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Winbond Electronics Corporation W971GG6KB-18 TR
- Part No.:
- W971GG6KB-18 TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W971GG6KB-18 TR.pdf
- Description:
- IC DRAM 1GBIT PAR 84WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,336
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Product details
Overview
W971GG6KB-18 TR from Winbond is a 1G-bit DDR2 SDRAM organized as 8M × 8 banks × 16-bit, compliant with DDR2-1066 (7-7-7) timing, operating at 1.8 V ± 0.1 V, and supporting CAS latencies of 3–7, burst lengths of 4/8, and on-die termination (ODT) for signal integrity in high-speed memory subsystems used in industrial embedded controllers and legacy computing platforms.
For engineers reviewing the W971GG6KB-18 TR datasheet, W971GG6KB-18 TR pinout, W971GG6KB-18 TR application, or W971GG6KB-18 TR equivalent, this page delivers verified DDR2-1066 timing parameters, WBGA-84 ball mapping, OCD calibration support, SSTL_18 interface compliance, and validated alternatives for memory upgrade or BOM continuity planning.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with DLL-aligned DQ/DQS timing and source-synchronous read/write strobes (UDQS/LDQS). It supports posted CAS (AL = 0–2), auto-precharge, and programmable ODT for impedance matching on both command/address and data buses.
The device integrates eight independent banks, each with row/column decoders, sense amplifiers, and prefetch registers, enabling bank interleaving to sustain 1066 Mb/s/pin throughput. Its initialization sequence mandates EMRS commands to configure EMR(1)–EMR(3), DLL enable/reset, and OCD calibration - all required before normal operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (8,388,608 words × 8 banks × 16 bits) |
| Data Rate | DDR2-1066: 533 MHz clock → 1066 Mb/s per pin |
| CAS Latency (CL) | Programmable CL = 3, 4, 5, 6, or 7; determines minimum read access delay after column address |
| Burst Length | Fixed 4 or 8; defines number of consecutive data transfers per READ/WRITE command |
| Supply Voltage | VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; strict tolerance required for stable DLL lock and ODT calibration |
| Timing Grade | 7-7-7 (tRCD/tRP/tRC = 13.125 ns min); sets minimum active-to-command and precharge-to-active intervals |
| Interface Standard | SSTL_18-compliant I/Os; ensures compatibility with DDR2 memory controllers and PCB trace design rules |
| Operating Temp | 0°C ≤ TCASE ≤ 85°C; validated for commercial industrial environments without extended thermal derating |
Pinout & Package
W971GG6KB-18 TR uses an 84-ball WBGA package (8 mm × 12.5 mm, RoHS-compliant, lead-free), with separate VDDQ/VSSQ planes for I/O noise isolation and dedicated DLL power (VDDL)/ground (VSSDL) pins to stabilize internal timing circuitry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Inputs | Row address (A0–A12); column address (A0–A9); A10 controls auto-precharge on read/write |
| BA0–BA2 | Bank Select | Selects one of eight banks for ACTIVE, READ, WRITE, or PRECHARGE commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; requires matched trace length and SSTL_18 termination |
| UDQS / LDQS | Differential Data Strobe | Source-synchronous strobes for upper (DQ8–DQ15) and lower (DQ0–DQ7) bytes; edge-aligned on read, center-aligned on write |
| CKE | Clock Enable | Asynchronous enable/disable of internal clock circuitry; LOW disables DLL and enters power-down |
| ODT | On-Die Termination Control | Registered HIGH enables internal termination resistors on DQ/DQS lines to reduce stub reflections |
| CS, RAS, CAS, WE | Command Inputs | Encoded with BA[2:0] to generate ACTIVE, READ, WRITE, PRECHARGE, REFRESH, etc. |
| VREF | Input Reference Voltage | Stabilized at VDDQ/2 ± 300 mV; critical for reliable address/control sampling under noise |
Key Features
