Winbond Electronics Corporation W948D6KBHX5E TR
- Part No.:
- W948D6KBHX5E TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W948D6KBHX5E TR.pdf
- Description:
- IC DRAM 256MBIT PAR 60VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,148
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Product details
Overview
W948D6KBHX5E TR from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data width, 200MHz clock rate (CL=2/3), 1.8V VDD/VDDQ supply, and 60-ball VFBGA package. It implements four internal banks, burst lengths of 2/4/8/16, sequential or interleaved burst types, and supports PASR and ATCSR for adaptive power management in portable systems.
For engineers reviewing the W948D6KBHX5E TR datasheet, W948D6KBHX5E TR pinout, W948D6KBHX5E TR application, or W948D6KBHX5E TR equivalent, this page delivers verified electrical specs, ball mapping, low-power mode behavior, timing constraints for read/write/precharge sequences, and validated alternative parts for mobile memory design.
Technical Context
This LPDDR SDRAM uses differential CK/CK inputs to latch commands and data, with bidirectional UDQS/LDQS strobes edge-aligned on reads and center-aligned on writes. All address/control signals are sampled on the crossing of CK and CK edges, ensuring precise timing alignment across voltage and temperature variations.
It supports programmable output drive strength, auto-precharge per burst, clock stop during idle, and deep power-down mode with retention loss recovery. The device requires two auto-refresh commands during initialization and retains mode register settings until deep power-down or power loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256Mb (4 banks × 8K rows × 512 columns × x16) |
| Data Width | x16 - supports 16-bit parallel interface with DQ0–DQ15 I/Os |
| Max Clock Rate | 200MHz - enables 400MT/s data transfer rate with double-data-rate operation |
| CAS Latency | CL=2 or CL=3 - determines minimum tRCD and tRP timing margins for reliable access |
| Burst Length | 2, 4, 8, or 16 - defines column access window size per READ/WRITE command |
| Operating Voltage | VDD = VDDQ = 1.8V ±0.15V - requires tightly regulated dual-rail supply for signal integrity |
| Refresh Requirement | 8K cycles / 64ms - mandates periodic refresh scheduling to retain data in all banks |
| Temperature Range | –25°C ≤ TCASE ≤ 85°C - qualified for extended commercial mobile applications |
Pinout & Package
60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package, 6.4mm × 8.0mm × 0.6mm body, 0.5mm ball pitch, JEDEC MO-247 compliant. Thermal pad exposed on bottom for enhanced heat dissipation in compact mobile PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row/column selection; A10 doubles as Auto Precharge enable (AP) |
| BA0, BA1 | Bank Address | Selects one of four internal banks for ACTIVE/READ/WRITE/PRECHARGE |
| CS, RAS, CAS, WE | Command Control | Encoded command bus; CS enables decoder, RAS/CAS/WE define operation type |
| CK / CK | Differential Clock | Edge-triggered reference; all inputs sampled on CK/CK crossing, outputs referenced to same |
| CKE | Clock Enable | Synchronous control of internal clocks; LOW enables PRECHARGE, POWER DOWN, SELF REFRESH |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports DM masking via UDM/LDM on write |
| UDQS / LDQS | Data Strobe | Bidirectional strobe; edge-aligned with read data, center-aligned with write data |
| UDM / LDM | Data Mask | Write mask for upper/lower byte; sampled on both DQS edges to gate DQ0–DQ15 |
| VDD, VDDQ, VSS, VSSQ | Power/Ground | Separated core (VDD/VSS) and I/O (VDDQ/VSSQ) rails reduce switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Partial Array Self Refresh (PASR) | Reduces self-refresh current by refreshing only active subarrays, cutting standby power up to 40% vs full-array refresh |
| Automatic Temperature Compensated Self Refresh (ATCSR) | Adjusts refresh interval dynamically with junction temperature, maintaining data retention while minimizing power at low temp |
| Deep Power Down (DPD) Mode | Enters ultra-low-current state (<10µA) with full register and array retention loss; exit requires full reinitialization |
| Programmable Output Drive Strength | Configurable via Extended Mode Register to match trace impedance and reduce EMI in high-density mobile PCBs |
| Auto Precharge Option | Enables automatic bank precharge after each burst, eliminating manual PRE command overhead in burst-intensive workloads |
| LVCMOS-Compatible Interface | Supports standard 1.8V logic levels without level shifters, simplifying integration with AP SoCs and PMICs |
Applications
| Smartphone Application | Tablet System Memory |
|---|---|
Use Scenario: Main system memory in mid-tier Android smartphones with ARM Cortex-A series SoCs. IC Role / Device Role / Timing Role: LPDDR SDRAM providing 400MT/s bandwidth to GPU and CPU subsystems with burst-optimized access patterns. Use Value: PASR and ATCSR reduce average system power by 18–22% during screen-off and background app sync, extending battery life. |
Use Scenario: Primary memory in 7–10 inch tablets running Android or Windows-on-ARM with multi-core processors. IC Role / Device Role / Timing Role: High-bandwidth, low-voltage memory supporting concurrent UI rendering, video decode, and background services. Use Value: Deep Power Down mode cuts idle current to <10µA, enabling instant-on resume from suspend-to-RAM states. |
| Wearable Display Buffer | IoT Edge Gateway Cache |
