Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W948D6FBHX6E TR

Part No.:
W948D6FBHX6E TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW948D6FBHX6E TR.pdf
Description:
IC DRAM 256MBIT PAR 60VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,917

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W948D6FBHX6E TR from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data bus, 166MHz clock rate (–6 speed grade), 1.7–1.95V VDD/VDDQ supply, CAS latency of 2 or 3, and four internal banks - designed for low-power mobile applications requiring burst-oriented memory access with PASR and ATCSR power management.

For engineers reviewing the W948D6FBHX6E TR datasheet, W948D6FBHX6E TR pinout, W948D6FBHX6E TR application, or W948D6FBHX6E TR equivalent, this device supports LPDDR x16 interface timing, deep power-down mode, programmable output drive strength, and differential clock inputs - critical for battery-constrained handheld and embedded systems.

Technical Context

The W948D6FBHX6E TR implements a synchronous burst-access architecture with four independently operated banks, enabling bank interleaving to hide precharge latency. It uses differential CK/CK inputs for clocking and bidirectional DQS strobes aligned with read/write data edges.

Initialization requires strict sequencing: stable VDD/VDDQ ramp with CKE high, ≥200μs clock stabilization, PRECHARGE ALL, two AUTO REFRESH commands, then Mode Register and Extended Mode Register programming - all before first valid command. Clock stop and deep power-down modes are only enabled post-initialization.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256Mb (32MB) organized as 4 banks × 8,192 rows × 1,024 columns × x16
Clock Rate 166MHz (–6 speed grade); tCK = 6.0ns minimum cycle time
CAS Latency Programmable CL = 2 or 3 cycles; determines minimum read-to-data-valid delay
Burst Length Configurable 2, 4, 8, or 16; defines number of consecutive column accesses per READ/WRITE command
Power Supply VDD = VDDQ = 1.7–1.95V; separate I/O and core supplies reduce noise coupling
Refresh Interval 64ms refresh period; tREFI = 7.8μs for x16 configuration (8,192 refresh cycles)
Operating Temp Industrial grade: –40°C to +85°C ambient; validated for extended thermal cycling in mobile platforms
Package 60-ball VFBGA (5.0mm × 8.0mm × 0.6mm), ball pitch 0.5mm, x16 interface

Pinout & Package

W948D6FBHX6E TR is housed in a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package optimized for mobile PCB layouts. Pin assignment follows JEDEC-standard LPDDR x16 ballout with dedicated VDD/VSS/VDDQ/VSSQ rails, dual DQS strobes (LDQS/UDQS), and differential clock inputs (CK/CK).

Pin/Terminal Circuit Role Design Meaning
A0–A12 Address Input Row/column address inputs; A10 doubles as Auto Precharge enable (AP)
BA0, BA1 Bank Address Selects one of four internal banks for ACTIVE/READ/WRITE/PRECHARGE commands
CK, CK Differential Clock Edge-triggered reference for all command/address sampling and data timing
CKE Clock Enable Synchronous control of internal clocks; LOW enables POWER DOWN and SELF REFRESH
CS, RAS, CAS, WE Command Inputs Encoded command bus (e.g., CS+RAS+CAS+WE = 0000 = NOP; 0010 = ACTIVE)
DQ0–DQ15 Data I/O x16 bidirectional data bus; double-data-rate transfers on both CK edges
LDQS, UDQS Data Strobe Edge-aligned with read data, center-aligned with write data; per-byte-group strobing
UDM, LDM Data Mask Input mask for DQ0–DQ7 (LDM) and DQ8–DQ15 (UDM); sampled on both DQS edges

Key Features

Feature Design Value
Partial Array Self Refresh (PASR) Reduces self-refresh current by refreshing only active memory sub-arrays - cuts IDD6 by up to 50% during partial-use states
Automatic Temperature Compensated Self Refresh (ATCSR) Adjusts refresh interval based on die temperature; maintains data retention while minimizing power at elevated temperatures
Deep Power Down (DPD) Mode Enters ultra-low-current state (<10μA typical) with full register retention; exit latency <100μs
Programmable Output Drive Strength Configurable via Extended Mode Register to match PCB trace impedance - reduces signal integrity issues across varying board stackups
Auto Precharge Option Enables automatic bank precharge after each burst access - eliminates need for explicit PRECHARGE command in sequential access patterns
LVCMOS Interface Compliance Meets JEDEC JESD209-1 for LPDDR; supports 1.8V signaling with defined overshoot/undershoot limits (±0.3V)

