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Winbond Electronics Corporation W958D6DBCX7I
- Part No.:
- W958D6DBCX7I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-VFBGA
- Datasheet:
-
W958D6DBCX7I.pdf
- Description:
- IC PSRAM 256MBIT PAR 54VFBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
W958D6DBCX7I from Winbond is a 256Mb x16 asynchronous/burst/synchronous pseudo-static RAM (PSRAM) with address/data multiplexing, designed for low-power portable systems requiring SRAM-like interface and DRAM density. It supports 70ns random access, 133MHz burst clocking, and operates at 1.8V VCC/VCCQ across –40°C to +85°C. Its integrated temperature-compensated refresh and partial-array refresh enable ultra-low standby current (400μA) in cellular handsets and IoT edge nodes.
For engineers reviewing the W958D6DBCX7I datasheet, W958D6DBCX7I pinout, W958D6DBCX7I application, or W958D6DBCX7I equivalent, key selection criteria include its dual-mode bus operation (asynchronous + burst), configurable latency (fixed/variable), 54-ball VFBGA package, and CellularRAM 1.5 compliance-critical for memory-constrained wireless MCU designs.
Technical Context
This PSRAM integrates a DRAM core with SRAM-compatible control logic and a multiplexed x16 A/DQ bus, eliminating external address latches while maintaining high bandwidth. Its dual-register architecture-Bus Configuration Register (BCR) and Refresh Configuration Register (RCR)-enables runtime reconfiguration of burst length (4/8/16/32/continuous), latency mode, drive strength, and refresh behavior without reset.
The device implements three distinct power states: active (asynchronous/burst), self-refresh standby (400μA), and deep power-down (DPD). Refresh arbitration uses WAIT signal assertion during burst collisions, and TCR dynamically scales refresh rate based on on-die temperature sensing-reducing current at lower temperatures without compromising data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256Mb (16M × 16-bit organization), enabling compact code/data storage in space-constrained modules |
| Access Time | 70ns random access time-matches SRAM timing for legacy controller compatibility without wait states |
| Burst Clock Rate | 133MHz max (tCLK = 7.5ns), supporting high-throughput streaming in display buffers and audio FIFOs |
| Supply Voltage | 1.7V–1.95V for both VCC (core) and VCCQ (I/O), ensuring single-rail 1.8V system integration |
| Standby Current | 400μA in self-refresh mode-enables multi-day battery life in always-on sensor nodes |
| Operating Temp | –40°C to +85°C case temperature, qualified for industrial-grade handheld and automotive infotainment use |
| Package | 54-ball Very Thin Fine-Pitch BGA (VFBGA), 8mm × 8mm × 0.6mm-compatible with high-density PCB layouts |
Pinout & Package
W958D6DBCX7I uses a 54-ball VFBGA package with 0.5mm pitch and standard ball layout per datasheet Figure 4.1. Pin assignments are validated per section 4.1 and 5.1 of Winbond's A01-004 revision.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A/DQ[15:0] | Multiplexed address/data I/O | Shares 16 pins for both address input (ADV# LOW) and data I/O (ADV# HIGH); reduces total signal count by 50% vs. non-muxed interface |
| ADV# | Address valid strobe | Latches address on rising edge during async READ/WRITE; initiates burst sequence when LOW with CLK active |
| CRE | Control register enable | Enables write to BCR/RCR or read from configuration registers-required for runtime latency, burst, or refresh tuning |
| WAIT | Refresh collision indicator | Asserted during burst operations to signal refresh interference; used by controller to insert wait cycles or adjust timing |
| CLK | Synchronous timing reference | Required for burst mode; must be static (HIGH/LOW) during async operation to avoid undefined behavior |
| LB#/UB# | Byte lane enables | Selects DQ[7:0] (LB#), DQ[15:8] (UB#), or full x16 (both LOW)-supports byte-level writes without masking logic |
Key Features
| Feature | Design Value |
|---|---|
| CellularRAM 1.5 Compliance | Fully compatible with industry-standard CRAM x16 A/D MUX protocol-enables drop-in replacement in existing CRAM-based designs |
