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Winbond Electronics Corporation W971GG6NB25I TR
- Part No.:
- W971GG6NB25I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W971GG6NB25I TR.pdf
- Description:
- IC DRAM 1GBIT SSTL 18 84TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,263
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Product details
Overview
W971GG6NB25I TR from Winbond is a 1G-bit DDR2 SDRAM organized as 8M × 8 banks × 16 bits, supporting DDR2-800 (5-5-5 or 6-6-6) operation at 1.8 V with CAS Latency 3–6, tRCD/tRP = 12.5 ns minimum, and industrial temperature range −40°C to +95°C. It implements on-die termination (ODT), OCD impedance adjustment, and auto-precharge for embedded control and networking memory subsystems.
For engineers reviewing the W971GG6NB25I TR datasheet, W971GG6NB25I TR pinout, W971GG6NB25I TR application, or W971GG6NB25I TR equivalent, key selection criteria include DDR2-800 timing compliance, VDD/VDDQ = 1.8 V ±0.1 V operation, 84-ball VFBGA package compatibility, and industrial-grade thermal reliability across −40°C to +95°C.
Technical Context
This DDR2 SDRAM uses differential clock inputs (CLK/CLK) and source-synchronous DQS/DQS strobes with edge-aligned read and center-aligned write data. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable high-speed transfers up to 800 Mbps per pin.
The device supports programmable additive latency (AL = 0–2), posted CAS, bi-directional DM masking, and dual ODT modes (active/standby). Internal refresh counters and EMR-controlled self-refresh entry at elevated temperatures ensure data retention without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (8,388,608 words × 8 banks × 16 bits) |
| Data Rate | DDR2-800: 400 MHz clock → 800 Mbps per DQ |
| CAS Latency | CL = 3, 4, 5, or 6 - determines minimum read access delay in clock cycles |
| tRCD / tRP | 12.5 ns min - defines minimum interval between ACTIVE and READ/WRITE or PRECHARGE commands |
| Operating Voltage | VDD = VDDQ = 1.8 V ± 0.1 V - strict supply tolerance required for signal integrity and timing margin |
| Temperature Range | −40°C ≤ TCASE ≤ +95°C - qualified for industrial environments with doubled refresh at high temp |
| Burst Length | 4 or 8 - configurable burst size for optimized bus efficiency and prefetch alignment |
| Interface Standard | SSTL_18 - ensures compatible signaling with DDR2 controllers and termination networks |
Pinout & Package
Packaged in 84-ball VFBGA (8 mm × 12.5 mm, 1.0 mm height), RoHS-compliant, lead-free window-type BGA.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row/column address bus; A10 controls auto-precharge on read/write |
| BA0–BA2 | Bank Select | 3-bit bank address for concurrent bank activation and interleaving |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with SSTL_18 signaling and DM masking |
| UDQS / LDQS | Differential Data Strobe | Upper/lower byte strobes; edge-aligned on read, center-aligned on write |
| CLK / CLK | Differential Clock | Primary timing reference; all commands latched at crossing of CLK rising and CLK falling |
| CKE | Clock Enable | Asynchronous enable/disable of internal clock circuitry; controls power-down entry/exit |
| CS, RAS, CAS, WE | Command Inputs | Encoded command bus; CS enables rank-level command decoding |
| ODT | On-Die Termination Control | Dynamic enable of internal termination resistors during reads/writes to reduce stub reflections |
| VREF | Input Reference Voltage | Reference for all address/control inputs; must track VDDQ/2 ±300 mV |
| VDD / VDDQ / VDDL | Power Supplies | VDD (core), VDDQ (I/O), VDDL (DLL) each regulated at 1.8 V ±0.1 V |
| VSS / VSSQ / VSSDL | GND Planes | Separate ground domains for core, I/O, and DLL to minimize noise coupling |
| UDM / LDM | Data Mask Inputs | Per-byte write mask sampled on both DQS edges; masks corresponding DQ0–7 or DQ8–15 |
Key Features
| Feature | Design Value |
|---|---|
| On-Die Termination (ODT) | Programmable termination resistance reduces signal reflections on high-speed DQ/DQS lines without external resistors |
| Off-Chip Driver (OCD) Calibration | Runtime impedance tuning of output drivers to match PCB trace impedance and maintain signal fidelity |
| Auto-Precharge | Automatic bank precharge after burst read/write eliminates explicit PRECHARGE command overhead |
| Self-Refresh Mode | Internal refresh execution at ≥85°C with doubled frequency (tREFI = 3.9 µs) preserves data without host intervention |
| Posted CAS with AL | Additive latency decouples command bus utilization from data availability, improving controller pipeline efficiency |
| Differential Clock & Strobe | CLK/CLK and UDQS/LDQS differential pairs reject common-mode noise and enable precise timing alignment |
Applications
| Industrial PLC Memory Buffer | Network Switch Packet Buffer |
|---|---|
Use Scenario: Real-time I/O scanning and logic execution in programmable logic controllers requiring deterministic memory access. IC Role / Device Role / Timing Role: Main working memory for firmware execution and process data storage with guaranteed −40°C to +95°C operation. Use Value: Stable DDR2-800 bandwidth and industrial temperature rating eliminate thermal derating and support fanless enclosure designs. | Use Scenario: Temporary storage of Ethernet frames in Layer 2/Layer 3 switching ASICs before forwarding decisions. IC Role / Device Role / Timing Role: High-throughput packet buffer interfaced to switch fabric controllers via SSTL_18 DDR2 interface. Use Value: 16-bit bus width and auto-precharge reduce command overhead, increasing effective throughput for bursty traffic patterns. |
| Medical Imaging Control Subsystem | Automotive ADAS Camera Interface |
