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Winbond Electronics Corporation W948V6KBHX5E TR

Part No.:
W948V6KBHX5E TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW948V6KBHX5E TR.pdf
Description:
IC DRAM 256MBIT LVCMOS 60VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,958

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Product details

Overview

W948V6KBHX5E TR from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data bus, 200MHz clock rate (CL=3), 1.8V VDD/VDDQ supply, and 60-ball VFBGA package. It delivers burst-oriented memory access with programmable burst lengths (2/4/8/16), sequential or interleaved burst types, and supports partial array self-refresh (PASR) and automatic temperature-compensated self-refresh (ATCSR) for low-power mobile applications including smartphones and portable tablets.

For engineers reviewing the W948V6KBHX5E TR datasheet, W948V6KBHX5E TR pinout, W948V6KBHX5E TR application, or W948V6KBHX5E TR equivalent, key selection considerations include its LPDDR interface compliance, 4-bank architecture enabling bank interleaving, deep power-down (DPD) and DSR modes, differential CK/CK inputs, bidirectional DQS strobes, and LVCMOS-compatible signaling for integration into power-constrained SoC memory subsystems.

Technical Context

The W948V6KBHX5E TR implements a synchronous double-data-rate architecture with four independent internal banks, enabling concurrent row activation and column access to hide precharge latency. Its command decoder interprets CS, RAS, CAS, and WE in combination with BA0/BA1 to execute ACTIVE, READ, WRITE, PRECHARGE, AUTO REFRESH, and MODE REGISTER SET operations.

It features dual-mode register programming: base Mode Register (MRS) sets burst length, burst type, and CAS latency (CL=2 or 3), while Extended Mode Register (EMRS) configures PASR, ATCSR, output drive strength, and deep power-down quarter-array self-refresh (DSR). Initialization requires strict sequencing: power ramp with CKE high, 200μs stable clocks, PRECHARGE ALL, two AUTO REFRESH commands, then MRS and EMRS loading with tMRD delays.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256Mb (4 banks × 4K rows × 1K columns × x16)
Data Bus Width x16 - supports 16-bit parallel I/O transfers per clock edge
Max Clock Frequency 200MHz - enables 400 MT/s data rate with DDR operation
CAS Latency CL=2 or CL=3 - determines minimum read-to-output delay in clock cycles
Burst Length 2, 4, 8, or 16 - defines number of consecutive column accesses per READ/WRITE command
Supply Voltages VDD = 1.8V, VDDQ = 1.8V - separate core and I/O supplies reduce noise coupling
Operating Temperature -25°C to +85°C case temperature - qualified for extended commercial mobile use
Refresh Requirement 8K cycles / 64ms - standard JEDEC LPDDR refresh interval for data retention

Pinout & Package

W948V6KBHX5E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.5mm ball pitch and 8mm × 8.1mm body size. Power and ground balls are distributed across the array to minimize IR drop and improve signal integrity.

Pin/Terminal Circuit Role Design Meaning
A0–A12 Address Input Row/column address inputs; A10 doubles as Auto Precharge select
BA0, BA1 Bank Address Selects one of four internal banks for command targeting
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; supports masked writes via DQM
UDQS, LDQS Data Strobe Bidirectional strobes: edge-aligned on read, center-aligned on write; UDQS for DQ8–DQ15, LDQS for DQ0–DQ7
CK, CK Differential Clock Edge-sensitive inputs; all commands and data sampled at CK/CK crossing
CKE Clock Enable Synchronous control of internal clocks; LOW enables power-down and self-refresh entry
CS, RAS, CAS, WE Command Control Encoded command bus; CS enables command decoder, RAS/CAS/WE define operation type
UDM, LDM Data Mask Write data masking: UDM masks DQ8–DQ15, LDM masks DQ0–DQ7; sampled on both DQS edges
VDD, VSS Core Power/Ground Supplies logic and control circuitry; decoupling critical for timing stability
VDDQ, VSSQ I/O Power/Ground Separate supply for DQ/DQS drivers; isolates I/O noise from core logic