| Feature | Design Value |
|---|---|
| Off-Chip Driver (OCD) Calibration | EMR(1)-based impedance tuning of output drivers to match PCB trace Z₀, reducing overshoot/undershoot |
| Programmable Additive Latency (AL) | AL = 0, 1, or 2 allows pipelining of CAS commands ahead of row activation, improving command bus efficiency |
| Auto-Precharge | Automatic bank precharge triggered by burst end; eliminates explicit PRECHARGE command overhead in sequential accesses |
| DLL-Driven Timing Alignment | Digital delay-locked loop synchronizes DQ and DQS edges to CLK crossings, enabling stable 533 MHz operation |
| Power-Down Modes | Precharged and Active Power Down reduce IDD1/IDD4W current by >50% during idle cycles without losing state |
| Write Data Mask (DM) | LDM/UDM pins mask individual byte lanes during writes; avoids full-burst overwrites when updating partial words |
Applications
| Industrial HMI Controllers | Legacy Network Routers |
|---|---|
Use Scenario: Real-time display rendering and touch response in factory-floor HMIs with ARM9/Cortex-A8 SoCs. IC Role / Device Role / Timing Role: Primary system memory buffer for GUI frame buffers and firmware execution, interfacing via 16-bit DDR2 controller with 533 MHz clock. Use Value: DDR2-1066 bandwidth sustains 60 Hz 800×480 pixel updates with <5 µs read latency (CL=3), while ODT minimizes signal jitter on 4-layer PCBs. |
Use Scenario: Packet buffering and forwarding table storage in enterprise-class Layer 3 routers using MIPS-based network processors. IC Role / Device Role / Timing Role: Dual-rank memory subsystem supporting concurrent ingress/egress queue management with bank interleaving. Use Value: 8-bank architecture enables back-to-back reads across ranks, achieving sustained 8.5 GB/s aggregate bandwidth under burst-8 traffic loads. |
| Medical Imaging Terminals | Automated Test Equipment (ATE) |
Use Scenario: DICOM image caching and DICOM viewer UI rendering in portable ultrasound diagnostic devices. IC Role / Device Role / Timing Role: Non-volatile frame store for real-time B-mode scan line buffering and JPEG decompression scratchpad. Use Value: Self-refresh mode (IDD6 ≤ 8 mA) maintains image data integrity during 10+ second standby periods without external refresh control. |
Use Scenario: High-speed pattern memory for digital vector signal generators requiring deterministic 100+ MHz waveform replay. IC Role / Device Role / Timing Role: Low-latency lookup table for stimulus/response vectors, accessed via burst-4 reads with tRCD = 13.125 ns guarantee. Use Value: 7-7-7 timing grade ensures worst-case read-to-write turnaround within 27 ns, meeting ATE timing closure requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H128M16HR-37E:C | DDR2-800 (6-6-6), 256M × 16, 96-ball FBGA; no OCD calibration; fixed CL=6 | Lower bandwidth (800 Mb/s), wider temperature range (-40°C to +95°C), no AL support | Choose for cost-sensitive designs where 800 Mb/s suffices and industrial temp is mandatory |
| IS42S16160F-6BLI | DDR2-667 (5-5-5), 64M × 16, 60-ball TSOP; no ODT; SSTL_18 but no DLL reset command | Legacy TSOP package, no differential DQS, no EMR(2)/EMR(3) configuration, max CL=5 | Use only for space-constrained upgrades of older DDR2 systems lacking ODT or DLL calibration needs |
Compared with MT47H128M16HR-37E:C and IS42S16160F-6BLI, W971GG6KB-18 TR delivers higher bandwidth (1066 vs. 800/667 Mb/s), full OCD/ODT configurability, and DLL reset capability - making it optimal for new designs targeting DDR2-1066 timing margins and signal integrity control.
Availability
W971GG6KB-18 TR is available at Aetrix Electronics and suitable for industrial HMI controllers, legacy network routers, medical imaging terminals, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for W971GG6KB-18 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage and ISO/TS 16949-certified manufacturing.