Use Scenario: Frame buffering and configuration storage in ultrasound or X-ray control modules where EMI resilience is critical. IC Role / Device Role / Timing Role: Dual-rail DDR2 memory with isolated VSSQ/VSSDL grounds and ODT for clean signal integrity in mixed-signal environments. Use Value: Differential clock/strobe and OCD calibration maintain timing margins despite board-level noise from analog front-ends. | Use Scenario: Image data staging between MIPI CSI-2 receivers and vision processors in surround-view camera systems. IC Role / Device Role / Timing Role: Low-latency, temperature-hardened memory for real-time image preprocessing pipelines. Use Value: −40°C to +95°C qualification and self-refresh at high ambient enable reliable operation inside vehicle cabins and engine bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H128M16RT-25E IT:C | 1 G-bit DDR2-800 in 84-ball FBGA; CL=5, tRCD/tRP=12.5 ns; same VDD/VDDQ=1.8 V; JEDEC-compliant but no OCD calibration | Requires external termination; lacks runtime driver impedance tuning; identical industrial temp range (−40°C to +95°C) | Select when OCD is not required and legacy Micron footprint compatibility is prioritized |
| IS42S16160F-25BLI | 1 G-bit DDR2-800 in 84-ball FBGA; CL=5, tRCD/tRP=12.5 ns; VDD/VDDQ=1.8 V; includes ODT but no OCD or DLL disable | No DLL disable mode; fixed drive strength; same industrial temperature grade and pinout | Choose when simplified initialization sequence is preferred and DLL disable is unnecessary |
Compared with MT47H128M16RT-25E IT:C and IS42S16160F-25BLI, the W971GG6NB25I TR provides unique OCD calibration for dynamic output impedance matching and full DLL control - critical for marginal PCB layouts - while maintaining identical DDR2-800 timing, industrial temperature range, and 84-ball VFBGA compatibility.
Availability
W971GG6NB25I TR is available at Aetrix Electronics and suitable for industrial PLCs, network switches, medical imaging subsystems, and automotive ADAS camera interfaces requiring stable component supply across extended temperature ranges.
Supply support for W971GG6NB25I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs for industrial, communications, and consumer markets.
The W971GG6NB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for embedded systems demanding robust operation from −40°C to +105°C with JEDEC-compliant timing and advanced signal integrity features.
FAQ
What is the maximum data rate supported by the W971GG6NB25I TR?
The W971GG6NB25I TR supports DDR2-800 operation, delivering an effective data rate of 800 Mbps per data line. This corresponds to a 400 MHz differential clock frequency with double-data-rate transfers on both clock edges. The device meets JEDEC specification for DDR2-800 (5-5-5 or 6-6-6) timing under industrial temperature conditions.
Does the W971GG6NB25I TR support on-die termination (ODT)?
Yes, the W971GG6NB25I TR supports programmable on-die termination (ODT) controlled via the ODT pin and extended mode registers. ODT can be enabled during read or write operations to suppress signal reflections on DQ/DQS lines, eliminating the need for external termination resistors and improving signal integrity in point-to-point or multi-drop DDR2 topologies.
What is the operating temperature range for the W971GG6NB25I TR?
The W971GG6NB25I TR is rated for industrial operation from −40°C to +95°C case temperature. At temperatures above 85°C, it automatically doubles its refresh frequency (tREFI = 3.9 µs) and supports self-refresh entry via EMR(2) configuration, ensuring data retention without host intervention across the full specified range.
How does the OCD calibration feature work in the W971GG6NB25I TR?
The W971GG6NB25I TR implements off-chip driver (OCD) impedance adjustment through an EMR(1)-controlled calibration sequence. During initialization, the device compares its output driver impedance against an external reference resistor and adjusts internal drive strength to match target values - compensating for process/voltage/temperature variation and maintaining consistent signal edge rates and voltage levels.
Is the W971GG6NB25I TR pin-compatible with other DDR2 SDRAMs in 84-ball VFBGA packages?
The W971GG6NB25I TR uses a standard 84-ball VFBGA footprint (8 mm × 12.5 mm) with JEDEC-aligned ball assignment for address, data, control, and power pins. While mechanical pinout matches common DDR2 SDRAMs like MT47H128M16RT-25E and IS42S16160F-25BLI, functional compatibility requires verification of timing parameters, ODT behavior, and initialization sequence - especially for OCD and DLL control features unique to Winbond.
W971GG6NB25I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- SSTL_18
- Clock Frequency:
- 800 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 57.5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-TFBGA (8x12.5)
W971GG6NB25I TR FAQ
1.How can I place an order for W971GG6NB25I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W971GG6NB25I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W971GG6NB25I TR reliable?
The price and inventory of W971GG6NB25I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W971GG6NB25I TR is usually 5 days.
3.What payment methods are accepted for W971GG6NB25I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W971GG6NB25I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W971GG6NB25I TR?
W971GG6NB25I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W971GG6NB25I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W971GG6NB25I TR?
For technical support, including W971GG6NB25I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W971GG6NB25I TR requirements.
6.How does Aetrix verify that W971GG6NB25I TR is sourced from the original manufacturer or authorized distributors?
All W971GG6NB25I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W971GG6NB25I TR meets industry standards.
7.What is the process for return or replacement of W971GG6NB25I TR?
All W971GG6NB25I TR units undergo pre-shipment inspection (PSI). If there is an issue with W971GG6NB25I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W971GG6NB25I TR part is unused and in its original packaging.
Return procedure for W971GG6NB25I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W971GG6NB25I TR Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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