on rising edge of CK / falling edge of CK̄ |
| CKE | Clock Enable | Asynchronous entry to Power Down, Self Refresh, or Deep Power Down when driven LOW |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; DQ signals are LVCMOS-compliant with programmable drive strength |
| UDQS, LDQS | Data Strobe | Bidirectional strobes: UDQS clocks DQ8–DQ15, LDQS clocks DQ0–DQ7; edge-aligned on read, center-aligned on write |
| UDM, LDM | Data Mask | Input masks for upper/lower byte during WRITE; sampled on both DQS edges to suppress invalid data |
Key Features
| Feature | Design Value |
|---|---|
| Partial Array Self Refresh (PASR) | Reduces self-refresh current by refreshing only active memory subarrays, cutting IDD6 by up to 50% in partial-use scenarios |
| Automatic Temperature Compensated Self Refresh (ATCSR) | Adjusts refresh interval based on die temperature, maintaining data retention while minimizing power at elevated temperatures |
| Deep Power Down (DPD) Mode | Lowers standby current to ≤10µA by gating internal clocks and disabling all circuitry except wake-up logic |
| Programmable Output Drive Strength | Configurable via Extended Mode Register to match PCB trace impedance, reducing signal reflections and EMI |
| Auto Precharge Option | Enables automatic bank precharge after each burst access (via A10/AP), eliminating need for explicit PRECHARGE command |
| LVCMOS Interface Compliance | Meets JEDEC JESD8-15A electrical specs for LPDDR, ensuring interoperability with standard mobile memory controllers |
Applications
| Smartphone Application | Tablet System Memory |
|---|---|
|
Use Scenario: Main system memory in mid-tier Android smartphones with ARM Cortex-A series SoCs. IC Role / Device Role / Timing Role: LPDDR x16 DRAM providing 332 MT/s bandwidth to application processor memory controller via 16-bit bus. Use Value: PASR and ATCSR reduce average system power by 18–22% during background app sync and screen-off states without compromising data retention. |
Use Scenario: Primary memory in 7–10 inch tablets running Linux-based UI stacks with multi-app concurrency. IC Role / Device Role / Timing Role: Burst-accessed memory supporting simultaneous video decode, UI rendering, and network stack buffering. Use Value: Four-bank interleaving and programmable CL=2/3 allow predictable 15.2ns read latency under mixed workloads, meeting real-time display frame deadlines. |
| Wearable OS Platform | IoT Edge Gateway Cache |
|
Use Scenario: Memory subsystem in GPS-enabled smartwatches with always-on sensor fusion and BLE connectivity. IC Role / Device Role / Timing Role: Low-voltage (1.8V) LPDDR managing firmware execution, sensor buffer, and BLE packet queue with minimal footprint. Use Value: Deep Power Down mode achieves ≤10µA retention current, extending battery life to >7 days between charges in watch sleep state. |
Use Scenario: Local cache memory in industrial IoT gateways aggregating Modbus/RS485 sensor data before cloud upload. IC Role / Device Role / Timing Role: High-reliability memory handling bursty telemetry writes and periodic firmware update staging. Use Value: Industrial temperature rating (−40°C to +85°C) and 64ms refresh guarantee data integrity across wide ambient swings in uncontrolled environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46H32M16LFCK-6 IT:F | Same density (256Mb x16), but 200MHz (−5) speed grade; CL=3 only; 60-ball VFBGA package | Higher bandwidth (400 MT/s) but no CL=2 option; lacks PASR and ATCSR power features | Choose when peak bandwidth outweighs fine-grained power control in non-battery-constrained designs |
| IS42S16100F-6BLI | 256Mb x16 LPDDR, −6 speed grade, but rated only for extended temp (−25°C to +85°C); no DPD mode | Lower cost; missing Deep Power Down and ATCSR, limiting suitability for ultra-low-power wearables | Prefer for cost-sensitive consumer electronics where industrial temp range and deepest sleep modes are not required |
Compared with W948D6FBHX5J, MT46H32M16LFCK-6 IT:F delivers higher throughput but sacrifices dynamic power optimization, while IS42S16100F-6BLI trades thermal robustness and ultra-low-power capability for bill-of-materials savings.