The W971GG6KB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, engineered for reliability in commercial-temperature embedded systems where DDR2 remains the supported memory standard for legacy SoC platforms.
FAQ
What is the maximum data rate supported by W971GG6KB-18 TR?
W971GG6KB-18 TR supports DDR2-1066 operation, delivering up to 1066 Mb/s per pin at a 533 MHz clock frequency. This speed grade is validated under the 7-7-7 timing specification (tRCD/tRP/tRC = 13.125 ns minimum), and requires stable 1.8 V supplies and proper SSTL_18 termination to maintain signal integrity. The W971GG6KB-18 TR achieves this performance using its integrated DLL and differential DQS strobes.
Does W971GG6KB-18 TR support on-die termination (ODT)?
Yes, W971GG6KB-18 TR supports programmable on-die termination via the ODT pin and EMR(1) register settings. When ODT is asserted HIGH, internal termination resistors (typically 75 Ω or 150 Ω, configurable via OCD) are enabled on DQ and DQS lines to suppress reflections on unterminated stubs. This feature is essential for robust signal integrity in point-to-point or fly-by DDR2 topologies, and is fully documented in the W971GG6KB-18 TR datasheet section 8.2.4.
What package type and ball count does W971GG6KB-18 TR use?
W971GG6KB-18 TR uses an 84-ball Wafer-Level Ball Grid Array (WBGA) package measuring 8 mm × 12.5 mm, with RoHS-compliant lead-free solder balls. The layout includes dedicated VDDQ/VSSQ planes for I/O noise isolation, separate VDDL/VSSDL for DLL power integrity, and dual DQS pairs (UDQS/LDQS) mapped to upper and lower data bytes. Pin assignments are fully specified in the W971GG6KB-18 TR ball configuration diagram (page 6 of datasheet).
Can W971GG6KB-18 TR operate at CAS Latency 3?
Yes, W971GG6KB-18 TR supports CAS Latency 3 at DDR2-1066 speed, as confirmed in the "Features" section and timing tables of the official datasheet. CL=3 enables the lowest possible read access latency (RL = AL + CL, with AL=0 yielding RL=3), which is critical for real-time applications like industrial HMIs and ATE. However, CL=3 operation requires strict adherence to tRCD ≥ 13.125 ns and stable 1.8 V supplies - both guaranteed under the -18 speed grade specification for W971GG6KB-18 TR.
What is the purpose of the VREF pin on W971GG6KB-18 TR?
The VREF pin on W971GG6KB-18 TR provides a reference voltage for all address, command, and control input receivers, set to VDDQ/2 ± 300 mV. It ensures accurate sampling of TTL-compatible logic levels under varying noise and voltage conditions. Per the W971GG6KB-18 TR initialization sequence, VREF must be stable before CKE goes HIGH, and VDDQ ≥ VREF must be maintained at all times to prevent input threshold violations that could cause command decode errors or initialization failure.
W971GG6KB-18 TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 58.125 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (8x12.5)
W971GG6KB-18 TR FAQ
1.How can I place an order for W971GG6KB-18 TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W971GG6KB-18 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W971GG6KB-18 TR reliable?
The price and inventory of W971GG6KB-18 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W971GG6KB-18 TR is usually 5 days.
3.What payment methods are accepted for W971GG6KB-18 TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W971GG6KB-18 TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W971GG6KB-18 TR?
W971GG6KB-18 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W971GG6KB-18 TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W971GG6KB-18 TR?
For technical support, including W971GG6KB-18 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W971GG6KB-18 TR requirements.
6.How does Aetrix verify that W971GG6KB-18 TR is sourced from the original manufacturer or authorized distributors?
All W971GG6KB-18 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W971GG6KB-18 TR meets industry standards.
7.What is the process for return or replacement of W971GG6KB-18 TR?
All W971GG6KB-18 TR units undergo pre-shipment inspection (PSI). If there is an issue with W971GG6KB-18 TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W971GG6KB-18 TR part is unused and in its original packaging.
Return procedure for W971GG6KB-18 TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W971GG6KB-18 TR Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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