Winbond Electronics Corporation W9712G6KB25I

Overview

W9712G6KB25I from Winbond Electronics is a 128M-bit DDR2 SDRAM organized as 2,097,152 words × 4 banks × 16 bits, operating at up to 800 MT/s (DDR2-800) with CAS latency options of 3–6 and industrial temperature support (−40°C to +95°C). It features SSTL_18 interface, on-die termination (ODT), off-chip driver (OCD) impedance adjustment, and auto-precharge for embedded control, networking, and industrial HMI systems.

For engineers reviewing the W9712G6KB25I datasheet, W9712G6KB25I pinout, W9712G6KB25I application, or W9712G6KB25I equivalent, key selection criteria include DDR2-800 timing compliance (5-5-5/6-6-6), TFBGA-84 ball layout, VDD/VDDQ = 1.8 V ± 0.1 V operation, ODT programmability, and industrial-grade thermal reliability.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned for reads and center-aligned for writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling precise timing at 250 MHz (tCK = 4 ns min for CL=5).

Functional control includes mode register (MR) and extended mode registers (EMR1–EMR3) for configuring burst length (4/8), additive latency (AL), ODT states, OCD calibration, and DLL enable/disable. Power management supports precharged/active power down, self-refresh (IDD6 ≤ 6 mA), and burst refresh (IDD5B ≤ 80 mA).

Key Specifications

Pinout & Package

W9712G6KB25I uses a TFBGA-84 package with 8×12.5 mm² footprint and 0.8 mm ball pitch. Ball assignments follow JEDEC-standard DDR2 layout with dedicated VSSQ/VDDQ planes for I/O noise isolation and separate VDDL/VSSDL for DLL power integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Compared with MT47H128M16HR-25E and IS42S16160F-6BL, W9712G6KB25I uniquely combines industrial temperature operation, OCD calibration, and full DDR2-800 (5-5-5/6-6-6) compliance in a single TFBGA-84 package-making it optimal for thermally demanding embedded systems requiring signal integrity tuning and long-term supply stability.

Availability

W9712G6KB25I is available at Aetrix Electronics and suitable for industrial HMI controllers, network switching ASIC buffers, and medical imaging front-end processors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9712G6KB25I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W97 series DDR2 SDRAM product line is engineered for high-reliability embedded applications requiring extended temperature operation, low-power self-refresh, and advanced signal integrity features like OCD and ODT.

FAQ

What is the maximum supported data rate for W9712G6KB25I?

W9712G6KB25I supports up to 800 MT/s (DDR2-800), corresponding to a minimum clock period (tCK) of 2.5 ns at CAS latency 6. This is validated across the full industrial temperature range (−40°C to +95°C) with appropriate refresh rate doubling above 85°C. The W9712G6KB25I achieves this using a DLL-synchronized interface and SSTL_18 signaling.

Does W9712G6KB25I support differential DQS operation?

Yes, W9712G6KB25I supports differential DQS operation via UDQS/UDQS and LDQS/LDQS ball pairs. This mode is enabled by setting A10 = HIGH in the Extended Mode Register 1 (EMR1) command. When active, both upper and lower byte strobes operate differentially for improved noise immunity and timing margin in high-speed layouts.

What is the purpose of the VDDL and VSSDL pins on W9712G6KB25I?

VDDL and VSSDL supply dedicated power and ground to the internal delay-locked loop (DLL) circuitry in W9712G6KB25I. Isolating the DLL's supply improves jitter performance and phase alignment stability between DQ and DQS signals. These pins must be decoupled independently from VDD/VSS and VDDQ/VSSQ to maintain DLL accuracy across temperature and voltage variations.

How does W9712G6KB25I handle refresh at elevated temperatures?

At case temperatures above 85°C, W9712G6KB25I requires doubling the refresh frequency to maintain data retention - reducing tREFI from 15.6 µS to 7.8 µS (32 ms interval). This is implemented by setting A7 = "1" in EMR(2), which enables high-temperature self-refresh mode. The W9712G6KB25I remains fully functional in self-refresh with IDD6 ≤ 6 mA even at 95°C.

Can W9712G6KB25I be used as a drop-in replacement for W9712G6KB-25?

No - W9712G6KB25I is not a drop-in replacement for W9712G6KB-25. While both share identical electrical specifications and pinout, the W9712G6KB25I is qualified for −40°C to +95°C operation with enhanced thermal refresh behavior and stricter AC parameter validation across that full range. System-level validation is required to confirm timing margins and power delivery stability under industrial thermal profiles.