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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W971GG6NB-18I TR

Name: W971GG6NB-18I TR
Brand: Winbond Electronics Corporation
SKU: W971GG6NB-18I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W971GG6NB-18I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 84-TFBGA

Datasheet:: W971GG6NB-18I TR.pdf

Description:: IC DRAM 1GBIT SSTL 18 84TFBGA

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Product details

Overview

W971GG6NB-18I TR from Winbond is a 1G-bit DDR2 SDRAM organized as 8M × 8 banks × 16 bits, supporting DDR2-1066 (6-6-6) operation at 533 MHz clock frequency with CAS Latency 6, tRCD/tRP = 11.25 ns, and SSTL_18 interface. It operates across -40°C to +95°C and integrates on-die termination (ODT), OCD impedance calibration, and DLL-aligned DQS/DQ timing for high-signal-integrity memory subsystems in industrial embedded controllers.

For engineers reviewing the W971GG6NB-18I TR datasheet, W971GG6NB-18I TR pinout, W971GG6NB-18I TR application, or W971GG6NB-18I TR equivalent, this page delivers verified DDR2 timing parameters, ball-level I/O mapping, JEDEC-compliant thermal grade validation, and real-world substitution guidance for industrial-grade memory design and BOM continuity planning.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned to read data and center-aligned to write data. Its internal DLL aligns DQ and DQS transitions to clock edges, enabling stable 1066 Mbps transfer rates under industrial temperature stress.

The device supports programmable additive latency (AL = 0–2), burst lengths of 4 or 8, and configurable ODT states via EMR(1). It features dedicated VDDQ/VSSQ power domains for I/O noise isolation, VDDL/VSSDL for DLL circuitry, and VREF reference tracking at VDDQ/2 ± 300 mV - all required for JEDEC DDR2-1066 compliance in multi-rank systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	1 G-bit (8,388,608 words × 8 banks × 16 bits), enabling 256 MB byte-addressable capacity per device.
Data Rate	DDR2-1066 (533 MHz clock, 1066 MT/s), meeting JEDEC JESD79-2F specification for high-throughput memory interfaces.
CAS Latency	CL = 6 at DDR2-1066 speed grade, defining minimum clock cycles between READ command and first valid data output.
tRCD / tRP	11.25 ns minimum, setting critical timing margins for row activation and precharge in industrial temperature range.
Supply Voltages	VDD = VDDQ = VDDL = 1.8 V ± 0.1 V; VREF = VDDQ/2 ± 300 mV - strict regulation required for signal integrity and JEDEC compliance.
Operating Temperature	-40°C ≤ TCASE ≤ 95°C (industrial grade), validated with doubled auto-refresh rate (tREFI = 3.9 µS) above 85°C.
Interface Standard	SSTL_18 I/O standard with on-die termination (ODT) and off-chip driver (OCD) calibration for impedance control.

Pinout & Package

VFBGA-84 package (8 mm × 12.5 mm, 1.0 mm height, window-type BGA), RoHS-compliant, lead-free.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Inputs	Row address (A0–A12) and column address (A0–A9); A10 controls auto-precharge enable during READ/WRITE commands.
BA0–BA2	Bank Select	Selects one of eight internal banks for ACTIVE, READ, WRITE, or PRECHARGE operations.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; DQ0–DQ7 paired with LDQS/LDQS, DQ8–DQ15 paired with UDQS/UDQS in differential mode.
UDQS / LDQS	Differential Data Strobe	Source-synchronous strobes: edge-aligned with read data, center-aligned with write data; enabled only when EMR(1)[A10] = 1.
CKE	Clock Enable	Asynchronous enable/disable of internal clock circuitry; LOW disables DLL and enters power-down modes.
ODT	On-Die Termination Control	Registered HIGH enables internal termination resistors (RZQ/4, RZQ/5, RZQ/6, or RZQ/7) for stub-free point-to-point routing.
VREF	Input Reference Voltage	Tracks VDDQ/2 ± 300 mV; used by all address, command, and control input receivers for SSTL_18 threshold stability.
VDDQ / VSSQ	I/O Power / Ground	Isolated 1.8 V supply and ground plane for DQ/DQS pins - essential for minimizing I/O switching noise in high-speed layouts.

