Winbond Electronics Corporation W957A8MFYA5I TR
- Part No.:
- W957A8MFYA5I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W957A8MFYA5I TR.pdf
- Description:
- IC DRAM 128MBIT HYPERBUS 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,469
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Product details
Overview
W957A8MFYA5I from Winbond Electronics is a 128Mb (16MB) HyperRAM device operating at 3.0V VCC/VCCQ, featuring an 8-bit DDR HyperBus interface, 200MHz clock rate (400 MT/s), and Dual-Die-Package (DDP) in 24-ball TFBGA. It serves as high-speed, low-pin-count external memory for microcontrollers and SoCs in graphics, firmware, and real-time data buffering applications.
For engineers reviewing the W957A8MFYA5I datasheet, W957A8MFYA5I pinout, W957A8MFYA5I application, or W957A8MFYA5I equivalent, key selection criteria include its 3.0V operation, configurable burst modes (linear/wrapped/hybrid), Hybrid Sleep and Deep Power Down power states, RWDS-based latency signaling, and DDP architecture enabling 128Mb density in compact footprint.
Technical Context
The W957A8MFYA5I implements a dual-die HyperBus interface with independent 64Mb dies stacked in one 24-ball TFBGA package. It supports both single-ended (CK only) and differential (CK/CK#) clocking, and uses RWDS bidirectionally - as latency indicator during Command/Address phase and as read strobe/write mask during data transfer.
Its functional block includes configurable initial/fixed latency, partial array refresh, hybrid burst (wrapped + linear), and register-mapped configuration (CR0/CR1) for drive strength, deep power down, and master clock type. Memory space addressing spans 128Mb across two dies with die-select logic embedded in address mapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128Mb (16MB) total, implemented as two 64Mb dies in DDP configuration |
| Interface | HyperBus DDR: 8-bit bidirectional DQ[7:0], RWDS strobe/mask, CS#, RESET#, CK/CK# or CK-only |
| Operating Voltage | 3.0V VCC/VCCQ (confirmed for W957A8MFYA5I; distinct from 1.8V W957D8MFYA5I) |
| Max Clock Rate | 200MHz - enables 400 MT/s sustained throughput in linear burst mode |
| Package | 24-ball TFBGA (5×5 mm, 1-ball footprint), DDP construction with shared I/O and dedicated die control |
| Temperature Range | –40°C to +85°C case temperature - qualified for industrial embedded operation |
| Burst Configurations | Linear, wrapped (16/32/64/128-byte), and hybrid burst - selectable per transaction via CA bits |
Pinout & Package
W957A8MFYA5I uses a 24-ball TFBGA package (5×5 mm, 1-ball footprint) with Dual-Die-Package architecture. All balls are assigned per Winbond's official ball map; RFU balls must remain unconnected on PCB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Input | Active-low chip select initiating all HyperBus transactions; edge-triggered start/stop of command/address/data flow |
| CK / CK# | Input | Differential clock pair (or CK-only single-ended); defines timing reference for DDR sampling of DQ and RWDS |
| DQ[7:0] | I/O | 8-bit bidirectional data bus carrying command, address, and read/write data with DDR timing |
| RWDS | I/O | Bidirectional strobe/mask: output during CA phase (latency signal), read strobe during reads, write mask during writes |
| RESET# | Input | Hardware reset with internal pull-up; forces High-Z on DQ/RWDS and returns device to Standby state |
| VCC / VCCQ | Power | VCC powers input buffers and core logic; VCCQ powers DQ/RWDS output drivers - allows I/O voltage independence |
| VSS / VSSQ | Ground | Separate analog/digital ground returns for VCC and VCCQ to minimize noise coupling in DDR signaling |
Key Features
| Feature | Design Value |
|---|---|
| HyperBus DDR Interface | Reduces pin count vs. parallel NOR/NAND while delivering 400 MB/s throughput using 8 DQ lines + RWDS |
| Configurable Drive Strength | Adjustable output drive on DQ/RWDS optimizes signal integrity across varying PCB trace lengths and loads |
| Hybrid Sleep Mode (HSM) | Retains memory contents with ultra-low current draw while allowing fast wake-up (<1 µs) for responsive system operation |
| Dual-Die-Package (DDP) | Integrates two 64Mb dies in single 24-ball package - doubles density without increasing footprint or interface complexity |
| Partial Array Refresh | Reduces refresh power by refreshing only active memory regions, critical for battery-powered and thermally constrained designs |
Applications
| Graphics Frame Buffer | Firmware Code Execution |
|---|---|
Use Scenario: Storing and streaming high-resolution UI assets and frame buffers in automotive instrument clusters and HMI displays. IC Role / Device Role / Timing Role: External XIP-capable memory providing low-latency, burst-oriented read access to GPU or display controller. Use Value: Linear burst mode delivers sustained 400 MB/s to feed 1080p@60fps rendering pipelines without bus contention. |
Use Scenario: Executing boot code and application firmware directly from external memory in resource-constrained MCUs. IC Role / Device Role / Timing Role: Non-volatile-like execution memory with deterministic read latency and no erase/write overhead. Use Value: Wrapped burst mode enables cache-line-aligned fetches matching CPU instruction fetch patterns for zero-wait-state execution. |
| Real-Time Data Logging | Industrial Edge Sensor Hub |
Use Scenario: Buffering time-stamped sensor streams (vibration, temperature, pressure) in predictive maintenance gateways. IC Role / Device Role / Timing Role: High-bandwidth circular buffer supporting concurrent write (via host) and read (via analytics engine). Use Value: Hybrid burst allows efficient wrap-around writes at buffer end and linear reads for batch analysis - minimizing software overhead. |
Use Scenario: Aggregating and preprocessing multi-sensor data before transmission in IIoT edge nodes. IC Role / Device Role / Timing Role: Shared memory resource between MCU and co-processor (e.g., DSP or AI accelerator) with low-latency inter-core communication. Use Value: RWDS-based latency signaling enables precise synchronization between processors without polling or complex handshaking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W957D8MFYA5I | 1.8V VCC/VCCQ operation; identical pinout, timing, and feature set except supply voltage | Targeted at low-power, battery-operated systems where 1.8V rail is available and preferred | Select W957D8MFYA5I when system uses 1.8V I/O domain; W957A8MFYA5I is required for 3.0V domains. |
| IS66WV1288GALL-100BLLI | Parallel SRAM interface (32-bit bus), 100MHz async operation, no RWDS or burst control; 128Mb density in 100-ball TQFP | Suitable for legacy controllers lacking HyperBus support but requiring same density and speed class | Choose IS66WV1288GALL-100BLLI only if HyperBus PHY is unavailable; expect 4× more pins and higher layout complexity. |
Compared with W957D8MFYA5I and IS66WV1288GALL-100BLLI, the W957A8MFYA5I uniquely balances 3.0V compatibility, 24-ball footprint, and DDR HyperBus efficiency - making it optimal for new industrial and automotive designs prioritizing pin count, power, and bandwidth simultaneously.
