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Winbond Electronics Corporation W971GG6NB-25

Part No.:
W971GG6NB-25
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
84-TFBGA
Datasheet:
AetrixW971GG6NB-25.pdf
Description:
IC DRAM 1GBIT SSTL 18 84TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:179

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Product details

Overview

W971GG6NB-25 from Winbond is a 1G-bit DDR2 SDRAM organized as 8M × 8 banks × 16 bits, compliant with DDR2-800 (5-5-5 or 6-6-6) timing, operating at 1.8 V ± 0.1 V supply, and featuring CAS latency options of 3–7 for embedded memory subsystems in industrial control and networking equipment.

For engineers reviewing the W971GG6NB-25 datasheet, W971GG6NB-25 pinout, W971GG6NB-25 application, or W971GG6NB-25 equivalent, key selection considerations include tRCD = 12.5 ns, tRP = 12.5 ns, tRC = 52.5 ns, ODT support, and VFBGA-84 package compatibility with JEDEC DDR2-800 interface requirements.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. It integrates DLL-based DQ–DQS alignment, programmable additive latency (AL), and write latency = read latency − 1 (WL = RL − 1).

Functional operation includes auto-precharge, self-refresh, precharged/active power-down modes, OCD impedance calibration, and on-die termination (ODT) controlled via dedicated ODT pin. All commands are sampled on the crossing of CLK rising and CLK falling edges, and address/control inputs use SSTL_18 signaling.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 G-bit (8,388,608 words × 8 banks × 16 bits)
Data RateDDR2-800: 400 MHz clock → 800 Mbps transfer rate
CAS LatencyProgrammable CL = 3, 4, 5, 6, or 7; determines minimum read access delay in clock cycles
tRCD / tRP12.5 ns min - defines minimum delay between ACTIVE and READ/WRITE or PRECHARGE commands
tRC52.5 ns min - constrains minimum interval between successive ACTIVE commands to same bank
Supply VoltageVDD = VDDQ = VDDL = 1.8 V ± 0.1 V - strict rail tolerance required for signal integrity and timing compliance
Operating Temp0°C ≤ TCASE ≤ 85°C - commercial-grade thermal envelope per speed grade -25
Refresh Interval7.8 μs max at 0–85°C - dictates refresh controller timing budget for DRAM maintenance

Pinout & Package

VFBGA-84 package (8 mm × 12.5 mm, 1.0 mm height), RoHS-compliant, lead-free, window-type BGA with 0.8 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A12Address InputRow/column address bus; A10 controls auto-precharge enable during READ/WRITE
BA0–BA2Bank Select3-bit field selecting one of eight internal banks for command targeting
DQ0–DQ15Data I/O16-bit bidirectional data bus; requires matched trace lengths and proper termination
UDQS / LDQSDifferential Data StrobeUpper/lower byte source-synchronous strobes; edge-aligned on reads, center-aligned on writes
CLK / CLKDifferential Clock InputTiming reference for all command/address latching; sampling occurs at crossing points
CKEClock EnableAsynchronous gate controlling internal clock tree activation/deactivation
CS, RAS, CAS, WECommand ControlEncoded command bus; CS enables rank-level command decoding
ODTOn-Die Termination ControlActive-HIGH signal enabling internal termination resistors on DQ/DQS lines
VREFInput Reference VoltageMid-supply reference (VDDQ/2 ± 300 mV) for SSTL_18 input threshold setting
VDD / VDDQ / VDDLPower SuppliesVDD/VDDL = core/DLL supply; VDDQ = I/O supply - must be independently decoupled
VSS / VSSQ / VSSDLGND PlanesVSS = core ground; VSSQ = I/O ground (isolated); VSSDL = DLL ground - separation reduces noise coupling

Key Features

FeatureDesign Value
Double Data Rate ArchitectureTwo transfers per clock cycle doubles effective bandwidth without increasing clock frequency
Programmable Additive Latency (AL)AL = 0–2 allows pipelining of CAS commands ahead of row activation, improving command bus efficiency
Off-Chip Driver (OCD) CalibrationAdjusts output driver impedance to match PCB trace Z₀, reducing reflections and timing skew
On-Die Termination (ODT)Configurable termination on DQ/DQS lines eliminates need for external resistors and saves board space
Auto-Precharge SupportAutomatic bank precharge after burst access simplifies controller logic and reduces command overhead
Self-Refresh ModeAutonomous refresh during CKE-low state maintains data retention with <8 mA current at ≤85°C

Applications

Industrial PLC Memory BufferNetwork Switch Packet Buffer

Use Scenario: Real-time I/O scanning and ladder logic execution in programmable logic controllers requiring deterministic memory access.

IC Role / Device Role / Timing Role: Primary working memory storing program code, data tables, and process variables with guaranteed tRCD/tRP ≤ 12.5 ns timing.

Use Value: DDR2-800 bandwidth supports >600 MB/s sustained throughput for multi-axis motion control buffering and high-speed analog acquisition.

Use Scenario: Temporary storage of Ethernet frames in Layer 2/L3 switching ASICs before forwarding or classification.

IC Role / Device Role / Timing Role: Shared packet buffer interfacing directly to switch fabric controller via 16-bit DDR2 bus with posted CAS and AL optimization.

Use Value: ODT and OCD calibration ensure signal integrity across 10+ inch traces at 400 MHz, minimizing bit errors in 1 Gbps+ backplane links.

Medical Imaging Display ControllerVideo Surveillance DVR Frame Store

Use Scenario: Frame buffering for real-time rendering of ultrasound or MRI scan data on high-resolution clinical displays.