Key Features

Feature Design Value
Partial Array Self-Refresh (PASR) Reduces refresh current by limiting self-refresh to active memory subarrays, cutting standby power up to 50% vs full-array refresh
Automatic Temperature Compensated Self-Refresh (ATCSR) Adjusts refresh interval dynamically with junction temperature, maintaining data retention while minimizing unnecessary refresh cycles
Deep Power Down (DPD) Mode Shuts down all internal circuitry except retention logic, achieving <10μA typical ICCDPD for ultra-low idle power
Deep Power Down Quarter Partial Array Self-Refresh (DSR) Combines DPD entry with quarter-array PASR, enabling rapid wake-up from deepest low-power state without full reinitialization
Programmable Output Drive Strength Configurable via EMRS to match PCB trace impedance and reduce signal overshoot/undershoot in high-speed layouts
LVCMOS-Compatible Interface Supports standard 1.8V logic levels with defined VIH/VIL thresholds, simplifying integration with application processors and PMICs

Applications

Smartphone Application Processor Memory Portable Tablet Main Memory

Use Scenario: Primary working memory for ARM-based application processors in slim-profile smartphones with thermal constraints.

IC Role / Device Role / Timing Role: LPDDR SDRAM serving as system DRAM, interfacing directly with processor's memory controller using differential CK/CK and bidirectional DQS.

Use Value: 200MHz operation and 4-bank interleaving deliver sustained bandwidth >1.2GB/s while PASR and ATCSR cut average system power by 18–22% during UI idle and background app refresh.

Use Scenario: Main memory in 7–10 inch Android tablets requiring high-density, low-voltage storage with fast wake-from-sleep response.

IC Role / Device Role / Timing Role: Mobile SDRAM providing burst-accessed code/data storage; leverages DSR mode for sub-100μs exit from deep sleep without full initialization.

Use Value: DPD and DSR modes reduce tablet standby current to <15μA per memory device, extending battery life beyond 14 days in connected standby.

Wearable OS Runtime Memory IoT Edge Gateway Buffer

Use Scenario: Runtime memory for real-time OS execution in compact wearables (smartwatches, AR glasses) where board space and thermal envelope are severely limited.

IC Role / Device Role / Timing Role: Low-power LPDDR SDRAM supporting burst reads/writes with programmable CL=2 for minimal latency in sensor fusion pipelines.

Use Value: 60-ball VFBGA footprint (8mm × 8.1mm) fits tight PCB layouts; clock stop capability eliminates dynamic power during sensor polling intervals.

Use Scenario: Local buffering for protocol translation and data aggregation in industrial IoT gateways operating in ambient temperatures up to +85°C.

IC Role / Device Role / Timing Role: High-reliability mobile DRAM handling bursty MQTT/CoAP packet buffering with auto-precharge and robust command timing margins.

Use Value: Industrial-grade -40°C to +85°C qualification (via W948V6KBHX5I variant) ensures stable operation under wide thermal cycling; 8K/64ms refresh meets JEDEC reliability requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT46H256M16LFQ-5IT:C Same density (256Mb), x16, LPDDR2; 1.2V VDDQ; CL=3 at 266MHz; 60-ball VFBGA but different ball map Lacks PASR, ATCSR, DSR; supports only standard self-refresh and power-down Choose when legacy LPDDR2 compatibility is required and advanced low-power modes are not needed.
W948D6KBHX5E TR Same Winbond family, identical pinout and command set; LPDDR3 instead of LPDDR; 1.2V VDDQ; 400MHz max clock Higher bandwidth but higher voltage sensitivity and stricter layout rules; no DSR mode Choose for performance-critical designs needing >2GB/s bandwidth and willing to manage tighter signal integrity constraints.

Compared with MT46H256M16LFQ-5IT:C and W948D6KBHX5E TR, the W948V6KBHX5E TR uniquely balances 200MHz LPDDR throughput with industry-leading low-power features-PASR, ATCSR, and DSR-enabling optimal energy efficiency in thermally constrained mobile platforms without sacrificing JEDEC-compliant interoperability.

Availability

W948V6KBHX5E TR is available at Aetrix Electronics and suitable for smartphone main memory, portable tablet runtime storage, wearable OS execution, IoT gateway buffering, and embedded HMI applications requiring stable component supply across multi-year production cycles.

Supply support for W948V6KBHX5E TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, with global manufacturing and quality certifications.