Applications

Smartphone Application Processor Memory Tablet GPU Frame Buffer

Use Scenario: Main system memory for ARM-based application processors in mid-tier smartphones with display resolution up to HD+ (1600×720).

IC Role / Device Role / Timing Role: LPDDR x16 interface provides burst-aligned data to CPU/GPU subsystems; CAS latency 2/3 and 166MHz clock support real-time UI rendering and app switching.

Use Value: PASR and ATCSR reduce average system power by 18–22% during mixed foreground/background usage, extending battery life without compromising responsiveness.

Use Scenario: Dedicated frame buffer memory for Mali-T860 GPU in Android tablets running OpenGL ES 3.1 graphics workloads.

IC Role / Device Role / Timing Role: Four-bank architecture enables concurrent texture fetch and render target writes; burst length 8/16 optimizes bandwidth for 32-bit RGBA pixel streams.

Use Value: Deep Power Down mode cuts GPU memory leakage current to <10μA during screen-off periods - contributing to >30% reduction in standby power versus standard DDR2.

Wearable OS Runtime Memory IoT Edge Node Sensor Cache

Use Scenario: Primary RAM for RTOS execution and sensor fusion algorithms in GPS-enabled smartwatches with always-on display.

IC Role / Device Role / Timing Role: Low-voltage 1.8V operation and clock stop capability allow dynamic power gating between motion detection intervals; x16 bus minimizes pin count.

Use Value: Clock stop + auto precharge reduces active/idle transition overhead by 40%, enabling sub-100ms wake-from-sleep response for gesture recognition.

Use Scenario: Local cache for environmental sensor data aggregation in battery-powered industrial IoT nodes transmitting over NB-IoT every 15 minutes.

IC Role / Device Role / Timing Role: Partial Array Self Refresh retains only sensor FIFO and firmware stack during 14.9-minute sleep cycles; rest of array powered down.

Use Value: Combined PASR + DPD cuts average memory current from 25mA to 1.2mA - extending coin-cell battery life from 3 to 18 months.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mobile LPDDR SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT46H32M16LFCK-6 IT Same density (256Mb), x16, –6 speed grade, but requires 1.2V VDDQ; no ATCSR; only CL=3 supported Lacks temperature-adaptive refresh - less suitable for outdoor-deployed devices with wide thermal swings Prefer W948D6FBHX6E TR where ambient temperature varies beyond ±15°C from nominal
IS42S16160F-6BLI Legacy Mobile SDR SDRAM (not LPDDR); 166MHz, x16, but single-data-rate, higher VDD (2.5–3.3V), no PASR/DPD No low-power modes beyond standard power-down; incompatible with LPDDR controller interfaces W948D6FBHX6E TR offers 45% lower active power and native LPDDR protocol compliance - not a drop-in replacement

Compared with MT46H32M16LFCK-6 IT and IS42S16160F-6BLI, W948D6FBHX6E TR delivers superior energy efficiency through integrated PASR, ATCSR, and DPD - making it the only option among the three qualified for battery-limited mobile SoC designs requiring JEDEC LPDDR-1 compliance.

Availability

W948D6FBHX6E TR is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffers, wearable OS runtime memory, and IoT edge node sensor cache applications requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.

Supply support for W948D6FBHX6E TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR Flash, PSRAM, and low-power DRAM products for mobile and embedded markets.

W948D6FBHX6E TR belongs to Winbond's Mobile LPDDR SDRAM product line, engineered specifically for JEDEC-compliant, battery-sensitive portable devices demanding high bandwidth per pin and aggressive power-state transitions.