| Configurable Burst Length | 4/8/16/32-word or continuous burst via BCR[2:0]; allows optimization for video line buffering (short bursts) or firmware loading (continuous) |
| Variable/Fixed Latency Mode | BCR[14] selects variable latency (controller monitors WAIT) or fixed latency (predictable tAA)-supports both high-performance and simple-controller use cases |
| Temperature-Compensated Refresh | On-die thermal sensor adjusts refresh interval-cuts standby current up to 40% at 25°C vs. fixed-rate refresh |
| Deep Power-Down (DPD) | Enters sub-μA state via RCR[4] write; exits on CE# falling edge-ideal for intermittent wake-up sensor applications |
Applications
| Smartphone Application Processor Cache | Wireless Headset Audio Buffer |
|---|---|
|
Use Scenario: Offloading L2 cache for ARM Cortex-A series APs in entry-tier smartphones where SRAM cost is prohibitive. IC Role / Device Role / Timing Role: PSRAM acts as low-latency, high-bandwidth working memory with SRAM-equivalent interface timing and burst streaming capability. Use Value: Enables 256Mb of fast memory at ~30% lower cost and power than equivalent LPDDR2, while avoiding complex PHY training. |
Use Scenario: Storing decoded AAC/Opus frames and microphone pre-buffer in Bluetooth LE headsets with tight power budgets. IC Role / Device Role / Timing Role: Provides deterministic 70ns access for real-time audio playback and 133MHz burst for firmware updates over HCI. Use Value: Delivers 400μA standby current and DPD mode-extending battery life to >20 hours on a 120mAh cell. |
| Industrial Telematics Gateway | POS Terminal Display Framebuffer |
|
Use Scenario: Holding GPS/IMU sensor fusion data and cellular modem packet buffers in ruggedized fleet management units. IC Role / Device Role / Timing Role: Serves as shared memory between MCU and modem subsystems using asynchronous and burst modes interchangeably. Use Value: –40°C to +85°C operation and partial-array refresh ensure reliable data retention during vehicle engine-off cold soak and hot parking scenarios. |
Use Scenario: Acting as double-buffered framebuffer for 480×272 LCDs in retail point-of-sale terminals with instant-on UI requirements. IC Role / Device Role / Timing Role: Supplies pixel data via continuous burst reads synchronized to display controller clock, minimizing CPU overhead. Use Value: 133MHz burst bandwidth sustains 60fps refresh at full resolution without frame tearing or CPU polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS66WV12816EBLL-70NLI | 128Mb x16, 70ns async only, no burst mode or WAIT signal; 48-pin TSOP-II package | Lacks burst bandwidth and refresh arbitration-suitable only for simple SRAM drop-in where throughput < 100MB/s | Choose when board space allows larger TSOP and system lacks burst-capable memory controller |
| Winbond W956D6DBBX7I | 128Mb density, identical pinout, same BCR/RCR register map, and 133MHz burst capability | Half memory capacity but identical power profile and timing-ideal for cost-sensitive designs with <128Mb working set | Prefer for BOM rationalization where 128Mb suffices and footprint reuse is critical |
Compared with W958D6DBCX7I, the IS66WV12816EBLL-70NLI offers simpler interface but sacrifices 2× density and burst throughput, while the W956D6DBBX7I delivers identical architecture at half capacity-making it a true footprint- and firmware-compatible alternative for capacity-downgraded variants.
Availability
W958D6DBCX7I is available at Aetrix Electronics and suitable for smartphone AP caching, wireless headset audio buffering, industrial telematics gateways, and POS terminal display framebuffers requiring stable component supply across extended product lifecycles.
Supply support for W958D6DBCX7I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, PSRAM, and mobile DRAM, with global manufacturing and quality certifications.
W958D6DBCX7I belongs to Winbond's CellularRAM-compliant ADMUX PSRAM product line, engineered specifically for low-power, high-density memory substitution in portable wireless and embedded applications where SRAM cost or DRAM complexity is prohibitive.
