Winbond Electronics Corporation W971GG6KB-18
- Part No.:
- W971GG6KB-18
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W971GG6KB-18.pdf
- Description:
- IC DRAM 1GBIT PAR 84WBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,373
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Product details
Overview
W971GG6KB-18 from Winbond Electronics is a 1G-bit DDR2 SDRAM organized as 8M words × 8 banks × 16 bits, supporting DDR2-1066 (7-7-7) timing at 533 MHz clock frequency with 1.8 V supply. It implements differential clock inputs (CLK/CLK), bi-directional DQS strobes, on-die termination (ODT), and off-chip driver (OCD) impedance calibration for high-signal-integrity memory subsystems in embedded networking and industrial control applications.
For engineers reviewing the W971GG6KB-18 datasheet, W971GG6KB-18 pinout, W971GG6KB-18 application, or W971GG6KB-18 equivalent, key selection considerations include its -18 speed grade compliance with DDR2-1066, 84-ball WBGA package, SSTL_18 interface, CAS latency programmability (CL=3–7), and support for auto-precharge, self-refresh, and power-down modes.
Technical Context
This DDR2 SDRAM uses a double-data-rate architecture synchronized to differential CLK/CLK inputs, with all address/control latched at clock crossings and I/Os referenced to source-synchronous DQS/DQS strobes. Its internal DLL aligns DQ and DQS transitions to clock edges, enabling precise timing at 533 MHz.
The device supports programmable additive latency (AL=0–2), burst lengths of 4 or 8, write latency = read latency − 1, and on-die termination controlled via ODT pin and extended mode registers. OCD calibration allows dynamic output driver impedance tuning for improved signal integrity across varying PCB trace conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (8,388,608 words × 8 banks × 16 bits) |
| Data Rate | 1066 Mb/sec/pin (DDR2-1066, 533 MHz clock) |
| CAS Latency | Programmable CL = 3, 4, 5, 6, or 7 - determines minimum read access delay in clock cycles |
| Burst Length | Configurable BL = 4 or 8 - defines number of consecutive data transfers per read/write command |
| Supply Voltage | VDD/VDDQ/VDDL = 1.8 V ± 0.1 V - strict rail tolerance required for stable DDR2 operation |
| Operating Temp | 0°C ≤ TCASE ≤ 85°C - commercial-grade thermal envelope for industrial edge devices |
| Package | 84-ball WBGA (8 mm × 12.5 mm, RoHS-compliant, lead-free) |
| Interface Standard | SSTL_18 - defines voltage thresholds and drive strength for reliable signal integrity |
Pinout & Package
W971GG6KB-18 is packaged in an 84-ball Wafer-Level Ball Grid Array (WBGA) measuring 8 mm × 12.5 mm with pitch 0.8 mm. The package separates VDDQ/VSSQ from VDD/VSS to reduce I/O noise coupling and includes dedicated DLL power (VDDL) and ground (VSSDL) pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row address (A0–A12); column address (A0–A9); A10 used for auto-precharge enable |
| BA0–BA2 | Bank Select | Selects one of eight internal banks for active/read/write/precharge commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDM/UDM |
| UDQS/UDQS, LDQS/LDQS | Differential Data Strobe | Source-synchronous strobes for upper (DQ8–DQ15) and lower (DQ0–DQ7) bytes; edge-aligned on read, center-aligned on write |
| CKE | Clock Enable | Asynchronous enable/disable of internal clock circuitry; controls power-down entry/exit |
| CS, RAS, CAS, WE | Command Inputs | Encoded command bus (e.g., ACTIVE, READ, WRITE, PRECHARGE, REFRESH) sampled on CLK/CLK crossing |
| ODT | On-Die Termination Control | Active-HIGH signal enabling internal termination resistors to match line impedance and suppress reflections |
| VREF | Input Reference Voltage | Mid-supply reference (VDDQ/2 ± 300 mV) for SSTL_18 input threshold stability |
Key Features
| Feature | Design Value |
|---|---|
| DLL-based clock alignment | Ensures DQ–DQS skew < ±150 ps across process/voltage/temperature, enabling reliable 533 MHz operation |
| Programmable ODT & OCD | Dynamic on-die termination and off-chip driver impedance tuning via EMR(1), reducing external termination components and improving signal fidelity |
| Posted CAS with AL | Additive latency (AL = 0–2) decouples command bus utilization from data return timing, increasing effective bandwidth under burst-heavy loads |
| Auto-precharge capability | Hardware-triggered bank precharge after burst completion eliminates manual PRE command overhead, simplifying controller logic |
| Multi-power-down modes | Supports both precharged and active power-down states, reducing IDD6 to ≤8 mA while preserving row activation state |
Applications
| Industrial PLC Memory Buffer | Network Switch Packet Buffer |
|---|---|
Use Scenario: Real-time deterministic data buffering in programmable logic controllers handling motion control I/O and fieldbus protocol stacks. IC Role / Device Role / Timing Role: Primary working memory for firmware execution and cyclic process data storage, interfaced to ARM Cortex-M7 or RISC-V SoC via 16-bit DDR2 bus. Use Value: DDR2-1066 bandwidth meets 100+ Mbps EtherCAT cycle requirements; -18 grade ensures timing margin at 85°C ambient in sealed enclosures. | Use Scenario: Temporary packet storage in Layer 2/3 Ethernet switches processing 1 GbE traffic with deep buffer queues. IC Role / Device Role / Timing Role: Shared packet buffer memory for ingress/egress queue management, accessed by switch fabric ASIC over DDR2 interface. Use Value: 1G-bit density supports ≥128 KB per port; ODT + OCD minimizes signal reflection on multi-drop DDR2 traces across backplane PCBs. |
| Medical Imaging Front-End Controller | Automotive ADAS Camera Interface |