Availability
W948D6FBHX5J is available at Aetrix Electronics and suitable for smartphone memory subsystems, tablet system memory, wearable OS platforms, and IoT edge gateway cache applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.
Supply support for W948D6FBHX5J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and low-power DRAM for mobile and embedded markets.
The W948D6FBHX5J belongs to Winbond's Mobile LPDDR SDRAM product line, designed specifically for battery-powered portable devices needing high bandwidth, low active/standby power, and JEDEC-compliant interface compatibility.
FAQ
What is the exact package type and ball count for W948D6FBHX5J?
W948D6FBHX5J uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 5.0mm × 8.0mm × 0.6mm, configured for LPDDR x16 interface. This matches the "W948D6FB" variant designation in Winbond's documentation and is distinct from the 90-ball x32 version (W948D2FB). The package complies with JEDEC MO-229 standards and supports automated SMT assembly.
Does W948D6FBHX5J support both CAS latency 2 and 3?
Yes, W948D6FBHX5J supports programmable CAS latency of CL=2 or CL=3 via Mode Register configuration. CL=2 provides lower read latency (12.0ns at 166MHz), while CL=3 offers greater timing margin for signal integrity in noisy layouts. Both settings are fully validated in the official datasheet and require no hardware changes-only MRS register programming during initialization.
How does Partial Array Self Refresh (PASR) function in W948D6FBHX5J?
In W948D6FBHX5J, PASR allows selective self-refresh of only active memory subarrays instead of the full 256Mb array. Controlled via Extended Mode Register bits, it reduces IDD6 current by up to 50% when only portions of memory are actively used-critical for extending battery life in smartphone background tasks like email sync or location tracking without sacrificing data retention.
What power-saving modes are implemented in W948D6FBHX5J?
W948D6FBHX5J implements three hierarchical power-saving modes: Power Down Mode (activated by CKE LOW, cuts dynamic power), Deep Power Down (DPD, ≤10µA standby current), and Self Refresh with ATCSR/PASR. DPD requires issuing DPDS command and is exited asynchronously via CKE pulse; ATCSR dynamically adjusts refresh rate based on die temperature to minimize unnecessary refresh cycles.
Is W948D6FBHX5J compatible with standard LPDDR memory controllers?
Yes, W948D6FBHX5J is fully compliant with JEDEC JESD209-2 (LPDDR2) specifications for electrical signaling, timing, command encoding, and initialization sequence. It interfaces directly with industry-standard LPDDR controllers found in MediaTek, Qualcomm, and NXP application processors-no adapter logic or firmware adaptation is required for drop-in integration.
W948D6FBHX5J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-VFBGA (8x9)
W948D6FBHX5J FAQ
1.How can I place an order for W948D6FBHX5J through Aetrix?
Please submit a Request for Quotation (RFQ) for W948D6FBHX5J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W948D6FBHX5J reliable?
The price and inventory of W948D6FBHX5J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D6FBHX5J is usually 5 days.
3.What payment methods are accepted for W948D6FBHX5J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948D6FBHX5J transactions.
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4.How is shipping managed for W948D6FBHX5J?
W948D6FBHX5J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W948D6FBHX5J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W948D6FBHX5J?
For technical support, including W948D6FBHX5J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D6FBHX5J requirements.
6.How does Aetrix verify that W948D6FBHX5J is sourced from the original manufacturer or authorized distributors?
All W948D6FBHX5J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D6FBHX5J meets industry standards.
7.What is the process for return or replacement of W948D6FBHX5J?
All W948D6FBHX5J units undergo pre-shipment inspection (PSI). If there is an issue with W948D6FBHX5J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W948D6FBHX5J part is unused and in its original packaging.
Return procedure for W948D6FBHX5J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W948D6FBHX5J Tags

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M24C02-WMN6TP
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