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Winbond Electronics Corporation W955N8MBYA5I TR

Part No.:
W955N8MBYA5I TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW955N8MBYA5I TR.pdf
Description:
IC DRAM 32MBIT HYPERBUS 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,933

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Product details

Overview

W955N8MBYA5I TR from Winbond Electronics is a 32Mb HyperRAM device implementing the HyperBus DDR interface for high-throughput, low-pin-count external memory expansion in resource-constrained embedded systems. It operates at 2.7–3.6V, supports up to 200MHz clock frequency (400 MT/s), and uses an 8-bit DQ bus with bidirectional RWDS strobe/mask for read/write synchronization - deployed in graphics buffer and firmware code execution applications.

For engineers reviewing the W955N8MBYA5I TR datasheet, W955N8MBYA5I TR pinout, W955N8MBYA5I TR application, or W955N8MBYA5I TR equivalent, key selection criteria include HyperBus timing compliance, configurable burst modes (wrapped/linear/hybrid), drive strength tuning, partial array refresh support, and compatibility with hybrid sleep and deep power-down states in battery-sensitive designs.

Technical Context

The W955N8MBYA5I TR implements a DDR-based HyperBus interface with dual-clock support (single-ended CK or differential CK/CK#), enabling deterministic latency control via RWDS-driven initial access timing. Its architecture separates VCC (core/buffer supply) and VCCQ (I/O output supply), supporting independent voltage scaling and noise isolation.

It features two programmable configuration registers governing burst behavior (wrapped/linear/hybrid), latency modes (fixed/initial), drive strength, deep power-down entry, and array refresh (full/partial). Memory space addressing uses 32-bit system word addresses split across CA0–CA2, with row/column boundaries determined by density-specific mapping.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density32Mb (4MB) - provides sufficient capacity for boot code, frame buffers, or real-time data logging without requiring multi-chip stacking.
Interface StandardHyperBus DDR - reduces signal count vs. parallel NOR/NAND while delivering 400 MB/s sustained throughput using only 8 DQ lines + RWDS + CK/CK# + CS#.
Max Clock Frequency200MHz - enables full-speed operation with standard microcontroller or FPGA HyperBus masters meeting tACC ≤ 7.5ns timing.
Supply Voltage Range2.7V–3.6V - compatible with common 3.0V/3.3V system rails; VCC and VCCQ are independently supplied for I/O noise margin optimization.
Operating Temperature−40°C to +85°C - qualified for industrial-grade deployment in automotive infotainment, HMI, and edge IoT gateways.
Burst ConfigurationsWrapped (16/32/64/128 bytes), Linear, Hybrid - allows cache-line-aligned fetches (wrapped) or streaming transfers (linear) within single transactions.
Power ManagementHybrid Sleep & Deep Power Down - reduces standby current to <10µA (DPD), enabling >10-year battery life in always-on sensor nodes.

Pinout & Package

Package: 24-ball TFBGA (5×5 mm, 1-ball footprint, ball-down mounting).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low slave enable; transaction starts on High→Low edge and ends on Low→High; enables multi-device bus sharing.
CK / CK#Differential Clock InputSupports both differential (CK/CK#) and single-ended (CK only) clocking; determines sampling edge for command/address/data capture.
DQ[7:0]Bidirectional Data BusTransfers commands, addresses, and data in DDR mode; LV-CMOS compatible; shared across all HyperBus phases.
RWDSBidirectional Strobe/MaskIndicates initial latency during CA phase; serves as read data strobe (edge-aligned) and write data mask (high=masked) during transfers.
RESET#Hardware Reset InputAsynchronous initialization; places DQ/RWDS in Hi-Z and returns device to Standby state; internal weak pull-up ensures safe default.
VCC / VSSCore Power/GroundPowers input buffers (CK/CK#, CS#, RESET#), internal logic, and memory array; decoupling required per layout guidelines.
VCCQ / VSSQI/O Power/GroundSupplies DQ[7:0] and RWDS output drivers only; separation minimizes switching noise coupling into core logic.

