Winbond Electronics Corporation W956A8MBYA5I TR
- Part No.:
- W956A8MBYA5I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W956A8MBYA5I TR.pdf
- Description:
- IC DRAM 64MBIT HYPERBUS 24TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W956A8MBYA5I TR from Winbond Electronics is a 64Mb HyperRAM device operating at 3.0V with HyperBus DDR interface, 200MHz clock rate (400 MT/s), and 24-ball TFBGA package. It serves as high-speed external memory for microcontrollers and SoCs in graphics, firmware, and real-time data buffering applications.
For engineers reviewing the W956A8MBYA5I TR datasheet, W956A8MBYA5I TR pinout, W956A8MBYA5I TR application, or W956A8MBYA5I TR equivalent, key selection criteria include 3.0V VCC/VCCQ supply compatibility, HyperBus timing compliance, RWDS-based latency signaling, and support for hybrid/linear/wrapped burst modes in embedded systems requiring low-pin-count high-bandwidth memory expansion.
Technical Context
The W956A8MBYA5I TR implements a DDR HyperBus interface with bidirectional RWDS for dynamic initial latency indication and read data strobing or write data masking. It supports configurable burst types (wrapped, linear, hybrid), partial array refresh, and multiple power-saving modes including Hybrid Sleep and Deep Power Down.
Its architecture uses separate VCC (1.7–2.0V or 2.7–3.6V) and VCCQ supplies, differential or single-ended clocking (CK/CK#), and 8-bit DQ[7:0] data bus with center-aligned writes and edge-aligned reads relative to RWDS transitions - enabling sustained 400 MB/s throughput under 200MHz operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64Mb (8MB) organized as 8M × 8-bit; supports efficient firmware storage and frame buffer allocation. |
| Interface | HyperBus DDR: 8-bit bidirectional DQ + RWDS strobe/mask + CK/CK# clock; reduces pin count vs. parallel NOR/NAND. |
| Max Clock Rate | 200MHz: enables 400 MT/s effective data rate (2 transfers/cycle × 8-bit bus = 400 MB/s peak). |
| Supply Voltage | VCC/VCCQ = 2.7–3.6V: compatible with 3.3V system rails; decoupled I/O (VCCQ) and core (VCC) supplies improve noise immunity. |
| Operating Temp | −40°C to +85°C case temperature: qualified for industrial-grade embedded applications without derating. |
| Burst Modes | Configurable wrapped (16/32/64/128-byte), linear, or hybrid bursts: optimizes cache-line fill (wrapped) or streaming graphics (linear). |
| Power Modes | Hybrid Sleep and Deep Power Down: reduces active current to <50µA in DPD; enables rapid wake-up from sleep states. |
Pinout & Package
24-ball TFBGA (5×5 mm, 1-ball footprint), ball-down orientation. Package supports fine-pitch PCB routing and thermal dissipation in space-constrained designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low slave enable; defines transaction boundaries; supports multi-device daisy-chaining on shared bus. |
| CK / CK# | Differential Clock Input | Supports both differential (CK/CK#) and single-ended (CK only) clocking; eliminates need for external clock buffers. |
| DQ[7:0] | Bidirectional Data Bus | Transfers command/address/data in DDR mode; center-aligned on writes, edge-aligned on reads via RWDS. |
| RWDS | Bidirectional Strobe/Mask | Indicates initial latency during CA phase; acts as read data strobe or write byte mask; enables dynamic latency adaptation. |
| RESET# | Hardware Reset Input | Asynchronous initialization; places DQ/RWDS in Hi-Z; internal weak pull-up allows floating connection. |
| VCC / VSS | Core Power/Ground | Powers CK/CK#, CS#, RESET#, internal logic, and memory array; requires dedicated decoupling near package. |
| VCCQ / VSSQ | I/O Power/Ground | Powers DQ[7:0] and RWDS output drivers; independent supply minimizes switching noise coupling to core logic. |
Key Features
| Feature | Design Value |
|---|---|
| HyperBus DDR Interface | Reduces signal count to 12 pins (vs. 40+ for parallel NOR), simplifying PCB layout while delivering 400 MB/s bandwidth. |
| Configurable Drive Strength | Adjustable DQ/RWDS output drive mitigates signal integrity issues across varying trace lengths and loads without external termination. |
