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Winbond Electronics Corporation W956D8MBYA5I TR

Part No.:
W956D8MBYA5I TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW956D8MBYA5I TR.pdf
Description:
IC DRAM 64MBIT HYPERBUS 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,730

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Product details

Overview

W956D8MBYA5I TR from Winbond Electronics is a 64Mb HyperRAM device operating at 1.8V with a 200MHz maximum clock rate, delivering up to 400 MT/s DDR throughput via an 8-bit HyperBus interface. It features configurable burst modes (wrapped/linear/hybrid), hybrid sleep and deep power-down modes, and supports partial array refresh for low-power embedded memory applications including graphics buffers and real-time firmware storage.

For engineers reviewing the W956D8MBYA5I TR datasheet, W956D8MBYA5I TR pinout, W956D8MBYA5I TR application, or W956D8MBYA5I TR equivalent, key selection criteria include HyperBus timing compliance, 24-ball TFBGA footprint compatibility, 1.8V VCC/VCCQ supply requirements, RWDS-based latency signaling, and burst configuration register support for cache-line-aligned or linear sequential access.

Technical Context

The W956D8MBYA5I TR implements a DDR HyperBus interface with differential (CK/CK#) or single-ended (CK) clocking, using RWDS as a bidirectional strobe/mask signal that indicates initial latency during CA phase and serves as source-synchronous read strobe or write mask. All transactions begin with CS# assertion and six-byte Command-Address (CA) transfer over DQ[7:0] in center-aligned DDR format.

It supports dual-bank memory architecture with configurable initial latency (1× or 2× tACC), wrapped burst lengths of 16–128 bytes, hybrid burst (wrapped + linear), and two configuration registers enabling drive strength control, master clock type selection, partial array refresh, and distributed refresh intervals - all accessible via HyperBus register space addressing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 64Mb (8MB) organized as 8M × 8-bit; enables compact external memory for MCU-based displays and boot code storage.
Interface HyperBus DDR: 8-bit DQ + RWDS + CS# + CK/CK#; reduces pin count vs. parallel NOR/PSRAM while sustaining 400 MB/s peak bandwidth.
Max Clock Rate 200MHz: defines maximum sustained transaction frequency; combined with DDR yields 400 MT/s effective data rate.
Supply Voltage VCC/VCCQ = 1.8V ±0.1V: requires dedicated low-noise 1.8V rail for I/O and core logic; not compatible with 3.0V variants like W956A8MBYA5I.
Operating Temp –40°C to +85°C case temperature: qualified for industrial-grade operation in automotive infotainment and edge IoT gateways.
Burst Modes Wrapped (16/32/64/128-byte), Linear, Hybrid: allows cache-line fill (wrapped) or streaming graphics/video (linear) without host-side address management.
Power Modes Hybrid Sleep (low-latency wake), Deep Power Down (sub-10µA ICC): enables dynamic power scaling in battery-constrained HMI systems.

Pinout & Package

Package: 24-ball TFBGA, 5mm × 5mm, 0.8mm pitch, ball-down mounting. Compatible with standard reflow profiles for fine-pitch BGAs.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Input Active-low enable for bus transaction; high-to-low transition initiates CA transfer; low-to-high terminates transaction.
CK / CK# Differential Clock Input Timing reference for DDR sampling; supports single-ended mode (CK only) with CK# NC; not free-running.
DQ[7:0] Bidirectional Data Bus Transfers CA words and read/write data; LV-CMOS compatible; 8-bit width reduces PCB routing complexity vs. x16 interfaces.
RWDS Bidirectional Strobe/Mask Indicates initial latency during CA phase; acts as read data strobe (edge-aligned) or write mask (high = masked byte).
RESET# Hardware Reset Input Active-low initialization; places DQ/RWDS in Hi-Z; internal weak pull-up ensures safe default state if unconnected.
VCC / VSS Core Power/Ground VCC powers CK/CS#/RESET#/DQ/RWDS input buffers and internal logic; VSS is its return path.
VCCQ / VSSQ I/O Power/Ground VCCQ powers DQ/RWDS output drivers; independent rail allows voltage optimization for signal integrity.

Key Features

Feature Design Value
Configurable Drive Strength Adjustable output driver strength on DQ/RWDS pins to match trace impedance and reduce EMI in high-speed layouts.
Hybrid Burst Mode Combines wrapped burst (for cache-line alignment) followed by linear burst (for contiguous streaming), optimizing both latency and throughput.
Partial Array Refresh Reduces refresh current by refreshing only active memory rows, extending battery life in always-on display buffer applications.
Register Space Access Enables runtime configuration of latency, burst type, and power modes via HyperBus register reads/writes - no external EEPROM needed.
RFU Ball Handling Five RFU balls (A3, A4, B3, C2, D2) are explicitly defined as no-connect; must remain un-routed to ensure future compatibility.

Applications

Display Frame Buffer Real-Time Firmware Storage

Use Scenario: Storing rendered UI frames for TFT-LCD or OLED displays in automotive instrument clusters.

IC Role / Device Role / Timing Role: External frame buffer accessed via HyperBus by GPU or display controller; RWDS-synchronized reads ensure jitter-free pixel streaming.

Use Value: 400 MB/s bandwidth sustains 1080p@60fps with minimal CPU overhead; wrapped burst aligns to 64-byte cache lines for efficient rendering.

Use Scenario: Hosting boot firmware and runtime configuration data for RISC-V or ARM Cortex-M7 microcontrollers.

IC Role / Device Role / Timing Role: Non-volatile-like execution-in-place (XIP) memory mapped into processor address space; linear burst enables fast code fetch.

Use Value: 200MHz DDR interface provides lower latency than SPI Flash; deep power-down mode cuts standby current to <10µA during sleep cycles.

