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Winbond Electronics Corporation W948D6KBHX5I

Part No.:
W948D6KBHX5I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW948D6KBHX5I.pdf
Description:
IC DRAM 256MBIT PAR 60VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,509

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Product details

Overview

W948D6KBHX5I from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data width, 200MHz clock rate, 1.8V VDD/VDDQ supply, and industrial temperature range (–40°C to +85°C). It implements four internal banks, burst lengths of 2/4/8/16, CAS latency 2 or 3, and low-power features including Deep Power Down, Partial Array Self Refresh (PASR), and Automatic Temperature Compensated Self Refresh (ATCSR) for battery-constrained mobile applications.

For engineers reviewing the W948D6KBHX5I datasheet, W948D6KBHX5I pinout, W948D6KBHX5I application, or W948D6KBHX5I equivalent, key selection criteria include its 60-ball VFBGA package, differential CK/CK clock interface, bidirectional DQS strobes, programmable output drive strength, and support for auto precharge, clock stop, and LVCMOS-compatible signaling in space- and power-sensitive embedded systems.

Technical Context

This LPDDR SDRAM uses a synchronous double-data-rate architecture with differential clock inputs (CK/CK) and edge-aligned DQS for read capture and center-aligned DQS for write capture. Its command decoder interprets CS, RAS, CAS, and WE in conjunction with BA0/BA1 bank select and A[12:0] address lines to execute ACTIVE, READ, WRITE, PRECHARGE, AUTO REFRESH, and SELF REFRESH operations.

The device integrates a 4-bank memory array with independent row/column decoders, a refresh counter, mode register (MRS) and extended mode register (EMRS) for configuration, and power management logic supporting Power Down, Deep Power Down, and PASR/ATCSR modes. Initialization requires two AUTO REFRESH commands, MRS and EMRS programming, and strict timing windows (tRP, tRFC, tMRD).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density256Mb (32MB) organized as 4 banks × 8K rows × 1K columns × x16
Clock Rate200MHz - supports 400MT/s data transfer rate with DDR interface
VDD / VDDQ1.8V ±0.15V - separate core and I/O supplies enable noise isolation
CAS LatencyCL = 2 or 3 - determines minimum read access latency in clock cycles
Burst Length2, 4, 8, or 16 - configurable via Mode Register for optimized bandwidth vs. latency trade-off
Operating Temp–40°C to +85°C case temperature - qualified for industrial-grade mobile and embedded use
Refresh Rate8K cycles per 64ms - standard JEDEC LPDDR requirement for data retention
Package60-ball Very Fine Pitch BGA (VFBGA), 6.4mm × 8.0mm × 0.6mm - compact footprint for portable PCBs

Pinout & Package

W948D6KBHX5I is housed in a 60-ball VFBGA package with 0.5mm ball pitch. Power and ground are distributed across multiple VDD, VDDQ, VSS, and VSSQ balls to minimize noise and ensure stable operation under dynamic load.

Pin/Terminal Circuit Role Design Meaning
A0–A12Address InputRow/column address for ACTIVE, READ/WRITE; A10 doubles as Auto Precharge enable
BA0, BA1Bank SelectSelects one of four internal banks for command targeting
CS, RAS, CAS, WECommand ControlEncoded command inputs (e.g., ACTIVE = CS/L, RAS/L, CAS/H, WE/H)
CK / CKDifferential ClockEdge-triggered reference for all command, address, and data timing
CKEClock EnableSynchronous control of internal clocks; LOW enables Power Down and Self Refresh
DQ0–DQ15Data I/Ox16 bidirectional data bus with DQS-synchronized transfers
UDQS / LDQSData StrobeUDQS clocks DQ8–DQ15; LDQS clocks DQ0–DQ7; edge-aligned on read, center-aligned on write
UDM / LDMData MaskLDM masks DQ0–DQ7; UDM masks DQ8–DQ15 during WRITE operations
VDD, VDDQ, VSS, VSSQPower/GroundSeparated core (VDD/VSS) and I/O (VDDQ/VSSQ) rails reduce switching noise coupling

Key Features

Feature Design Value
Deep Power Down (DPD)Reduces standby current to <1μA - extends battery life during prolonged idle periods
Partial Array Self Refresh (PASR)Refreshes only selected banks or sub-arrays - cuts self-refresh power by up to 50% vs. full-array refresh
Automatic Temperature Compensated Self Refresh (ATCSR)Adjusts refresh interval based on die temperature - maintains data integrity while minimizing power at low temp
Programmable Output Drive StrengthConfigurable via EMRS - optimizes signal integrity and EMI across varying PCB trace lengths and loads
Auto Precharge OptionEnables automatic bank precharge after each burst - simplifies controller logic and reduces command overhead
Clock Stop CapabilityStops CK/CK propagation during idle - eliminates dynamic power in clock distribution network

Applications

Smartphone Application Tablet System Memory

Use Scenario: Main system memory in mid-tier Android smartphones with ARM Cortex-A series SoCs.

IC Role / Device Role / Timing Role: LPDDR SDRAM serving as primary working memory interfaced directly to the application processor's memory controller.

Use Value: 200MHz clock rate and x16 bus deliver 3.2GB/s peak bandwidth; PASR and DPD cut active/idle power to extend talk time and standby duration.

Use Scenario: Shared memory resource in 7–10 inch tablets running Linux or Android with integrated GPU.

IC Role / Device Role / Timing Role: Dual-channel-capable LPDDR device supporting interleaved access across four banks to hide latency during graphics and UI rendering.

Use Value: Burst lengths up to 16 and CL=2/3 allow fine-grained tuning for frame buffer throughput; ATCSR ensures reliable operation across ambient temperature swings.