| Hybrid Burst Mode | Combines one wrapped burst (for cache-line alignment) followed by linear burst (for sequential streaming), improving mixed-access efficiency. |
| Partial Array Refresh | Refreshes only active memory regions instead of full array, reducing power consumption during partial utilization scenarios. |
| Multiple Power-Saving Modes | Hybrid Sleep retains data with fast wake-up; Deep Power Down cuts current to µA range for battery-backed standby. |
Applications
| Graphics Frame Buffer | Firmware Storage |
|---|---|
Use Scenario: Storing and streaming high-resolution display frames in automotive instrument clusters or industrial HMIs. IC Role / Device Role / Timing Role: External frame buffer accessed via HyperBus DDR; provides low-latency, high-throughput pixel data delivery synchronized to display controller timing. Use Value: 400 MB/s bandwidth supports 1080p@60Hz RGB888 rendering without bottlenecks; wrapped burst mode aligns with GPU cache-line fetch requirements. | Use Scenario: Hosting boot code, configuration tables, and field-upgradable firmware images in MCU-based edge devices. IC Role / Device Role / Timing Role: Execute-in-place (XIP)-capable non-volatile memory replacement; delivers deterministic read latency via configurable initial access timing. Use Value: Linear burst mode enables fast sequential instruction fetch; Hybrid Sleep mode maintains firmware integrity during intermittent operation with minimal power overhead. |
| Real-Time Data Logging | IoT Sensor Hub Memory |
Use Scenario: Capturing timestamped sensor streams (vibration, temperature, pressure) in predictive maintenance gateways. IC Role / Device Role / Timing Role: High-speed circular buffer for bursty sensor data ingestion; leverages RWDS-driven latency signaling to adapt to variable host processing load. Use Value: 200MHz DDR interface sustains >300 MB/s sustained write rates; Deep Power Down extends battery life between logging intervals. | Use Scenario: Aggregating and preprocessing multi-sensor data in compact wireless sensor nodes before transmission. IC Role / Device Role / Timing Role: Shared memory resource for sensor fusion algorithms running on dual-core MCUs; supports concurrent read/write via burst arbitration. Use Value: 8-bit bus and low-pin-count HyperBus minimize RF interference and PCB area; partial array refresh reduces active power during sparse sensor polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar HyperRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W956D8MBYA5I | 1.8V VCC/VCCQ supply; identical 200MHz timing, 24-ball TFBGA, and HyperBus feature set. | Targeted at 1.8V system domains (e.g., low-power SoCs); not interoperable with 3.0V I/O without level shifting. | Select when host voltage domain matches 1.8V; verify VCCQ tolerance of host interface. |
| IS66WVH8M8BLL-100BLI | 8Mb density, 100MHz QSPI interface; no RWDS or DDR; 24-ball TFBGA but different pinout and protocol stack. | Suitable for simpler, lower-bandwidth applications where HyperBus features (burst control, latency signaling) are unnecessary. | Choose only if bandwidth demand ≤100 MB/s and design lacks HyperBus controller IP; requires full interface redesign. |
Compared with W956D8MBYA5I, the W956A8MBYA5I TR operates at 3.0V and targets higher-voltage industrial hosts; versus IS66WVH8M8BLL-100BLI, it delivers 4× bandwidth and advanced latency management but requires HyperBus-capable controller hardware.
Availability
W956A8MBYA5I TR is available at Aetrix Electronics and suitable for graphics frame buffer, firmware storage, and real-time data logging applications requiring stable component supply, long-term industrial lifecycle support, and guaranteed traceable sourcing.
Supply support for W956A8MBYA5I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR, SPI NAND, and HyperRAM products for embedded and industrial markets.
The W956A8MBYA5I TR belongs to Winbond's HyperRAM family, designed specifically to replace parallel NOR flash and PSRAM in bandwidth-constrained, pin-limited applications such as automotive displays, IoT edge nodes, and real-time control systems.
FAQ
What is the operating voltage range for the W956A8MBYA5I TR?
The W956A8MBYA5I TR operates with VCC and VCCQ supplies in the 2.7V to 3.6V range, making it compatible with standard 3.3V system rails. This differs from the 1.8V W956D8MBYA5I variant and requires matching host I/O voltage levels. The device specifies separate VCC (core) and VCCQ (I/O) supplies to isolate noise-sensitive logic from high-speed data drivers, and both must be within this range for reliable W956A8MBYA5I TR operation.
Does the W956A8MBYA5I TR support differential clocking?
Yes, the W956A8MBYA5I TR supports both differential (CK/CK#) and single-ended (CK only) clocking modes. In differential mode, CK and CK# provide improved noise immunity and jitter tolerance for high-speed 200MHz operation. When using single-ended mode, CK# is left unconnected and the device functions with CK alone - no external circuitry changes are needed. This flexibility allows the W956A8MBYA5I TR to integrate into diverse controller platforms without requiring dedicated differential clock generators.
How does the RWDS signal function in the W956A8MBYA5I TR?
The RWDS signal in the W956A8MBYA5I TR is bidirectional and performs three critical roles: (1) during Command/Address transfer, it outputs high to indicate additional initial latency is required for refresh; (2) during read transactions, it acts as an edge-aligned read data strobe synchronized to DQ; and (3) during write transactions, it serves as a byte-level mask (high = masked, low = written). This dynamic behavior enables the W956A8MBYA5I TR to adapt latency and data integrity handling per transaction, eliminating fixed wait states and supporting efficient mixed-access patterns.
What burst modes are configurable in the W956A8MBYA5I TR?
The W956A8MBYA5I TR supports wrapped bursts (16/32/64/128 bytes), linear bursts, and hybrid bursts (one wrapped burst followed by linear). These are selected per transaction via Command/Address bits and configured in Configuration Register 0. Wrapped mode is ideal for cache-line-aligned accesses like instruction fetch; linear mode suits large contiguous transfers such as image streaming; hybrid mode combines both for mixed workloads. All modes operate at full 200MHz DDR speed, and the W956A8MBYA5I TR executes them without software overhead or address boundary constraints.
Is the W956A8MBYA5I TR pin-compatible with other Winbond HyperRAM devices?
The W956A8MBYA5I TR shares the same 24-ball TFBGA package and pinout with W956D8MBYA5I, W956A8MBYA6I, and W956D8MBYA6I - all members of the W956x8MBYA family. Ball assignments for CS#, CK/CK#, DQ[7:0], RWDS, RESET#, and power pins are identical across these variants. However, voltage and speed ratings differ: W956A8MBYA5I TR is 3.0V/200MHz, while W956D8MBYA5I is 1.8V/200MHz. Thus, W956A8MBYA5I TR is mechanically and electrically pin-compatible within its voltage family but requires matching host supply and timing margins.
W956A8MBYA5I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- HyperRAM
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W956A8MBYA5I TR FAQ
1.How can I place an order for W956A8MBYA5I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W956A8MBYA5I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W956A8MBYA5I TR reliable?
The price and inventory of W956A8MBYA5I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W956A8MBYA5I TR is usually 5 days.
3.What payment methods are accepted for W956A8MBYA5I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W956A8MBYA5I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W956A8MBYA5I TR?
W956A8MBYA5I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W956A8MBYA5I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W956A8MBYA5I TR?
For technical support, including W956A8MBYA5I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W956A8MBYA5I TR requirements.
6.How does Aetrix verify that W956A8MBYA5I TR is sourced from the original manufacturer or authorized distributors?
All W956A8MBYA5I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W956A8MBYA5I TR meets industry standards.
7.What is the process for return or replacement of W956A8MBYA5I TR?
All W956A8MBYA5I TR units undergo pre-shipment inspection (PSI). If there is an issue with W956A8MBYA5I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W956A8MBYA5I TR part is unused and in its original packaging.
Return procedure for W956A8MBYA5I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W956A8MBYA5I TR Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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