Availability
W957A8MFYA5I is available at Aetrix Electronics and suitable for graphics frame buffers, firmware code execution, real-time data logging, and industrial edge sensor hubs requiring stable component supply, long-term lifecycle assurance, and industrial-grade temperature performance.
Supply support for W957A8MFYA5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR, NAND, and high-performance serial interfaces like HyperRAM and Octal Flash.
The W957A8MFYA5I belongs to Winbond's HyperRAM family - designed specifically to replace parallel PSRAM and SRAM in bandwidth-constrained, pin-limited embedded systems while maintaining simplicity and low power.
FAQ
What is the operating voltage range for W957A8MFYA5I?
The W957A8MFYA5I operates at a fixed 3.0V supply for both VCC and VCCQ, as confirmed in Winbond's Order Information table. This distinguishes it from the 1.8V W957D8MFYA5I variant. The 3.0V specification ensures compatibility with common industrial I/O rails and eliminates need for level-shifting circuitry in 3V-system designs. W957A8MFYA5I does not support dual-voltage operation or voltage scaling.
Does W957A8MFYA5I support differential clocking?
Yes, W957A8MFYA5I supports both differential (CK/CK#) and single-ended (CK-only) clocking modes. The CK# pin is fully functional and required for differential operation, which improves noise immunity and timing margin in electrically noisy environments. CK-only mode simplifies routing when board layout constraints limit differential pair implementation. Both modes are supported without hardware modification to the W957A8MFYA5I device itself.
How does the RWDS signal function in W957A8MFYA5I read versus write operations?
In W957A8MFYA5I, RWDS acts as a bidirectional signal with distinct roles: during Command/Address phase, it outputs to indicate additional refresh latency; during read data transfer, it serves as a source-synchronous read strobe with data edge-aligned to RWDS transitions; during write data transfer, it functions as a byte-level mask (High = masked, Low = valid). This dual-role design eliminates need for separate strobe and mask lines, reducing pin count while preserving timing precision.
Is W957A8MFYA5I pin-compatible with W957D8MFYA5I?
Yes, W957A8MFYA5I and W957D8MFYA5I share identical 24-ball TFBGA package, pin assignment, and mechanical footprint. They differ only in supply voltage (3.0V vs. 1.8V) and associated DC characteristics - all signals, timing parameters, register maps, and HyperBus protocol behavior are functionally identical. This allows direct substitution in PCB layouts where voltage rail matches the selected variant.
What power-saving modes are available in W957A8MFYA5I?
W957A8MFYA5I supports three defined power-saving states: Interface Standby (low-current idle with clocks stopped), Hybrid Sleep Mode (HSM - retains memory contents with sub-100µA current and <1µs wake-up), and Deep Power Down (DPD - lowest current draw, requires full reinitialization on wake). These modes are controlled via Configuration Register 0 and enable fine-grained energy management aligned to application workload cycles - critical for battery-backed and thermally sensitive deployments.
W957A8MFYA5I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- HyperRAM
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 36 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W957A8MFYA5I TR FAQ
1.How can I place an order for W957A8MFYA5I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W957A8MFYA5I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W957A8MFYA5I TR reliable?
The price and inventory of W957A8MFYA5I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W957A8MFYA5I TR is usually 5 days.
3.What payment methods are accepted for W957A8MFYA5I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W957A8MFYA5I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W957A8MFYA5I TR?
W957A8MFYA5I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W957A8MFYA5I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W957A8MFYA5I TR?
For technical support, including W957A8MFYA5I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W957A8MFYA5I TR requirements.
6.How does Aetrix verify that W957A8MFYA5I TR is sourced from the original manufacturer or authorized distributors?
All W957A8MFYA5I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W957A8MFYA5I TR meets industry standards.
7.What is the process for return or replacement of W957A8MFYA5I TR?
All W957A8MFYA5I TR units undergo pre-shipment inspection (PSI). If there is an issue with W957A8MFYA5I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W957A8MFYA5I TR part is unused and in its original packaging.
Return procedure for W957A8MFYA5I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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