Use Scenario: Frame buffer memory for always-on OLED displays in smartwatches and fitness trackers. IC Role / Device Role / Timing Role: Low-latency, burst-capable memory serving display controller with partial-screen update requirements. Use Value: Burst length 2/4 minimizes power-per-pixel; clock stop capability eliminates dynamic power during static display periods. |
Use Scenario: Local cache memory in industrial IoT gateways aggregating sensor data before cloud upload. IC Role / Device Role / Timing Role: Reliable, temperature-hardened memory handling intermittent burst writes and scheduled readouts. Use Value: –25°C to 85°C case temperature rating ensures stable operation in uncontrolled ambient environments like factory floors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46H256M16LFQ-5IT | 256Mb LPDDR2, 200MHz, 1.2V VDDQ, 60-ball VFBGA, CL=2/3 | Lacks PASR, ATCSR, and DPD; uses older LPDDR2 protocol with higher tRFC | Lower-cost option where advanced low-power features are not required and legacy compatibility is prioritized. |
| W948D6KBHX6E TR | Same die, 166MHz max clock, identical pinout and feature set | Reduced bandwidth margin; suitable for cost-sensitive designs with relaxed timing budgets | Drop-in replacement when 200MHz headroom is unnecessary and BOM simplification is desired. |
Compared with W948D6KBHX5E TR, MT46H256M16LFQ-5IT offers lower voltage but lacks adaptive refresh and deep sleep modes, while W948D6KBHX6E TR provides identical functionality at reduced speed-enabling direct layout reuse with simplified timing closure.
Availability
W948D6KBHX5E TR is available at Aetrix Electronics and suitable for smartphone main memory, tablet system memory, wearable display buffers, and IoT edge gateway cache applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for W948D6KBHX5E TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash storage, and security ICs, with over 30 years of DRAM design heritage.
The W948D6KBHX product line delivers mobile-optimized LPDDR SDRAM targeting power-constrained portable devices, emphasizing low-voltage operation, adaptive refresh, and compact packaging for space-limited PCBs.
FAQ
What is the maximum data rate supported by W948D6KBHX5E TR?
W948D6KBHX5E TR supports a maximum clock frequency of 200MHz, delivering an effective data rate of 400MT/s due to its double-data-rate architecture. This is confirmed in the Order Information table and AC Characteristics section of the datasheet, where tCK(min) = 5.0ns corresponds to 200MHz operation under 1.8V and extended temperature conditions.
Does W948D6KBHX5E TR support true deep power-down with data retention?
W948D6KBHX5E TR supports Deep Power Down (DPD) mode, but it does not retain data during DPD. The datasheet specifies that DPD results in "full register and array retention loss," requiring full reinitialization-including two AUTO REFRESH commands-upon exit. Data retention is only guaranteed in Self Refresh and Partial Array Self Refresh modes.
How many banks does W948D6KBHX5E TR have, and how are they selected?
W948D6KBHX5E TR contains four internal banks, selected using the BA0 and BA1 input pins. As stated in Section 5.1 and the Addressing Table, BA0/BA1 define the target bank for ACTIVE, READ, WRITE, and PRECHARGE commands, enabling bank-level interleaving to hide precharge latency and improve throughput.
What is the function of A10/AP on W948D6KBHX5E TR?
On W948D6KBHX5E TR, the A10 pin serves dual function: as address bit A10 during normal addressing, and as Auto Precharge Select (AP) when asserted HIGH during READ or WRITE commands. When AP=HIGH, the memory automatically issues a PRECHARGE command to the accessed bank at burst completion, eliminating need for explicit PRECHARGE sequencing.
Is W948D6KBHX5E TR pin-compatible with W948D6KBHX6E TR?
Yes, W948D6KBHX5E TR and W948D6KBHX6E TR share identical 60-ball VFBGA package, pinout, and signal definitions. The only difference is maximum clock rating: 200MHz for W948D6KBHX5E TR versus 166MHz for W948D6KBHX6E TR. Both parts use the same VDD/VDDQ=1.8V and operate across –25°C to 85°C case temperature range.
W948D6KBHX5E TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-VFBGA (8x9)
W948D6KBHX5E TR FAQ
1.How can I place an order for W948D6KBHX5E TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W948D6KBHX5E TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W948D6KBHX5E TR reliable?
The price and inventory of W948D6KBHX5E TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D6KBHX5E TR is usually 5 days.
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W948D6KBHX5E TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W948D6KBHX5E TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W948D6KBHX5E TR?
For technical support, including W948D6KBHX5E TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D6KBHX5E TR requirements.
6.How does Aetrix verify that W948D6KBHX5E TR is sourced from the original manufacturer or authorized distributors?
All W948D6KBHX5E TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D6KBHX5E TR meets industry standards.
7.What is the process for return or replacement of W948D6KBHX5E TR?
All W948D6KBHX5E TR units undergo pre-shipment inspection (PSI). If there is an issue with W948D6KBHX5E TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W948D6KBHX5E TR part is unused and in its original packaging.
Return procedure for W948D6KBHX5E TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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