Industrial HMI Graphics Cache Edge AI Inference Scratchpad

Use Scenario: Caching vector graphics assets and animation sequences in programmable logic controllers (PLCs) with touch HMI.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad for GUI engine; hybrid burst mode handles mixed icon+text rendering workloads.

Use Value: Configurable initial latency (1×/2× tACC) allows tuning for deterministic response time; partial array refresh lowers thermal load in sealed enclosures.

Use Scenario: Temporary weight/activation storage during lightweight neural network inference on microcontrollers with limited SRAM.

IC Role / Device Role / Timing Role: Off-chip accelerator memory accessed via DMA; RWDS-driven read strobe ensures precise timing for pipelined MAC operations.

Use Value: 64Mb capacity extends usable inference batch size beyond on-die SRAM; 1.8V operation matches modern ultra-low-power AI SoCs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
W956A8MBYA5I TR 3.0V VCC/VCCQ supply; identical 200MHz clock, 64Mb density, and 24-ball TFBGA package. Targets systems with 3.0V I/O domains; incompatible with 1.8V-only designs due to voltage mismatch. Select W956A8MBYA5I TR only when main system rail is 3.0V and level-shifting is impractical.
IS66WV1288GBLL-150B1LI 128Mb PSRAM with Quad SPI interface; 150MHz max clock; 48-ball BGA; no RWDS or HyperBus protocol. Requires different controller IP and software stack; lacks HyperBus-specific features like hybrid burst and partial refresh. Choose only if HyperBus controller is unavailable and higher density justifies SPI interface overhead and lower bandwidth.

Compared with W956A8MBYA5I TR and IS66WV1288GBLL-150B1LI, the W956D8MBYA5I TR uniquely delivers 1.8V-compatible HyperBus performance with RWDS-based latency signaling and hybrid burst - critical for deterministic real-time graphics and low-power firmware XIP in constrained industrial designs.

Availability

W956D8MBYA5I TR is available at Aetrix Electronics and suitable for display frame buffers, real-time firmware storage, industrial HMI graphics caches, and edge AI inference scratchpads requiring stable component supply across extended product lifecycles.

Supply support for W956D8MBYA5I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, RAM, and high-performance serial interface memories.

The W956D8MBYA5I TR belongs to Winbond's HyperRAM family, designed specifically to replace parallel PSRAM and low-density DDR SDRAM in resource-constrained embedded systems where pin count, power, and deterministic latency are critical.

FAQ

What is the primary interface protocol supported by the W956D8MBYA5I TR?

The W956D8MBYA5I TR uses the HyperBus interface - a low-pin-count, double-data-rate (DDR) protocol with 8-bit DQ, RWDS, CS#, and differential/single-ended clock (CK/CK#). It is not SPI, QSPI, or standard parallel interface. The W956D8MBYA5I TR relies on RWDS for latency indication and data strobing, distinguishing it from conventional PSRAM or NOR Flash devices.

Does the W956D8MBYA5I TR support both wrapped and linear burst modes?

Yes, the W956D8MBYA5I TR supports wrapped burst (16/32/64/128-byte), linear burst, and hybrid burst (wrapped + linear) via Configuration Register 0. Burst type is selected per-transaction using the CA[45] bit, allowing dynamic switching - essential for mixing cache-line-aligned reads with large sequential transfers in the same application.

What power supply voltages does the W956D8MBYA5I TR require?

The W956D8MBYA5I TR requires two separate 1.8V supplies: VCC (1.8V ±0.1V) for core logic and input buffers, and VCCQ (1.8V ±0.1V) for DQ and RWDS output drivers. These must be independently decoupled. It is not compatible with 3.0V operation - that variant is the W956A8MBYA5I TR.

How does the RWDS pin function during read and write operations in the W956D8MBYA5I TR?

In the W956D8MBYA5I TR, RWDS serves three roles: (1) during Command-Address phase, it outputs high to indicate additional initial latency; (2) during read data transfer, it acts as an edge-aligned read data strobe; (3) during write data transfer, it functions as a byte-level mask (high = masked, low = written). This multi-role behavior is intrinsic to HyperBus and eliminates need for separate RD/WR control lines.

Is the W956D8MBYA5I TR pin-compatible with other HyperRAM devices in the same family?

Yes, the W956D8MBYA5I TR shares the identical 24-ball TFBGA package and pinout with W956A8MBYA5I TR, W956D8MBYA6I TR, and W956A8MBYA6I TR. All use the same ball assignment and electrical interface definition - only supply voltage (1.8V vs. 3.0V) and max clock (200MHz vs. 166MHz) differ between variants.

W956D8MBYA5I TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
HyperRAM
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (6x8)

W956D8MBYA5I TR FAQ

1.How can I place an order for W956D8MBYA5I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W956D8MBYA5I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W956D8MBYA5I TR reliable?

The price and inventory of W956D8MBYA5I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W956D8MBYA5I TR is usually 5 days.

3.What payment methods are accepted for W956D8MBYA5I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W956D8MBYA5I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W956D8MBYA5I TR?

W956D8MBYA5I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W956D8MBYA5I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W956D8MBYA5I TR?

For technical support, including W956D8MBYA5I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W956D8MBYA5I TR requirements.

6.How does Aetrix verify that W956D8MBYA5I TR is sourced from the original manufacturer or authorized distributors?

All W956D8MBYA5I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W956D8MBYA5I TR meets industry standards.

7.What is the process for return or replacement of W956D8MBYA5I TR?

All W956D8MBYA5I TR units undergo pre-shipment inspection (PSI). If there is an issue with W956D8MBYA5I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W956D8MBYA5I TR part is unused and in its original packaging.

Return procedure for W956D8MBYA5I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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