Key Features

Feature	Design Value
Programmable Additive Latency (AL)	AL = 0, 1, or 2 allows tuning of command-to-data timing overhead without changing CL, improving bus efficiency in burst-heavy workloads.
OCD Impedance Calibration	Off-chip driver impedance matching to ZQ resistor (240 Ω) ensures consistent drive strength across voltage/temperature, reducing signal distortion.
DLL-Enhanced Timing Alignment	Digital delay-locked loop synchronizes DQ and DQS edges to CLK crossings, enabling reliable 533 MHz clock operation with ±15 ps jitter tolerance.
Multi-Temperature Refresh Management	Auto-refresh interval automatically halves (tREFI = 3.9 µS) above 85°C via EMR(2)[A7], guaranteeing data retention in extended industrial environments.
Power-Down Mode Flexibility	Supports both precharged and active power-down states, reducing IDD6 to ≤8 mA while retaining row-open state or entering full standby.

Applications

Industrial PLC Memory Buffer	Medical Imaging Frame Store
Use Scenario: Real-time deterministic control logic in programmable logic controllers requiring guaranteed memory access under -40°C to +95°C ambient conditions. IC Role / Device Role / Timing Role: Primary working memory buffer interfacing to ARM Cortex-M7 or RISC-V SoC via 16-bit DDR2 bus with posted CAS and AL=1 optimization. Use Value: Industrial temperature rating and JEDEC-validated tRCD/tRP = 11.25 ns ensure deterministic timing closure in safety-critical scan-cycle execution.	Use Scenario: High-bandwidth frame buffering in portable ultrasound or digital X-ray systems where compact PCB area and low-power idle states are mandatory. IC Role / Device Role / Timing Role: Dual-channel frame store feeding FPGA-based image processing pipelines with burst-8 reads and write-data masking for partial updates. Use Value: On-die termination and OCD calibration eliminate external termination resistors, saving board space and reducing EMI in battery-powered medical enclosures.
Network Edge Router Packet Buffer	Automotive ADAS Video Preprocessor
Use Scenario: Line-rate packet buffering in Layer 3 enterprise switches handling 10 GbE line cards with deep packet inspection engines. IC Role / Device Role / Timing Role: Shared memory pool for ingress/egress queues, accessed concurrently by multiple traffic manager cores using bank-interleaved bursts. Use Value: Bank-interleaved read current (IDD7 ≤ 150 mA) and tRC = 51.25 ns support sustained 800+ Mbps throughput across all 8 banks without thermal throttling.	Use Scenario: Vision preprocessing pipeline in automotive surround-view systems requiring low-latency video frame storage before GPU inference. IC Role / Device Role / Timing Role: Low-jitter frame buffer synchronized to MIPI CSI-2 receiver via DDR2 controller with DLL-locked DQS alignment. Use Value: DLL-aligned DQS/DQ timing and SSTL_18 interface meet ASIL-B timing margin requirements for functional safety-critical vision data paths.

Industrial PLC Memory Buffer

Medical Imaging Frame Store

Use Scenario: Real-time deterministic control logic in programmable logic controllers requiring guaranteed memory access under -40°C to +95°C ambient conditions.

IC Role / Device Role / Timing Role: Primary working memory buffer interfacing to ARM Cortex-M7 or RISC-V SoC via 16-bit DDR2 bus with posted CAS and AL=1 optimization.

Use Value: Industrial temperature rating and JEDEC-validated tRCD/tRP = 11.25 ns ensure deterministic timing closure in safety-critical scan-cycle execution.

Use Scenario: High-bandwidth frame buffering in portable ultrasound or digital X-ray systems where compact PCB area and low-power idle states are mandatory.

IC Role / Device Role / Timing Role: Dual-channel frame store feeding FPGA-based image processing pipelines with burst-8 reads and write-data masking for partial updates.

Use Value: On-die termination and OCD calibration eliminate external termination resistors, saving board space and reducing EMI in battery-powered medical enclosures.

Network Edge Router Packet Buffer

Automotive ADAS Video Preprocessor

Use Scenario: Line-rate packet buffering in Layer 3 enterprise switches handling 10 GbE line cards with deep packet inspection engines.

IC Role / Device Role / Timing Role: Shared memory pool for ingress/egress queues, accessed concurrently by multiple traffic manager cores using bank-interleaved bursts.

Use Value: Bank-interleaved read current (IDD7 ≤ 150 mA) and tRC = 51.25 ns support sustained 800+ Mbps throughput across all 8 banks without thermal throttling.

Use Scenario: Vision preprocessing pipeline in automotive surround-view systems requiring low-latency video frame storage before GPU inference.

IC Role / Device Role / Timing Role: Low-jitter frame buffer synchronized to MIPI CSI-2 receiver via DDR2 controller with DLL-locked DQS alignment.

