Winbond Electronics Corporation W948V6KBHX5I
- Part No.:
- W948V6KBHX5I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W948V6KBHX5I.pdf
- Description:
- IC DRAM 256MBIT LVCMOS 60VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W948V6KBHX5I from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data bus, 200MHz clock rate, 1.8V VDD/VDDQ supply, and industrial temperature range (−40°C to +85°C). It implements four internal banks, programmable burst lengths (2/4/8/16), CAS latency 2 or 3, and low-power modes including Deep Power Down and Partial Array Self Refresh - deployed in battery-constrained mobile SoC memory subsystems.
For engineers reviewing the W948V6KBHX5I datasheet, W948V6KBHX5I pinout, W948V6KBHX5I application, or W948V6KBHX5I equivalent, key selection criteria include its 60-ball VFBGA package, LVCMOS-compatible interface, differential CK/CK inputs, bidirectional DQS strobes, and support for ATCSR and PASR - critical for power-optimized mobile DRAM integration.
Technical Context
This LPDDR SDRAM uses a synchronous double-data-rate architecture with differential clock inputs (CK/CK) and edge-aligned DQS for read capture and center-aligned DQS for write capture. Its command decoder interprets CS, RAS, CAS, and WE in conjunction with BA0/BA1 bank select and A[12:0] address lines to execute ACTIVE, READ, WRITE, PRECHARGE, AUTO REFRESH, and low-power entry/exit sequences.
Internal operation relies on four independent banks enabling bank interleaving to hide precharge latency. Mode Register (MRS) and Extended Mode Register (EMRS) configure burst type (sequential/interleave), drive strength, PASR granularity, and Automatic Temperature Compensated Self Refresh - all required to be programmed during initialization before valid access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256Mb (4 banks × 4K rows × 2K columns × 16-bit width) |
| Data Bus Width | x16 - supports 16-bit parallel I/O transfers per clock edge |
| Max Clock Frequency | 200MHz - enables 400MT/s data rate with DDR interface |
| VDD / VDDQ Supply | 1.8V ±0.15V - single-supply operation simplifies PMIC design |
| CAS Latency | CL = 2 or 3 - determines minimum read-to-output delay in clock cycles |
| Burst Length | 2, 4, 8, or 16 - defines number of consecutive column accesses per READ/WRITE command |
| Operating Temperature | −40°C to +85°C case temperature - qualified for industrial mobile applications |
| Refresh Requirement | 8K cycles / 64ms - standard JEDEC LPDDR timing for retention guarantee |
Pinout & Package
W948V6KBHX5I is housed in a 60-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8.0mm × 10.5mm × 0.65mm (height), with 0.5mm ball pitch and Pb-free, RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Input Address | Row/column address inputs; A10 doubles as Auto Precharge enable |
| BA0, BA1 | Input Bank Select | Selects one of four internal banks for command targeting |
| CS, RAS, CAS, WE | Input Command Strobes | Decode ACTIVE, READ, WRITE, PRECHARGE, MRS via JEDEC LPDDR truth table |
| CK / CK | Differential Clock Inputs | Edge-triggered sampling of all control/address; reference for DQ/DQS timing |
| CKE | Clock Enable | Asynchronous entry to POWER DOWN, SELF REFRESH, and DPD modes |
| DQ0–DQ15 | I/O Data Bus | 16-bit bidirectional data path; supports DM masking per byte lane |
| UDQS / LDQS | Bidirectional Data Strobe | UDQS clocks DQ8–DQ15; LDQS clocks DQ0–DQ7; edge-aligned on read, center-aligned on write |
| UDM / LDM | Input Data Mask | LDM masks DQ0–DQ7; UDM masks DQ8–DQ15 during WRITE operations |
| VDD, VDDQ, VSS, VSSQ | Power/Ground | Separated core (VDD/VSS) and I/O (VDDQ/VSSQ) rails reduce switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Deep Power Down (DPD) Mode | Reduces standby current to ≤10μA - extends battery life during extended idle periods |
| Partial Array Self Refresh (PASR) | Refreshes only active memory subarrays - cuts self-refresh power by up to 50% vs full-array refresh |
| Automatic Temperature Compensated Self Refresh (ATCSR) | Adjusts refresh interval based on die temperature - maintains data retention while minimizing power |
| Programmable Output Drive Strength | Configurable via EMRS - optimizes signal integrity across varying PCB trace lengths and loads |
| Four Independent Banks | Enables bank interleaving - hides tRP/tRC delays and sustains >80% bus utilization under mixed workloads |
| LVCMOS-Compatible Interface | Supports direct connection to application processors without level-shifting - reduces BOM count |
Applications
| Smartphone Application Processor Memory | Tablet GPU Frame Buffer |
|---|---|
|
Use Scenario: Main system memory for ARM-based application processors in LTE smartphones requiring low-latency, high-bandwidth access with aggressive power gating. IC Role / Device Role / Timing Role: Primary LPDDR SDRAM interfacing directly to SoC memory controller via 16-bit bus and differential clock; handles boot code, OS, and app execution. Use Value: 200MHz clock + CL2/3 + burst-8 delivers ≥1.2GB/s sustained bandwidth; DPD and PASR cut idle power by >60% versus standard DDR2. |
Use Scenario: Dedicated frame buffer for Mali or Adreno GPUs in Android tablets, supporting 1080p UI rendering and video playback. IC Role / Device Role / Timing Role: Graphics memory co-located with GPU; operates in burst-16 sequential mode for pixel block transfers; leverages ATCSR for thermal-aware refresh. Use Value: Four-bank architecture enables concurrent texture fetch and render target writes; 1.8V operation reduces GPU subsystem voltage rail complexity. |
| Industrial Handheld Terminal RAM | Automotive Infotainment Display Cache |
|
Use Scenario: System memory in ruggedized barcode scanners and field service terminals operating continuously at −40°C ambient. IC Role / Device Role / Timing Role: Industrial-grade LPDDR SDRAM providing reliable boot and runtime memory; validated for extended temperature cycling and vibration. Use Value: −40°C to +85°C qualification ensures no refresh failure or timing violation; VFBGA package withstands mechanical shock per MIL-STD-883H. |