IC Role / Device Role / Timing Role: Dual-port-capable memory subsystem supporting simultaneous read (display engine) and write (acquisition engine) bursts with auto-precharge.

Use Value: Burst length 8 and CL=5 configuration delivers 3.2 GB/s peak bandwidth needed for 4K@60Hz RGB pixel streaming.

Use Scenario: Concurrent recording of multiple HD video streams (1080p@30fps) with motion detection and compression offload.

IC Role / Device Role / Timing Role: High-reliability frame store operating continuously at 85°C ambient, leveraging self-refresh and extended temperature qualification.

Use Value: 85°C-rated operation ensures stable frame buffering in sealed enclosures without active cooling, reducing system BOM cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT47H128M16HR-25ESame density (1G-bit), same VFBGA-84, but Micron part uses different EMR layout and has tRCD = 12.5 ns identical; requires separate initialization flow.Validated in telecom baseband designs; slightly higher IDD1 (68 mA vs. 65 mA) affects thermal design margin.Select when existing Micron-based reference designs require drop-in validation with minimal register reconfiguration.
IS43TR16128B-25BLI1G-bit DDR2-800 in VFBGA-84; supports identical CL/tRCD/tRP specs but adds partial array self-refresh and different OCD calibration sequence.Used in automotive infotainment head units; qualified to AEC-Q200 Grade 3 (-40°C to 105°C), exceeding W971GG6NB-25's 85°C limit.Choose for extended temperature environments where industrial-grade reliability is insufficient.

Compared with MT47H128M16HR-25E and IS43TR16128B-25BLI, the W971GG6NB-25 offers identical DDR2-800 timing and pinout but lower cost and simpler initialization, making it optimal for cost-sensitive industrial applications within its 0–85°C envelope.

Availability

W971GG6NB-25 is available at Aetrix Electronics and suitable for industrial PLCs, network switches, medical imaging systems, and video surveillance DVRs requiring stable component supply and long-term manufacturing continuity.

Supply support for W971GG6NB-25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, communications, and consumer markets.

The W971GG6NB series belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-effective, high-reliability embedded systems requiring JEDEC-compliant DDR2-667/800/1066 performance in compact VFBGA packages.

FAQ

What is the maximum clock frequency supported by the W971GG6NB-25?

The W971GG6NB-25 supports DDR2-800 operation, meaning a 400 MHz input clock frequency with double-data-rate transfers yielding 800 Mbps per data line. Its AC specifications are validated up to tCK(min) = 2.5 ns (400 MHz) for CL = 5–7 and tCK(min) = 3.75 ns (266 MHz) for CL = 4, with full JEDEC compliance across the commercial temperature range.

Does the W971GG6NB-25 support on-die termination (ODT)?

Yes, the W971GG6NB-25 supports ODT via a dedicated ODT pin (Ball K9). When driven HIGH, it enables internal termination resistors on DQ and DQS lines, configurable through EMR(1) settings. This eliminates the need for external termination resistors and improves signal integrity in point-to-point or stub-bus topologies.

What package type and ball count does the W971GG6NB-25 use?

The W971GG6NB-25 uses a VFBGA-84 package: 8 mm × 12.5 mm footprint, 1.0 mm thickness, 0.8 mm ball pitch, RoHS-compliant and lead-free. Ball mapping follows JEDEC MO-270AB standard, with dedicated VSSQ, VDDQ, and isolated VSSDL planes for noise reduction.

How is the W971GG6NB-25 initialized after power-up?

Initialization of the W971GG6NB-25 requires a strict 13-step sequence: stable power ramp, 200 µs clock stabilization, CKE assertion, PRECHARGE ALL, three EMRS commands (EMR2, EMR3, EMR1 for DLL enable), MRS for DLL reset, second PRECHARGE ALL, ≥2 AUTO REFRESH, final MRS, and OCD calibration ≥200 clocks after DLL reset - all documented in Section 8.1 of the datasheet.

Can the W971GG6NB-25 operate in self-refresh mode, and what is its current draw?

Yes, the W971GG6NB-25 supports self-refresh mode activated via CKE LOW and specific EMR(2) configuration. At TCASE ≤ 85°C, its maximum IDD6 current is 8 mA - critical for low-power standby in battery-backed or fanless industrial systems where memory data retention must persist without host intervention.

W971GG6NB-25 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
84-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
1Gbit
Memory Organization:
64M x 16
Memory Interface:
SSTL_18
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
57.5 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-TFBGA (8x12.5)

W971GG6NB-25 FAQ

1.How can I place an order for W971GG6NB-25 through Aetrix?

Please submit a Request for Quotation (RFQ) for W971GG6NB-25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W971GG6NB-25 reliable?

The price and inventory of W971GG6NB-25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W971GG6NB-25 is usually 5 days.

3.What payment methods are accepted for W971GG6NB-25?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W971GG6NB-25 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W971GG6NB-25?

W971GG6NB-25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W971GG6NB-25 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W971GG6NB-25?

For technical support, including W971GG6NB-25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W971GG6NB-25 requirements.

6.How does Aetrix verify that W971GG6NB-25 is sourced from the original manufacturer or authorized distributors?

All W971GG6NB-25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W971GG6NB-25 meets industry standards.

7.What is the process for return or replacement of W971GG6NB-25?

All W971GG6NB-25 units undergo pre-shipment inspection (PSI). If there is an issue with W971GG6NB-25, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W971GG6NB-25 part is unused and in its original packaging.

Return procedure for W971GG6NB-25:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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