Winbond Electronics Corporation W94AD2KBJX5E

Overview

W94AD2KBJX5E from Winbond is a 1Gb mobile LPDDR SDRAM with x32 data width, 200MHz clock rate (CL=2/3), and 90-ball VFBGA package. It operates at 1.8V VDD/VDDQ, supports four internal banks, and delivers burst lengths of 2/4/8/16 in sequential or interleave mode for high-bandwidth memory access in space-constrained portable devices.

For engineers reviewing the W94AD2KBJX5E datasheet, W94AD2KBJX5E pinout, W94AD2KBJX5E application, or W94AD2KBJX5E equivalent, key selection criteria include its -25°C to +85°C extended temperature range, PASR and ATCSR self-refresh modes, deep power-down capability, and LVCMOS-compatible interface for low-power mobile SoC integration.

Technical Context

This LPDDR SDRAM implements differential CK/CK clock inputs with edge-aligned DQS strobes for precise timing control, and uses BA0/BA1 bank address lines with A0–A9 column and A0–A12 row addressing to manage 4-bank interleaving. Its command decoder interprets CS/RAS/CAS/WE combinations to execute ACTIVE, READ, WRITE, PRECHARGE, AUTO REFRESH, and SELF REFRESH operations.

The device integrates programmable Mode and Extended Mode Registers to configure burst length, CAS latency, output drive strength, and low-power features including Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR). Power management includes Power Down, Deep Power Down (DPD), and Clock Stop modes-all synchronized via CKE.

Key Specifications

Pinout & Package

W94AD2KBJX5E uses a 90-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 10.5mm × 13.0mm × 0.6mm (JEDEC MO-245AC), optimized for mobile PCB stacking and thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR SDRAM applications.

Compared with MT46H128M32LF-6 IT:C and IS42S32160F-6BLI, W94AD2KBJX5E uniquely combines 200MHz operation, PASR, ATCSR, and extended -25°C to +85°C rating in a single 1Gb x32 LPDDR2 solution-making it optimal for next-generation portable devices balancing performance, power, and thermal envelope.

Availability

W94AD2KBJX5E is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffers, and automotive infotainment head units requiring stable component supply across production lifecycles.

Supply support for W94AD2KBJX5E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and low-power DRAM products for consumer, industrial, and automotive markets.

W94AD2KBJX5E belongs to Winbond's LPDDR2 SDRAM product line, designed specifically for mobile and portable electronics demanding high bandwidth, low voltage operation, and aggressive power management in compact form factors.

FAQ

What is the maximum data transfer rate supported by W94AD2KBJX5E?

W94AD2KBJX5E supports a maximum data transfer rate of 400MT/s (megatransfers per second) at its rated 200MHz clock frequency using double-data-rate architecture. This translates to a peak theoretical bandwidth of 6.4GB/s across its x32 interface. The actual sustained bandwidth depends on burst length, CAS latency, and command scheduling efficiency in the host controller.

Does W94AD2KBJX5E support both CL=2 and CL=3 timing modes?

Yes, W94AD2KBJX5E supports both CAS Latency 2 and CAS Latency 3, which are programmable via the Mode Register (bits A4–A6). CL=2 provides lower read latency for time-critical operations, while CL=3 allows marginally relaxed timing margins-both are fully compliant with JEDEC LPDDR2 specifications and validated across the -25°C to +85°C operating range.

How does Partial Array Self Refresh (PASR) function in W94AD2KBJX5E?

In W94AD2KBJX5E, PASR allows the memory controller to specify which sub-arrays remain active during self-refresh, reducing refresh current by skipping inactive portions of the 1Gb array. This feature is configured via the Extended Mode Register and can cut typical self-refresh ICC by up to 50%, significantly extending battery life in always-on mobile applications without compromising data retention.

What package type and dimensions does W94AD2KBJX5E use?

W94AD2KBJX5E uses a 90-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package conforming to JEDEC MO-245AC. Its dimensions are 10.5mm × 13.0mm × 0.6mm with 0.5mm ball pitch. This compact, low-profile package is optimized for high-density mobile PCB layouts and thermal performance in thin form-factor devices.

Can W94AD2KBJX5E operate with a 1.7V or 1.95V supply?

No-W94AD2KBJX5E is specified strictly for 1.8V ± 0.15V operation, meaning its valid VDD and VDDQ range is 1.65V to 1.95V. However, the part is characterized and guaranteed only at the nominal 1.8V supply; operation at 1.7V or 1.95V falls outside the validated specification and may result in timing violations, increased bit error rates, or failure to meet AC parameter limits per the datasheet.