FAQ
What is the maximum burst clock frequency supported by W958D6DBCX7I?
W958D6DBCX7I supports a maximum burst clock frequency of 133MHz (tCLK = 7.5ns), as specified in the "Features" section of the datasheet. This enables high-throughput data transfers for applications like display framebuffers and audio streaming. The device maintains timing integrity across its full operating temperature range (–40°C to +85°C), and the BCR register allows dynamic adjustment of burst length and latency to match system controller capabilities. W958D6DBCX7I achieves this performance while retaining asynchronous SRAM compatibility.
Does W958D6DBCX7I require external refresh circuitry?
No, W958D6DBCX7I incorporates fully transparent self-refresh logic with on-die temperature compensation (TCR) and partial-array refresh (PAR) controlled via the Refresh Configuration Register (RCR). The device performs all refresh operations autonomously-no external refresh commands or timing control are needed. This eliminates memory controller overhead and ensures data retention during standby, with typical self-refresh current of 400μA. W958D6DBCX7I handles refresh arbitration internally using the WAIT signal during burst operations.
Can W958D6DBCX7I operate in pure asynchronous mode without using CLK?
Yes, W958D6DBCX7I supports full asynchronous operation with CLK tied to VSSQ or VCCQ (per Note 1 in Section 5.1). In this mode, ADV#, CE#, OE#, and WE# govern all READ/WRITE cycles, and WAIT is ignored. The device defaults to asynchronous mode (BCR[15] = 1) at power-up. W958D6DBCX7I retains 70ns random access time and full byte-enable (LB#/UB#) functionality in this configuration-ideal for legacy SRAM controllers lacking burst clock support.
What package type and dimensions does W958D6DBCX7I use?
W958D6DBCX7I uses a 54-ball Very Thin Fine-Pitch BGA (VFBGA) package measuring 8mm × 8mm × 0.6mm with 0.5mm ball pitch. This compact, low-profile package is optimized for space-constrained portable electronics such as smartphones and wearables. The pinout-including A/DQ[15:0], ADV#, CRE, WAIT, and dual power rails (VCC/VCCQ)-is defined in Section 4.1 of the datasheet and validated for IPC-7351B compliance. W958D6DBCX7I's VFBGA footprint enables high routing density and thermal efficiency in multilayer PCBs.
How is the WAIT signal used in W958D6DBCX7I burst operations?
In W958D6DBCX7I burst mode, WAIT is an active-Low output that signals refresh collisions and row boundary crossings. During burst READ/WRITE, WAIT asserts at initiation and de-asserts to indicate valid data transfer timing; it reasserts at row boundaries unless burst wrap is enabled. The controller must monitor WAIT in variable-latency mode to insert wait states. WAIT polarity is configurable via BCR[10], and the signal is High-Z when CE# is HIGH. W958D6DBCX7I uses WAIT exclusively in burst mode-its state is undefined and should be ignored during asynchronous access.
W958D6DBCX7I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-VFBGA (6x8)
W958D6DBCX7I FAQ
1.How can I place an order for W958D6DBCX7I through Aetrix?
Please submit a Request for Quotation (RFQ) for W958D6DBCX7I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W958D6DBCX7I reliable?
The price and inventory of W958D6DBCX7I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W958D6DBCX7I is usually 5 days.
3.What payment methods are accepted for W958D6DBCX7I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W958D6DBCX7I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W958D6DBCX7I?
W958D6DBCX7I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W958D6DBCX7I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W958D6DBCX7I?
For technical support, including W958D6DBCX7I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W958D6DBCX7I requirements.
6.How does Aetrix verify that W958D6DBCX7I is sourced from the original manufacturer or authorized distributors?
All W958D6DBCX7I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W958D6DBCX7I meets industry standards.
7.What is the process for return or replacement of W958D6DBCX7I?
All W958D6DBCX7I units undergo pre-shipment inspection (PSI). If there is an issue with W958D6DBCX7I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W958D6DBCX7I part is unused and in its original packaging.
Return procedure for W958D6DBCX7I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W958D6DBCX7I Tags
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