Use Scenario: Secondary display cache in automotive head units buffering HMI graphics assets and navigation map tiles. IC Role / Device Role / Timing Role: Low-power display memory supporting partial array refresh during instrument cluster sleep states; synchronized to infotainment SoC clock domain. Use Value: DSR mode (Deep power down quarter partial array Self Refresh) retains critical UI state while drawing <5μA - meets ISO 16750-2 quiescent current limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46H256M16LFQ-5IT | 256Mb LPDDR2, 200MHz, 1.2V VDDQ, 60-ball VFBGA, −40°C to +85°C | LPDDR2 interface (not LPDDR1); requires different controller timing and voltage sequencing | Choose if migrating to LPDDR2 ecosystem; not drop-in compatible due to protocol and voltage differences |
| W948D6KBHX5I | Same 256Mb density and 60-ball VFBGA, but LPDDR2 generation; 1.2V VDDQ, higher bandwidth (400MT/s), no PASR/ATCSR | Lacks PASR and ATCSR - less suitable for ultra-low-power battery hold scenarios | Prefer W948V6KBHX5I when legacy LPDDR1 controller compatibility, deeper low-power modes, or 1.8V supply simplicity are required |
Compared with MT46H256M16LFQ-5IT and W948D6KBHX5I, W948V6KBHX5I provides unique LPDDR1 protocol compliance, 1.8V-only operation, and industry-leading low-power features (PASR, ATCSR, DSR) - making it optimal for cost-sensitive, thermally constrained, or legacy-controller-based mobile designs.
Availability
W948V6KBHX5I is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffers, industrial handheld terminal RAM, automotive infotainment display caches, and embedded SoC boot memory requiring stable component supply across long production lifecycles.
Supply support for W948V6KBHX5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for consumer, industrial, and automotive markets.
W948V6KBHX5I belongs to Winbond's LPDDR1 SDRAM product line, designed specifically for mobile and portable electronics where low-voltage operation, multi-bank concurrency, and advanced power management are essential.
FAQ
What is the maximum data rate supported by W948V6KBHX5I?
W948V6KBHX5I supports a maximum clock frequency of 200MHz, delivering an effective data rate of 400MT/s using double-data-rate architecture. This is confirmed in the Features section and Electrical Characteristics tables of the official datasheet (Rev. A01-002, Jun. 2018), where tCK(min) = 5.0ns corresponds to 200MHz operation.
Does W948V6KBHX5I support both sequential and interleaved burst types?
Yes, W948V6KBHX5I supports both sequential and interleaved burst types, selectable via bit A3 in the Mode Register. This is explicitly defined in Section 7.3.3 (Burst Type) and Table 7.3.2 (Burst Definition), which lists access ordering for burst lengths 2, 4, 8, and 16 under both configurations.
What low-power modes are implemented in W948V6KBHX5I?
W948V6KBHX5I implements five low-power modes: Power Down, Deep Power Down (DPD), Standard Self Refresh, Partial Array Self Refresh (PASR), and Deep power down quarter partial array Self Refresh (DSR). These are detailed in Sections 2 (Features) and 8.11–8.13 of the datasheet, with DSR enabling retention of one-quarter array while drawing <5μA.
Is W948V6KBHX5I pin-compatible with other Winbond LPDDR parts?
No, W948V6KBHX5I is not pin-compatible with later-generation Winbond LPDDR2 or LPDDR3 devices such as W948D6KBHX5I due to differences in voltage requirements (1.2V vs 1.8V), command encoding, and DQS timing behavior. Pin compatibility is limited to same-generation LPDDR1 variants like W948V6KBHX6I (166MHz version), sharing identical 60-ball VFBGA mapping.
What is the purpose of the A10/AP pin on W948V6KBHX5I?
The A10 pin on W948V6KBHX5I serves dual function: as address bit A10 during normal operation and as Auto Precharge Enable (AP) during READ/WRITE commands. When A10 is HIGH during a READ or WRITE, the device automatically issues a PRECHARGE command at burst end - reducing controller overhead and improving efficiency in page-mode access.
W948V6KBHX5I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- LVCMOS
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-VFBGA (8x9)
W948V6KBHX5I FAQ
1.How can I place an order for W948V6KBHX5I through Aetrix?
Please submit a Request for Quotation (RFQ) for W948V6KBHX5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W948V6KBHX5I reliable?
The price and inventory of W948V6KBHX5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948V6KBHX5I is usually 5 days.
3.What payment methods are accepted for W948V6KBHX5I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948V6KBHX5I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W948V6KBHX5I?
W948V6KBHX5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W948V6KBHX5I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W948V6KBHX5I?
For technical support, including W948V6KBHX5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948V6KBHX5I requirements.
6.How does Aetrix verify that W948V6KBHX5I is sourced from the original manufacturer or authorized distributors?
All W948V6KBHX5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948V6KBHX5I meets industry standards.
7.What is the process for return or replacement of W948V6KBHX5I?
All W948V6KBHX5I units undergo pre-shipment inspection (PSI). If there is an issue with W948V6KBHX5I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W948V6KBHX5I part is unused and in its original packaging.
Return procedure for W948V6KBHX5I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W948V6KBHX5I Tags

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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology

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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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Microchip Technology

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Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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