Winbond Electronics Corporation W971GG6SB25I TR

Overview

W971GG6SB25I TR from Winbond is a 1G-bit DDR2 SDRAM organized as 8M × 8 banks × 16-bit, supporting DDR2-800 (5-5-5 or 6-6-6) operation at 400 MHz clock frequency with CL=5/6, tRCD/tRP = 12.5 ns, and industrial temperature range (−40°C to +95°C). It delivers 1.6 Gb/s per pin in systems requiring high-bandwidth memory for embedded controllers, network processors, and industrial HMIs.

For engineers reviewing the W971GG6SB25I TR datasheet, W971GG6SB25I TR pinout, W971GG6SB25I TR application, or W971GG6SB25I TR equivalent, key selection factors include its SSTL_18 interface compliance, on-die termination (ODT), OCD impedance calibration, differential DQS strobes, and support for posted CAS with AL=0–2 - all critical for signal integrity and timing margin in dense PCB layouts.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ transitions to clock edges, enabling stable 400 MHz operation under industrial thermal stress.

The device supports programmable burst lengths (4/8), additive latency (AL=0–2), write latency = RL−1, and dual ODT modes (dynamic and static). Internal refresh control, auto-precharge, and power-down states (precharged/active) are managed via EMR(2)/EMR(3) and CKE gating - essential for low-power embedded runtime and thermal management.

Key Specifications

Pinout & Package

W971GG6SB25I TR uses an 84-ball WBGA package (8 mm × 12.5 mm, 0.8 mm pitch) with separate VDD/VDDQ/VDDL and VSS/VSSQ/VSSDL domains for noise isolation. Ball layout follows JEDEC-standard DDR2 SDRAM pinout with dedicated differential clocks (CLK/CLK), command/address (CS/RAS/CAS/WE/BA0–BA2/A0–A12), data (DQ0–DQ15), strobes (UDQS/UDQS/LDQS/LDQS), and control (ODT/CKE/DM/VREF).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Compared with MT47H128M8HQ-25E IT:J and IS42S16160F-25BLI, W971GG6SB25I TR uniquely combines industrial-grade thermal validation (−40°C to +95°C), dedicated VDDL supply for DLL stability, and OCD calibration - making it the only option for high-reliability embedded systems demanding consistent timing margins across full temperature range.

Availability

W971GG6SB25I TR is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical imaging controllers, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W971GG6SB25I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

W971GG6SB25I TR belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded applications requiring JEDEC-compliant performance with enhanced signal integrity features like OCD and ODT.

FAQ

What is the maximum operating frequency supported by W971GG6SB25I TR?

W971GG6SB25I TR supports DDR2-800 operation at 400 MHz clock frequency (800 Mb/s per pin), validated for both 5-5-5 and 6-6-6 timing bins across −40°C to +95°C. Its tCK(avg) minimum is 2.5 ns at CL=5 and 3.75 ns at CL=4, ensuring reliable setup/hold margins in high-speed designs using SSTL_18 signaling.

Does W971GG6SB25I TR require external termination resistors?

No, W971GG6SB25I TR integrates on-die termination (ODT) with selectable 75 Ω or 150 Ω resistance values controlled via the ODT pin and EMR settings. This eliminates the need for external parallel termination resistors on DQ/DQS lines, reducing PCB area and improving signal integrity in point-to-point or fly-by topologies.

How does the OCD calibration feature improve signal integrity in W971GG6SB25I TR?

W971GG6SB25I TR's Off-Chip Driver (OCD) calibration adjusts output driver impedance dynamically using EMR(1) commands, compensating for process/voltage/temperature variations. This maintains consistent 40 Ω DQ output impedance, minimizing reflection-induced jitter and eye closure - especially critical for clean 400 MHz data eyes in dense routing environments.

What is the purpose of the VDDL supply pin on W971GG6SB25I TR?

VDDL powers the internal DLL (Delay-Locked Loop) circuitry independently from VDD and VDDQ. This isolation prevents DLL phase error caused by core or I/O supply noise, ensuring precise DQ–DQS alignment across temperature and load - a key requirement for stable DDR2-800 operation in electrically noisy industrial systems.

Can W971GG6SB25I TR operate reliably at 95°C case temperature?

Yes, W971GG6SB25I TR is fully specified for −40°C ≤ TCASE ≤ 95°C, including all AC/DC parameters. At 85–95°C, it requires doubled refresh rate (tREFI = 3.9 µS) and entry into Self Refresh mode via EMR(2) bit A7, both supported in hardware. IDD6 remains ≤ 8 mA, confirming thermal design viability.