The W948V6KBHX5E TR belongs to Winbond's LPDDR SDRAM product line, designed specifically for power- and space-constrained mobile computing devices requiring JEDEC-compliant low-voltage, high-bandwidth memory with advanced power management.

FAQ

What is the maximum data rate supported by the W948V6KBHX5E TR?

The W948V6KBHX5E TR supports a maximum clock frequency of 200MHz, delivering an effective data rate of 400 MT/s due to its double-data-rate architecture. This is confirmed in the Order Information table and Electrical Characteristics section of the datasheet, where the "-5" speed grade is explicitly rated for 200MHz operation with CL=3 timing. The W948V6KBHX5E TR achieves this rate using differential CK/CK inputs and edge-aligned DQS strobes to maintain signal integrity at high speeds.

Does the W948V6KBHX5E TR support partial array self-refresh (PASR)?

Yes, the W948V6KBHX5E TR fully supports Partial Array Self-Refresh (PASR), as documented in Section 2 FEATURES and Section 7.4.2 of the datasheet. PASR allows the device to refresh only selected subarrays (full, half, or quarter) rather than the entire memory array, reducing self-refresh current by up to 50%. Configuration is performed via the Extended Mode Register (EMRS), and the feature is validated for operation across the full -25°C to +85°C temperature range specified for the W948V6KBHX5E TR.

What package type and ball count does the W948V6KBHX5E TR use?

The W948V6KBHX5E TR uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.5mm ball pitch, as stated in Section 2 FEATURES and illustrated in Section 4 BALL ASSIGNMENT. The mechanical dimensions are 8.0mm × 8.1mm with a maximum height of 0.6mm. This package is optimized for mobile PCBs with tight spacing requirements and is shared across the W948V6KBHX family, including the W948V6KBHX5E TR, W948V6KBHX5I TR, and other speed/temperature variants.

How does the W948V6KBHX5E TR handle initialization after power-up?

The W948V6KBHX5E TR requires a strict 11-step initialization sequence detailed in Section 7.1. This includes powering VDD and VDDQ simultaneously with CKE held high, applying stable clocks for ≥200μs, issuing PRECHARGE ALL, two AUTO REFRESH commands separated by tRFC, then programming the Mode Register and Extended Mode Register with tMRD delays between steps. Skipping or reordering these steps-especially omitting the second AUTO REFRESH or mis-timing tMRD-will result in undefined operation of the W948V6KBHX5E TR.

Is the W948V6KBHX5E TR compatible with LPDDR2 or LPDDR3 controllers?

No, the W948V6KBHX5E TR is a native LPDDR (Low Power DDR) SDRAM, not LPDDR2 or LPDDR3. It complies with the original JEDEC LPDDR standard (JESD209), featuring 1.8V VDDQ, specific command encoding (e.g., EMRS for PASR), and timing parameters distinct from later generations. Controllers must be explicitly designed for LPDDR-not LPDDR2 or LPDDR3-to correctly interpret its mode registers, DQS timing, and low-power command sequences. Using it with an LPDDR2/3 controller will cause functional failure.

W948V6KBHX5E TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - Mobile LPDDR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
LVCMOS
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
5 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-25°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (8x9)

W948V6KBHX5E TR FAQ

1.How can I place an order for W948V6KBHX5E TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W948V6KBHX5E TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W948V6KBHX5E TR reliable?

The price and inventory of W948V6KBHX5E TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948V6KBHX5E TR is usually 5 days.

3.What payment methods are accepted for W948V6KBHX5E TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948V6KBHX5E TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W948V6KBHX5E TR?

W948V6KBHX5E TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W948V6KBHX5E TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W948V6KBHX5E TR?

For technical support, including W948V6KBHX5E TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948V6KBHX5E TR requirements.

6.How does Aetrix verify that W948V6KBHX5E TR is sourced from the original manufacturer or authorized distributors?

All W948V6KBHX5E TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948V6KBHX5E TR meets industry standards.

7.What is the process for return or replacement of W948V6KBHX5E TR?

All W948V6KBHX5E TR units undergo pre-shipment inspection (PSI). If there is an issue with W948V6KBHX5E TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W948V6KBHX5E TR part is unused and in its original packaging.

Return procedure for W948V6KBHX5E TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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