Key Features

FeatureDesign Value
Configurable Drive StrengthAdjustable DQ/RWDS output drive to match PCB trace impedance and reduce EMI in high-speed layouts.
Hybrid Burst ModeCombines one wrapped burst (for cache-line alignment) followed by linear burst (for streaming), optimizing mixed-access workloads.
Partial Array RefreshReduces refresh power by refreshing only active memory banks instead of full array - critical for low-duty-cycle sensor logging.
Initial Latency SignalingRWDS output during CA phase dynamically indicates whether tACC = 1× or 2× latency count, enabling host-side timing adaptation.
Independent VCC/VCCQ RailsAllows VCCQ to be powered down while retaining core functionality - supports selective I/O retention in ultra-low-power states.

Applications

Graphics Frame BufferFirmware Code Execution

Use Scenario: Storing and streaming RGB pixel data for TFT LCD displays in automotive instrument clusters.

IC Role / Device Role / Timing Role: External frame buffer accessed via linear burst reads/writes synchronized to display controller's pixel clock.

Use Value: 400 MB/s bandwidth sustains 800×480@60Hz with zero wait-state rendering; hybrid sleep mode cuts idle power by 92% between frames.

Use Scenario: Executing application firmware directly from external memory on Cortex-M7 microcontrollers with XIP support.

IC Role / Device Role / Timing Role: Non-volatile code storage mapped into processor address space; accessed with wrapped bursts for instruction cache line fills.

Use Value: Wrapped 64-byte bursts align with ARM L1 cache lines; fixed-latency mode ensures deterministic instruction fetch timing under real-time constraints.

Industrial HMI Data LoggingEdge AI Sensor Preprocessing

Use Scenario: Capturing timestamped analog sensor readings at 10kHz and buffering before SPI upload to gateway MCU.

IC Role / Device Role / Timing Role: Circular buffer managed by DMA engine; writes use masked RWDS for partial-word updates without read-modify-write overhead.

Use Value: RWDS masking enables byte-granular writes to 32-bit aligned memory; deep power-down reduces quiescent current to 5µA during 500ms inter-sample intervals.

Use Scenario: Temporarily storing convolution kernel weights and feature map intermediates during on-device neural network inference.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed via linear bursts during MAC accumulation loops.

Use Value: 200MHz DDR interface delivers 400 MB/s - exceeds typical 256MB/s bandwidth requirement for INT8 ResNet-18 inference on Cortex-A53 SoCs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperRAM interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
W956D8MBYA5I TR64Mb density, identical package/timing/interface; same VCC/VCCQ and temperature range.Higher capacity suits larger firmware images or multi-layer graphics buffers where 32Mb is insufficient.Select when memory footprint exceeds 4MB but board layout and timing margins must remain unchanged.
IS66WV12816EBLL-15BLIParallel async SRAM (128Mb), 48-pin TSOP; no HyperBus, no RWDS, no DDR, higher pin count and static power.Legacy designs requiring pin-compatible drop-in replacement for existing async SRAM footprints.Choose only if HyperBus infrastructure is unavailable and board redesign for 24-ball BGA is not feasible.

Compared with W955N8MBYA5I TR, the W956D8MBYA5I TR offers double capacity with identical electrical and mechanical compatibility, while the IS66WV12816EBLL-15BLI trades interface efficiency and power savings for legacy parallel SRAM familiarity - making the former a seamless upgrade and the latter a last-resort migration path.

Availability

W955N8MBYA5I TR is available at Aetrix Electronics and suitable for graphics frame buffer, firmware code execution, and industrial HMI data logging applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.

Supply support for W955N8MBYA5I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR/NAND, RAM, and HyperRAM products for embedded and industrial markets.