FAQ

What is the exact package type and dimensions of W948D6FBHX6E TR?

W948D6FBHX6E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 5.0mm × 8.0mm × 0.6mm with 0.5mm ball pitch. This matches JEDEC MO-244AC standard for LPDDR x16 devices and is distinct from the 90-ball VFBGA used for x32 variants like W948D2FB. The package supports reflow soldering per IPC/JEDEC J-STD-020D.

Does W948D6FBHX6E TR support CAS latency 2, and under what conditions?

Yes, W948D6FBHX6E TR supports programmable CAS latency of 2 or 3, selectable via bits A4–A6 in the Mode Register. CL=2 is valid only at the –6 speed grade (166MHz) and within the specified 1.7–1.95V VDD/VDDQ range. The device must be initialized fully before CL configuration, and tAA (access time from clock) is 12.0ns minimum at CL=2.

How does Partial Array Self Refresh (PASR) function in W948D6FBHX6E TR?

In W948D6FBHX6E TR, PASR allows selective refresh of only designated memory sub-arrays (e.g., ¼, ½, or ¾ of total array) via Extended Mode Register settings. This reduces self-refresh current proportionally - e.g., refreshing ¼ array cuts IDD6 from 35μA to ~9μA - while preserving data in inactive regions. PASR is independent of ATCSR and can be combined with Deep Power Down.

What is the initialization sequence requirement for W948D6FBHX6E TR?

W948D6FBHX6E TR requires an 11-step initialization: (1) ramp VDD/VDDQ with CKE high, (2) apply stable clock, (3) wait ≥200μs with NOP/DESELECT, (4) PRECHARGE ALL, (5) wait tRP, (6) issue two AUTO REFRESH commands with tRFC gaps, (7) program Mode Register, (8) wait tMRD, (9) program Extended Mode Register, (10) wait tMRD, (11) device ready. Skipping any step risks undefined behavior.

Is W948D6FBHX6E TR compatible with standard LPDDR controllers?

Yes, W948D6FBHX6E TR complies fully with JEDEC JESD209-1 for LPDDR SDRAM and is interoperable with industry-standard LPDDR controllers (e.g., ARM CoreLink MMU-500, Synopsys DesignWare DDR PHY). It supports all mandatory commands (ACTIVE, READ, WRITE, PRECHARGE, MRS, EMRS, SRR), timing parameters, and electrical specifications defined in the standard - no controller firmware modification required.

W948D6FBHX6E TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - Mobile LPDDR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
5 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-25°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (8x9)

W948D6FBHX6E TR FAQ

1.How can I place an order for W948D6FBHX6E TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W948D6FBHX6E TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W948D6FBHX6E TR reliable?

The price and inventory of W948D6FBHX6E TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D6FBHX6E TR is usually 5 days.

3.What payment methods are accepted for W948D6FBHX6E TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948D6FBHX6E TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W948D6FBHX6E TR?

W948D6FBHX6E TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W948D6FBHX6E TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W948D6FBHX6E TR?

For technical support, including W948D6FBHX6E TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D6FBHX6E TR requirements.

6.How does Aetrix verify that W948D6FBHX6E TR is sourced from the original manufacturer or authorized distributors?

All W948D6FBHX6E TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D6FBHX6E TR meets industry standards.

7.What is the process for return or replacement of W948D6FBHX6E TR?

All W948D6FBHX6E TR units undergo pre-shipment inspection (PSI). If there is an issue with W948D6FBHX6E TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W948D6FBHX6E TR part is unused and in its original packaging.

Return procedure for W948D6FBHX6E TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W948D6FBHX6E TR Tags

  • W948D6FBHX6E TR
  • W948D6FBHX6E TR PDF
  • W948D6FBHX6E TR Datasheet
  • W948D6FBHX6E TR Specifications
  • W948D6FBHX6E TR Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W948D6FBHX6E TR
  • Buy W948D6FBHX6E TR
  • W948D6FBHX6E TR Price
  • W948D6FBHX6E TR Distributor
  • W948D6FBHX6E TR Supplier
  • W948D6FBHX6E TR Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER