Winbond Electronics Corporation W956D6KBKX7I TR
- Part No.:
- W956D6KBKX7I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 49-WFBGA
- Datasheet:
-
W956D6KBKX7I TR.pdf
- Description:
- IC PSRAM 64MBIT PAR 49WFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,844
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W956D6KBKX7I TR from Winbond is a 64Mb (4M × 16) pseudo-static RAM with asynchronous/burst/synchronous operation and address/data multiplexing. It features a DRAM core with transparent self-refresh, 70ns random access time, 133MHz max clock rate, and operates at 1.8V VCC/VCCQ. It serves as low-power memory in portable embedded systems requiring SRAM-like interface with DRAM density.
For engineers reviewing the W956D6KBKX7I TR datasheet, W956D6KBKX7I TR pinout, W956D6KBKX7I TR application, or W956D6KBKX7I TR equivalent, key selection considerations include burst length programmability (4/8/16/32/continuous), variable/fixed latency modes, WAIT-driven collision handling, and deep power-down (DPD) entry/exit timing compliance.
Technical Context
This ADMUX PSRAM implements a dual-mode bus interface controlled by the Bus Configuration Register (BCR): asynchronous mode (BCR[15]=1, default) uses ADV#/CE#/OE#/WE# timing similar to SRAM, while burst mode (BCR[15]=0) enables synchronous CLK-driven transfers with configurable latency (3–6 clocks) and wrap behavior. The device supports both CRAM 1.5 x16 A/D MUX compliance and a higher-speed second mode doubling data rate.
Refresh is fully hidden and managed via two user-accessible registers: BCR governs bus timing and drive strength (e.g., BCR[5:4] = half-drive default), while the Refresh Configuration Register (RCR) controls partial-array refresh (PAR), temperature-compensated refresh (TCR), and DPD activation (RCR[4]). Standby current is minimized through PAR, TCR, and DPD - all software-configurable without external controller intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64Mb (4,194,304 × 16-bit words); enables compact high-capacity buffer storage in space-constrained designs. |
| Access Time | 70ns random access time; ensures SRAM-compatible timing for legacy controllers without redesign. |
| Max Clock Rate | 133MHz (tCLK = 7.5ns); supports high-throughput burst transfers in multimedia and communication subsystems. |
| Supply Voltage | 1.7V–1.95V for both VCC (core) and VCCQ (I/O); allows single-rail 1.8V system integration with margin. |
| Standby Current | <250 μA in self-refresh standby; critical for battery-powered devices requiring multi-day sleep duration. |
| Burst Length | Configurable 4/8/16/32-word or continuous burst; balances bandwidth efficiency and controller complexity. |
| Operating Temp | −40°C to +85°C case temperature; qualified for industrial and automotive infotainment environments. |
Pinout & Package
Package: 49-ball WFBGA (5.0mm × 5.0mm × 0.6mm, 0.65mm ball pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A/DQ[15:0] | Multiplexed address/data I/O | Shares 16 pins for both address latching (ADV# LOW) and data transfer (ADV# HIGH); reduces PCB trace count by 50% vs. separate buses. |
| ADV# | Address valid strobe | Latches address on rising edge during async mode; initiates burst address capture on first CLK edge when LOW in sync mode. |
| CLK | System clock input | Required only in burst mode; must be static (HIGH/LOW) during async operations to avoid undefined behavior. |
| WAIT | Data-valid arbitration signal | Asserted to stall controller during refresh collisions or row boundary crossing; polarity configurable via BCR[10]. |
| CRE | Configuration register enable | Enables read/write access to BCR and RCR; required to program burst length, latency, DPD, or PAR settings. |
| LB#/UB# | Byte enable controls | Selects DQ[7:0], DQ[15:8], or full DQ[15:0]; enables partial-word writes without read-modify-write overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Transparent self-refresh | Zero-controller-overhead refresh; no external refresh command or timing constraints needed for DRAM core maintenance. |