Use Scenario: High-throughput image frame buffering in ultrasound or digital X-ray acquisition systems with real-time FPGA-based preprocessing. IC Role / Device Role / Timing Role: Frame buffer memory for raw sensor data ingestion and pixel-level correction pipelines, synchronized to FPGA DDR2 PHY. Use Value: Burst length 8 + CL=5 enables full 1280×720 frame line buffering at >60 fps; SSTL_18 compatibility ensures noise immunity in mixed-signal medical chassis. | Use Scenario: Vision processing pipeline memory in automotive surround-view or lane-departure systems using TI TDA3x or NXP S32V234 SoCs. IC Role / Device Role / Timing Role: Low-latency frame store for camera sensor data before ISP and CNN inference acceleration. Use Value: Self-refresh current ≤8 mA enables power-gated operation during vehicle sleep mode; -18 grade validated for 85°C junction in dashboard-mounted ECUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H128M16HR-37E | 1G-bit DDR2-800 (6-6-6), 84-ball FBGA, same VDDQ but higher tRC (57.5 ns vs. 58.125 ns) | Lower max data rate; requires controller reconfiguration for CL=6 and reduced tCK | Choose when system clock is limited to 400 MHz and thermal budget restricts to industrial temp range only |
| IS42S16160F-6BLI | 1G-bit DDR2-667 (5-5-5), 60-ball TSOP-II, 3.3 V tolerant VREF, no differential DQS support | Lacks UDQS/LDQS and DLL; requires single-ended strobe design and external termination | Prefer for cost-sensitive, space-constrained designs where 533 MHz performance is unnecessary and layout simplicity outweighs bandwidth |
Compared with MT47H128M16HR-37E and IS42S16160F-6BLI, W971GG6KB-18 delivers highest sustained bandwidth (1066 Mb/sec/pin), integrated differential strobes, and calibrated OCD-making it optimal for new designs targeting DDR2-1066 timing margins and signal integrity in dense, thermally constrained layouts.
Availability
W971GG6KB-18 is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, medical imaging, and automotive ADAS applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W971GG6KB-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.
The W971GG6KB series belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-optimized, high-reliability embedded systems needing JEDEC-compliant DDR2-1066 performance in compact WBGA packages.
FAQ
What is the maximum clock frequency supported by W971GG6KB-18?
W971GG6KB-18 supports a maximum clock frequency of 533 MHz, corresponding to DDR2-1066 operation (1066 Mb/sec/pin). This is validated under the -18 speed grade with tCK(min) = 1.875 ns at CL=7, and requires strict adherence to setup/hold timing relative to CLK/CLK differential crossings.
Does W971GG6KB-18 require external termination resistors?
No, W971GG6KB-18 integrates on-die termination (ODT) controlled via the ODT pin and extended mode registers, eliminating the need for external parallel termination. However, proper VREF (VDDQ/2 ± 300 mV) must be supplied externally to ensure correct SSTL_18 input threshold referencing.
How is the burst length configured for W971GG6KB-18?
Burst length for W971GG6KB-18 is set via A[2:0] bits during the Mode Register Set (MRS) command and is programmable to either 4 or 8. The device defaults to undefined after power-up, so the MRS command must be issued during initialization to configure BL before normal operation begins.
What is the purpose of the VDDL and VSSDL pins on W971GG6KB-18?
VDDL (DLL power) and VSSDL (DLL ground) provide isolated power and ground for the internal delay-locked loop circuitry. Separating DLL supply from core VDD/VSS prevents switching noise from degrading DLL jitter performance-critical for maintaining tight DQ–DQS alignment at 533 MHz operation.
Can W971GG6KB-18 operate in self-refresh mode at 85°C case temperature?
Yes, W971GG6KB-18 is rated for self-refresh current (IDD6) ≤8 mA at TCASE ≤ 85°C, as specified in the -18 speed grade datasheet. This enables low-power retention during system sleep states without external refresh controller intervention, provided VDD/VDDQ remain within 1.8 V ± 0.1 V.
W971GG6KB-18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 58.125 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (8x12.5)
W971GG6KB-18 FAQ
1.How can I place an order for W971GG6KB-18 through Aetrix?
Please submit a Request for Quotation (RFQ) for W971GG6KB-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W971GG6KB-18 reliable?
The price and inventory of W971GG6KB-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W971GG6KB-18 is usually 5 days.
3.What payment methods are accepted for W971GG6KB-18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W971GG6KB-18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W971GG6KB-18?
W971GG6KB-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W971GG6KB-18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W971GG6KB-18?
For technical support, including W971GG6KB-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W971GG6KB-18 requirements.
6.How does Aetrix verify that W971GG6KB-18 is sourced from the original manufacturer or authorized distributors?
All W971GG6KB-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W971GG6KB-18 meets industry standards.
7.What is the process for return or replacement of W971GG6KB-18?
All W971GG6KB-18 units undergo pre-shipment inspection (PSI). If there is an issue with W971GG6KB-18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W971GG6KB-18 part is unused and in its original packaging.
Return procedure for W971GG6KB-18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W971GG6KB-18 Tags

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