The W955N8MBYA5I TR belongs to Winbond's HyperRAM family, designed specifically to replace parallel NOR/PSRAM in bandwidth-constrained, pin-limited applications such as automotive displays, smart home hubs, and portable medical devices.

FAQ

What is the maximum supported clock frequency for W955N8MBYA5I TR?

The W955N8MBYA5I TR supports a maximum clock frequency of 200MHz, enabling Double Data Rate transfers at up to 400 MT/s. This specification is validated across the full −40°C to +85°C operating temperature range and requires compliance with tACC ≤ 7.5ns and setup/hold timing per the official Winbond datasheet. The W955N8MBYA5I TR achieves this performance using either single-ended CK or differential CK/CK# signaling.

Does W955N8MBYA5I TR support true DDR operation with both rising and falling clock edges?

Yes, the W955N8MBYA5I TR implements true DDR operation: command/address bits are center-aligned with clock edges, and data transfers occur on both rising and falling edges of CK during read/write transactions. This is intrinsic to the HyperBus protocol and confirmed in the W955N8MBYA5I TR datasheet Figures 1–3 and Section 6.1. The RWDS signal remains edge-aligned with read data and center-aligned with write data.

How does RWDS function during write transactions in W955N8MBYA5I TR?

In W955N8MBYA5I TR write transactions, RWDS acts as a per-byte write mask: when driven High by the host, the corresponding DQ[7:0] byte is masked (not written); when Low, the byte is valid and written. This enables unaligned multi-byte writes without read-modify-write cycles. During zero-initial-latency writes, RWDS may be left Hi-Z by the slave, and full words are always written - a behavior explicitly defined in Section 7.4 of the W955N8MBYA5I TR datasheet.

Can W955N8MBYA5I TR operate with only a single-ended clock (CK only)?

Yes, the W955N8MBYA5I TR supports single-ended clocking using CK only, with CK# left unconnected or tied to a fixed voltage. The datasheet confirms CK# is "not used" in single-ended mode, and the internal receiver adapts accordingly. This simplifies routing in cost-sensitive designs, though differential mode is recommended for noise immunity above 100MHz. The W955N8MBYA5I TR's clock input structure is explicitly designed for this dual-mode flexibility.

What power-saving modes are implemented in W955N8MBYA5I TR?

The W955N8MBYA5I TR implements three hardware-controlled power-saving modes: Interface Standby (reduced I/O activity), Hybrid Sleep (partial array refresh + clock gating), and Deep Power Down (sub-10µA current, full array retention lost). Entry into each mode is controlled via Configuration Register 0/1 bits and requires specific command sequences. These modes are fully documented in Sections 10.2 and 9.4–9.5 of the W955N8MBYA5I TR datasheet and validated across industrial temperature.

W955N8MBYA5I TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
HyperRAM
Memory Size:
32Mbit
Memory Organization:
4M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W955N8MBYA5I TR FAQ

1.How can I place an order for W955N8MBYA5I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W955N8MBYA5I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W955N8MBYA5I TR reliable?

The price and inventory of W955N8MBYA5I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W955N8MBYA5I TR is usually 5 days.

3.What payment methods are accepted for W955N8MBYA5I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W955N8MBYA5I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W955N8MBYA5I TR?

W955N8MBYA5I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W955N8MBYA5I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W955N8MBYA5I TR?

For technical support, including W955N8MBYA5I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W955N8MBYA5I TR requirements.

6.How does Aetrix verify that W955N8MBYA5I TR is sourced from the original manufacturer or authorized distributors?

All W955N8MBYA5I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W955N8MBYA5I TR meets industry standards.

7.What is the process for return or replacement of W955N8MBYA5I TR?

All W955N8MBYA5I TR units undergo pre-shipment inspection (PSI). If there is an issue with W955N8MBYA5I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W955N8MBYA5I TR part is unused and in its original packaging.

Return procedure for W955N8MBYA5I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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