| Temperature-compensated refresh (TCR) | On-chip thermal sensor dynamically scales refresh interval; cuts standby current up to 40% at room temperature vs. fixed-rate refresh. |
| Partial-array refresh (PAR) | Allows refresh of only active memory regions (RCR[2:0] selects 1/2/4/8 sub-arrays); extends battery life when only small data buffers are active. |
| Deep Power-Down (DPD) mode | Reduces current to <10 μA; entered by setting RCR[4]=1 and toggling CE#; exit latency is 100μs - suitable for rapid wake-up scenarios. |
| CRAM 1.5 x16 A/D MUX compliance | Fully compatible with CellularRAM 1.5 standard interface; enables drop-in replacement in existing cellular baseband or modem designs. |
Applications
| Mobile Baseband Processing | Wireless IoT Edge Node |
|---|---|
|
Use Scenario: Real-time protocol stack buffering and packet reassembly in LTE/5G modem SoCs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency working memory interfacing directly with baseband DSP via burst-mode bus. Use Value: 133MHz burst transfers and 70ns async access eliminate bottlenecks in MAC/PHY layer handshaking; DPD extends battery life between transmission bursts. |
Use Scenario: Local sensor fusion and encrypted message queuing in BLE/Wi-Fi 6 IoT end nodes. IC Role / Device Role / Timing Role: Non-volatile-buffered RAM holding firmware state and encrypted payloads during intermittent connectivity. Use Value: PAR and TCR reduce average current to <50 μA in sleep; CRAM 1.5 compatibility simplifies migration from legacy CellularRAM-based designs. |
| Automotive Infotainment Display Buffer | Industrial HMI Graphics Cache |
|
Use Scenario: Frame buffer storage for 720p video overlay and UI rendering in automotive head units. IC Role / Device Role / Timing Role: Dual-port-capable memory accessed concurrently by GPU (burst reads) and CPU (async writes). Use Value: 4–32-word burst lengths match GPU pixel-fetch patterns; −40°C to +85°C rating ensures reliability across vehicle cabin thermal zones. |
Use Scenario: Dynamic GUI asset caching in programmable logic controller HMIs with touch-responsive interfaces. IC Role / Device Role / Timing Role: Low-power PSRAM replacing SRAM to extend runtime in fanless, sealed enclosures. Use Value: 1.8V operation matches modern MCU I/O rails; WAIT signal enables deterministic timing for real-time display updates without refresh jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pseudo-static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS66WV51216EBLL-70BLI | 512K × 16 SRAM, 70ns async-only, no burst mode or DPD; 3.3V/2.5V supply only. | Lacks refresh management and low-power modes; suited for simple control-plane buffers where latency predictability outweighs power savings. | Choose when deterministic worst-case timing is mandatory and power budget allows >2mA standby. |
| Winbond W958D6KBKX7I TR | 128Mb (8M × 16) variant of same ADMUX family; identical pinout, timing, and register set; supports same CRAM 1.5 mode. | Provides double memory capacity without layout change; requires updated BCR initialization for larger address range. | Choose for scalability path - same firmware driver and PCB footprint, only memory map extension needed. |
Compared with IS66WV51216EBLL-70BLI, W956D6KBKX7I TR delivers 128× more density and 99% lower standby current but requires WAIT-aware controller logic; versus W958D6KBKX7I TR, it offers optimal cost-per-Mb for mid-tier applications where 64Mb suffices.
Availability
W956D6KBKX7I TR is available at Aetrix Electronics and suitable for mobile baseband processing, wireless IoT edge nodes, automotive infotainment display buffering, and industrial HMI graphics caching requiring stable component supply across extended product lifecycles.
Supply support for W956D6KBKX7I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND, PSRAM, and audio codecs, with global manufacturing and quality certifications.
The W956D6KBKX7I TR belongs to Winbond's ADMUX PSRAM product line, designed specifically to replace SRAM in portable and battery-operated systems where density, power efficiency, and industry-standard interface compatibility are critical.