Industrial HMI Display Automotive Infotainment Module

Use Scenario: Local memory for ARM-based human-machine interface controllers in factory HMIs operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade LPDDR SDRAM providing deterministic response for real-time UI updates and local data buffering.

Use Value: Extended temperature qualification and robust clock stop/power down modes meet EN 61000-6-2/6-4 EMC requirements without thermal derating.

Use Scenario: Application memory in automotive infotainment head units with ASIL-B compatible SoC platforms.

IC Role / Device Role / Timing Role: Safety-aware memory subsystem where PASR and ATCSR reduce thermal load and improve long-term data retention reliability.

Use Value: 60-ball VFBGA package enables high-density layout; dual DQS strobes and LVCMOS compatibility simplify interface design with automotive-grade SerDes PHYs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT46H64M16LFCK-6 ITSame density (256Mb), x16, but LPDDR2-800 (400MHz) with CL=3 only; 60-ball VFBGA, –40°C to +85°CHigher bandwidth but lacks PASR, ATCSR, and Deep Power Down - less suitable for ultra-low-power mobile designsChoose when higher sustained bandwidth is prioritized over advanced power management features
IS42S16160F-6BLILPDDR1-667 (333MHz), x16, 60-ball VFBGA, –40°C to +85°C; no PASR, ATCSR, or DPD; supports only CL=2/3 and BL=2/4/8Legacy LPDDR1 interface - lower power than DDR2 but lacks modern low-power modes and burst flexibilityChoose only for backward compatibility in cost-sensitive legacy designs where ATCSR/PASR are not required

Compared with MT46H64M16LFCK-6 IT and IS42S16160F-6BLI, W948D6KBHX5I delivers superior power efficiency through PASR, ATCSR, and Deep Power Down - critical for battery-operated devices - while maintaining pin-compatible 60-ball VFBGA packaging and industrial temperature support.

Availability

W948D6KBHX5I is available at Aetrix Electronics and suitable for smartphone main memory, tablet system memory, industrial HMI displays, and automotive infotainment modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W948D6KBHX5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR Flash, RAM, and trusted computing ICs, with global manufacturing and quality certifications.

W948D6KBHX5I belongs to Winbond's LPDDR SDRAM product line, designed specifically for mobile and embedded applications demanding high bandwidth, low voltage operation, and advanced power management in compact form factors.

FAQ

What is the maximum data transfer rate supported by W948D6KBHX5I?

W948D6KBHX5I supports a 200MHz clock rate with double-data-rate operation, delivering a peak data transfer rate of 400MT/s (megatransfers per second) on its x16 bus. This equates to 3.2GB/s theoretical bandwidth. The actual sustained rate depends on burst length, CAS latency, and memory controller efficiency, but the device is fully compliant with JEDEC LPDDR standards for 200MHz operation.

Does W948D6KBHX5I support both sequential and interleaved burst types?

Yes, W948D6KBHX5I supports both sequential and interleaved burst types, selectable via bit A3 in the Mode Register. Sequential bursts increment column addresses linearly (e.g., 0→1→2→3), while interleaved bursts follow a scrambled order optimized for cache-line access patterns. This flexibility allows system designers to align memory behavior with processor cache architectures for improved performance.

How does Partial Array Self Refresh (PASR) function in W948D6KBHX5I?

In W948D6KBHX5I, PASR allows the memory controller to configure which banks or sub-arrays remain active during self-refresh via the Extended Mode Register. By refreshing only the portions of memory containing live data, PASR reduces self-refresh current consumption by up to 50% compared to full-array refresh - a critical advantage for battery-powered devices where standby power dominates total energy budget.

What is the purpose of the UDQS and LDQS signals in W948D6KBHX5I?

W948D6KBHX5I uses two differential data strobes: UDQS for the upper byte (DQ8–DQ15) and LDQS for the lower byte (DQ0–DQ7). During reads, both strobes are edge-aligned with their respective data; during writes, they are center-aligned to capture data accurately. This dual-strobe architecture improves timing margin and signal integrity across the x16 bus, especially in high-speed, noise-sensitive mobile PCB layouts.

Can W948D6KBHX5I operate with a single 1.8V supply, or are separate VDD and VDDQ rails required?

W948D6KBHX5I requires two independent 1.8V supplies: VDD for core logic and VDDQ for I/O buffers. Although both are rated at 1.8V ±0.15V, they must be physically separated on the PCB to prevent switching noise from the data bus from coupling into the core logic domain. This separation is mandatory per the datasheet and essential for stable operation at 200MHz with tight timing margins.

W948D6KBHX5I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - Mobile LPDDR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
5 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (8x9)

W948D6KBHX5I FAQ

1.How can I place an order for W948D6KBHX5I through Aetrix?

Please submit a Request for Quotation (RFQ) for W948D6KBHX5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W948D6KBHX5I reliable?

The price and inventory of W948D6KBHX5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D6KBHX5I is usually 5 days.

3.What payment methods are accepted for W948D6KBHX5I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948D6KBHX5I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W948D6KBHX5I?

W948D6KBHX5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W948D6KBHX5I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W948D6KBHX5I?

For technical support, including W948D6KBHX5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D6KBHX5I requirements.

6.How does Aetrix verify that W948D6KBHX5I is sourced from the original manufacturer or authorized distributors?

All W948D6KBHX5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D6KBHX5I meets industry standards.

7.What is the process for return or replacement of W948D6KBHX5I?

All W948D6KBHX5I units undergo pre-shipment inspection (PSI). If there is an issue with W948D6KBHX5I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W948D6KBHX5I part is unused and in its original packaging.

Return procedure for W948D6KBHX5I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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