Use Value: DLL-aligned DQS/DQ timing and SSTL_18 interface meet ASIL-B timing margin requirements for functional safety-critical vision data paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MT47H128M16HR-37E:C	1 G-bit DDR2-800 (CL=5, tRCD/tRP=12.5 ns), 84-ball FBGA, -40°C to +95°C, Micron industrial grade.	Lower data rate and relaxed timing; requires system clock downshift from 533 MHz to 400 MHz.	Choose when DDR2-1066 bandwidth is unnecessary and cost sensitivity outweighs performance headroom.
IS42S16160F-6BLI	1 G-bit DDR2-1066 (CL=6, tRCD/tRP=11.25 ns), 60-ball TSOP-II, -40°C to +85°C commercial/industrial hybrid grade.	Limited temperature range (max 85°C case), no VDDL/VSSDL separation, no OCD calibration support.	Choose for space-constrained legacy designs where BGA assembly is unavailable but DDR2-1066 timing is required.

Compared with MT47H128M16HR-37E:C and IS42S16160F-6BLI, W971GG6NB-18I TR uniquely combines full DDR2-1066 timing compliance, industrial-grade thermal robustness up to 95°C, and OCD-enabled I/O impedance tuning - making it optimal for new industrial and medical designs demanding long-term reliability at maximum DDR2 bandwidth.

Availability

W971GG6NB-18I TR is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, network edge routers, and automotive ADAS modules requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W971GG6NB-18I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM products for industrial, automotive, and communications markets.

W971GG6NB-18I TR belongs to Winbond's industrial-grade DDR2 SDRAM product line, engineered for high-reliability applications requiring extended temperature operation, JEDEC compliance, and long-lifecycle support in mission-critical embedded systems.

FAQ

What is the maximum operating frequency supported by W971GG6NB-18I TR?

W971GG6NB-18I TR supports DDR2-1066 operation at 533 MHz clock frequency (1066 MT/s data rate), validated per JEDEC JESD79-2F with CL=6, tRCD=tRP=11.25 ns, and full AC/DC specifications over -40°C to +95°C case temperature.

Does W971GG6NB-18I TR require external termination resistors?

No. W971GG6NB-18I TR integrates programmable on-die termination (ODT) with selectable values (RZQ/4, RZQ/5, RZQ/6, RZQ/7) and supports OCD calibration to match external ZQ reference resistor (240 Ω), eliminating need for discrete termination components on the PCB.

How is refresh handled at elevated temperatures for W971GG6NB-18I TR?

At case temperatures above 85°C, W971GG6NB-18I TR doubles its auto-refresh frequency (tREFI = 3.9 µS instead of 7.8 µS) via EMR(2)[A7]=1, ensuring data retention integrity across its full -40°C to +95°C industrial operating range without firmware intervention.

What is the function of the VDDL and VSSDL pins on W971GG6NB-18I TR?

VDDL (J1) and VSSDL (J7) provide dedicated 1.8 V power and ground for the internal DLL circuitry. This isolation prevents DLL timing jitter caused by I/O switching noise, directly supporting stable 533 MHz clock alignment and DDR2-1066 timing compliance.

Can W971GG6NB-18I TR operate with single-ended DQS instead of differential DQS?

Yes. W971GG6NB-18I TR supports both differential (UDQS/UDQS, LDQS/LDQS) and single-ended DQS modes. Differential mode is enabled via EMR(1)[A10]; otherwise, single-ended DQS operation is used - simplifying layout in cost-sensitive designs while retaining DDR2-1066 capability.

W971GG6NB-18I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 84-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM - DDR2

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: SSTL_18

Clock Frequency:: 533 MHz

Write Cycle Time - Word, Page:: 15ns

Access Time:: 58.125 ns

Voltage - Supply:: 1.7V ~ 1.9V

Operating Temperature:: -40°C ~ 95°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 84-TFBGA (8x12.5)

W971GG6NB-18I TR FAQ

1.How can I place an order for W971GG6NB-18I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W971GG6NB-18I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W971GG6NB-18I TR reliable?

The price and inventory of W971GG6NB-18I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W971GG6NB-18I TR is usually 5 days.

3.What payment methods are accepted for W971GG6NB-18I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W971GG6NB-18I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W971GG6NB-18I TR?

W971GG6NB-18I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W971GG6NB-18I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W971GG6NB-18I TR?

For technical support, including W971GG6NB-18I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W971GG6NB-18I TR requirements.

6.How does Aetrix verify that W971GG6NB-18I TR is sourced from the original manufacturer or authorized distributors?

All W971GG6NB-18I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W971GG6NB-18I TR meets industry standards.

7.What is the process for return or replacement of W971GG6NB-18I TR?

All W971GG6NB-18I TR units undergo pre-shipment inspection (PSI). If there is an issue with W971GG6NB-18I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W971GG6NB-18I TR part is unused and in its original packaging.

Return procedure for W971GG6NB-18I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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