FAQ
What is the difference between CRAM 1.5 mode and the second operation mode of W956D6KBKX7I TR?
The W956D6KBKX7I TR supports two programmable operation modes. In CRAM 1.5 mode, it complies fully with the CellularRAM 1.5 x16 A/D MUX standard - matching timing, signaling, and register definitions for drop-in replacement. In the second mode, the device doubles its effective data rate by optimizing internal pipeline and burst sequencing, enabling higher throughput in custom-designed systems where strict CRAM 1.5 compliance is not required. Both modes retain identical pinout and power characteristics.
How does the WAIT signal behave during burst READ operations in W956D6KBKX7I TR?
In W956D6KBKX7I TR, the WAIT signal asserts at the start of a burst READ to indicate pending data validity, de-asserts when the first data word is ready (after configured latency), and re-asserts at row boundaries unless burst wrapping is enabled. During refresh collisions in variable-latency mode, additional WAIT assertion cycles are inserted to delay data output until refresh completes. WAIT polarity (active-HIGH/active-LOW) is configurable via BCR[10], and the signal is Hi-Z when CE# is HIGH.
Can W956D6KBKX7I TR operate without a clock signal?
Yes, W956D6KBKX7I TR supports full asynchronous operation with no CLK requirement. In this mode (BCR[15]=1, default), all READ/WRITE cycles are controlled solely by CE#, ADV#, OE#, WE#, and LB#/UB#. The CLK pin may be tied to VSSQ or VCCQ. However, burst mode, synchronous timing, and certain low-power features like precise DPD exit timing require CLK to be active and stable - so clock-free operation excludes burst transfers and some advanced power management sequences.
What is the minimum CE# LOW pulse width required to avoid refresh-related failures in W956D6KBKX7I TR?
The W956D6KBKX7I TR specifies tCEM (maximum CE# LOW duration) as 100ms under typical conditions. Exceeding this limit risks refresh starvation and data retention failure. To sustain long transfers, the controller must break bursts into segments shorter than tCEM - for example, issuing CE# HIGH between 4-word bursts - or use DPD mode for extended idle periods. This constraint applies to both asynchronous and burst operations and is enforced by internal refresh watchdog logic.
How is partial-array refresh (PAR) configured and used in W956D6KBKX7I TR?
Partial-array refresh (PAR) in W956D6KBKX7I TR is enabled by writing RCR[2:0] to select 1/2/4/8 sub-arrays for refresh, while RCR[4] must be 0 (DPD disabled). PAR reduces refresh current proportionally - e.g., refreshing only one-eighth of the array cuts self-refresh current to ~12.5% of full-array value. It is most effective when application data is localized (e.g., firmware code in lower addresses, buffers in upper addresses), and requires software coordination to ensure refreshed sub-arrays contain live data.
W956D6KBKX7I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 49-WFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-WFBGA (4x4)
W956D6KBKX7I TR FAQ
1.How can I place an order for W956D6KBKX7I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W956D6KBKX7I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W956D6KBKX7I TR reliable?
The price and inventory of W956D6KBKX7I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W956D6KBKX7I TR is usually 5 days.
3.What payment methods are accepted for W956D6KBKX7I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W956D6KBKX7I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W956D6KBKX7I TR?
W956D6KBKX7I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W956D6KBKX7I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W956D6KBKX7I TR?
For technical support, including W956D6KBKX7I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W956D6KBKX7I TR requirements.
6.How does Aetrix verify that W956D6KBKX7I TR is sourced from the original manufacturer or authorized distributors?
All W956D6KBKX7I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W956D6KBKX7I TR meets industry standards.
7.What is the process for return or replacement of W956D6KBKX7I TR?
All W956D6KBKX7I TR units undergo pre-shipment inspection (PSI). If there is an issue with W956D6KBKX7I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W956D6KBKX7I TR part is unused and in its original packaging.
Return procedure for W956D6KBKX7I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W956D6KBKX7I TR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

