Winbond Electronics Corporation W971GG6KB-25 TR

Overview

W971GG6KB-25 TR from Winbond Electronics is a 1G-bit DDR2 SDRAM organized as 8M × 8 banks × 16-bit, supporting DDR2-800 (5-5-5 or 6-6-6) operation at 400 MHz clock frequency with 1.8 V supply, CAS latency options of 3–7, and burst lengths of 4 or 8. It serves as main memory in embedded networking, industrial control, and digital video systems requiring reliable high-bandwidth data buffering.

For engineers reviewing the W971GG6KB-25 TR datasheet, W971GG6KB-25 TR pinout, W971GG6KB-25 TR application, or W971GG6KB-25 TR equivalent, key selection criteria include tRCD/tRP = 12.5 ns minimum, ODT and OCD impedance calibration support, SSTL_18 interface compliance, and WBGA-84 package compatibility with JEDEC DDR2 layout rules.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable timing at 400 MHz.

The device supports programmable additive latency (AL = 0–2), auto-precharge for burst operations, and dual power-down modes (precharged and active). On-die termination (ODT) and off-chip driver (OCD) impedance adjustment are controlled via extended mode registers EMR(1)–EMR(3), allowing dynamic signal integrity tuning without external components.

Key Specifications

Pinout & Package

W971GG6KB-25 TR uses an 84-ball fine-pitch wafer-level ball grid array (WBGA) package with 0.8 mm ball pitch, optimized for high-density PCB layouts and thermal performance in space-constrained embedded systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Compared with MT47H128M16HR-25E and IS42S16160F-6BLI, W971GG6KB-25 TR provides superior signal integrity via OCD calibration and flexible AL programming, making it optimal for high-speed, noise-sensitive industrial designs where WBGA packaging is feasible.

Availability

W971GG6KB-25 TR is available at Aetrix Electronics and suitable for industrial HMI panels, digital video recorders, and network edge routers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W971GG6KB-25 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage and ISO/TS 16949-certified manufacturing.

The W971GG6KB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, engineered for reliability in extended-temperature embedded applications where signal integrity, power efficiency, and long-term supply stability are critical.

FAQ

What is the maximum supported clock frequency for W971GG6KB-25 TR?

W971GG6KB-25 TR supports a maximum clock frequency of 400 MHz, corresponding to DDR2-800 speed grade (800 Mb/sec/pin). This is validated for tCK(min) = 2.5 ns at CL = 5 or 6, with tRCD and tRP minimums of 12.5 ns. Operation beyond this frequency violates AC timing specifications and risks data corruption.

Does W971GG6KB-25 TR support on-die termination (ODT) and how is it configured?

Yes, W971GG6KB-25 TR supports programmable ODT via EMR(1) register bits. ODT is enabled by driving the ODT pin HIGH and configuring termination resistance values (75 Ω, 150 Ω, or off) through extended mode register settings. This eliminates external termination resistors and improves signal integrity on high-speed DDR2 buses.

What package type and ball count does W971GG6KB-25 TR use?

W971GG6KB-25 TR uses a RoHS-compliant, lead-free wafer-level ball grid array (WBGA) package with 84 solder balls arranged in an 8 mm × 12.5 mm footprint and 0.8 mm pitch. This compact, thermally efficient package is designed for high-density PCB layouts in space-constrained industrial applications.

Can W971GG6KB-25 TR operate at CAS latency 3, and what are the timing implications?

Yes, W971GG6KB-25 TR supports CL = 3 at DDR2-800 speed, requiring tCK(min) ≥ 5 ns. At this setting, read latency RL = AL + CL = 3–5 cycles depending on additive latency, enabling lowest possible access delay. However, tRCD and tRP remain fixed at 12.5 ns minimum, constraining minimum row activation intervals.

How is OCD (Off-Chip Driver) impedance calibration performed on W971GG6KB-25 TR?

OCD calibration on W971GG6KB-25 TR is executed during initialization using EMR(1) commands: first enter OCD calibration mode (A9=A8=A7=HIGH), then adjust drive strength via A[6:0], and finally exit mode (A9=A8=A7=LOW). This tunes output driver impedance to match PCB trace characteristics, reducing signal reflections without external components.