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Winbond Electronics Corporation W971GG8NB-18I

Part No.:
W971GG8NB-18I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-VFBGA
Datasheet:
AetrixW971GG8NB-18I.pdf
Description:
IC DRAM 1GBIT SSTL 18 60VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,939

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Product details

Overview

W971GG8NB-18I from Winbond Electronics is a 1G-bit DDR2 SDRAM organized as 16M × 8 banks × 8 bits, supporting DDR2-1066 (6-6-6) operation at 533 MHz clock frequency with CAS Latency 6, tRCD/tRP = 11.25 ns, and industrial temperature range −40°C to +95°C. It serves as main system memory in embedded controllers, network processors, and industrial HMIs requiring high-bandwidth, low-power synchronous DRAM with on-die termination and OCD impedance tuning.

For engineers reviewing the W971GG8NB-18I datasheet, W971GG8NB-18I pinout, W971GG8NB-18I application, or W971GG8NB-18I equivalent, key selection criteria include DDR2-1066 timing compliance, 60-ball WBGA package compatibility, SSTL_18 interface voltage tolerance, ODT programmability, and industrial-grade thermal reliability across −40°C to +95°C ambient operation.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 1066 Mbps data transfer under JEDEC-compliant AC timing.

The device supports programmable additive latency (AL = 0–2), burst lengths of 4 or 8, and on-die termination (ODT) controlled via dedicated ODT pin and EMR(1) configuration. OCD calibration adjusts off-chip driver impedance for signal integrity, while auto-precharge and self-refresh modes reduce controller overhead and power consumption in idle states.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 G-bit (16,777,216 words × 8 banks × 8 bits)
Data Rate1066 Mbps (DDR2-1066, 533 MHz clock)
CAS LatencyCL = 6 (tAA = 11.25 ns at 533 MHz)
tRCD / tRP11.25 ns minimum - defines shortest row activation and precharge intervals
Supply VoltageVDD/VDDQ/VDDL = 1.8 V ± 0.1 V - requires tight regulation for SSTL_18 I/O compliance
Operating Temp−40°C ≤ TCASE ≤ +95°C - qualified for extended industrial environments
Package60-ball WBGA (8 mm × 9.5 mm, 1.0 mm height, RoHS-compliant lead-free)
Interface StandardSSTL_18 - mandates 1.8 V reference and controlled-impedance PCB routing

Pinout & Package

W971GG8NB-18I is packaged in a 60-ball Window BGA (WBGA) with 0.8 mm ball pitch, 8 mm × 9.5 mm footprint, and 1.0 mm thickness. The package uses lead-free materials and complies with RoHS Directive 2011/65/EU.

Pin/TerminalCircuit RoleDesign Meaning
A0–A13Address InputsRow/column address bus; A10 controls auto-precharge enable during read/write commands
BA0–BA2Bank Select3-bit bank address for concurrent access across 8 internal banks
DQ0–DQ7Data I/O8-bit bidirectional data bus; matched loading with DQS/DM for source-synchronous timing
DQS / DQSDifferential Data StrobeSource-synchronous strobe for read/write; edge-aligned on reads, center-aligned on writes
ODTOn-Die Termination ControlActive-HIGH signal enabling internal termination resistors to suppress reflections on DQ/DQS lines
CS, RAS, CAS, WECommand InputsDecode active, read, write, precharge, refresh, and deselect operations on rising CLK edge
CLK / CLKDifferential Clock InputEdge-triggered command latching and DLL reference; all inputs sampled at crossing points
CKEClock EnableGate for internal clock distribution; LOW disables DLL and enters power-down states
DM/RDQSData Mask / Read StrobeWrite mask input sampled on both DQS edges; RDQS function enabled only when EMR(1)[A11] = 1
VDD / VDDQ / VDDLPower SuppliesVDD (core), VDDQ (I/O), VDDL (DLL) each require independent 1.8 V ± 0.1 V regulation
VSS / VSSQ / VSSDLGND PlanesSeparate ground returns for core, I/O, and DLL domains to minimize noise coupling
VREFInput ReferenceStable 0.9 V reference for SSTL_18 input threshold; must track VDDQ/2 within ±300 mV

Key Features

FeatureDesign Value
Programmable CAS LatencyCL = 3–7 selectable via MRS - enables optimization for latency vs. bandwidth trade-offs in real-time systems
On-Die Termination (ODT)Configurable pull-up/pull-down resistance per DQ/DQS - eliminates external termination components and improves signal integrity
OCD Impedance CalibrationSelf-calibrating off-chip driver matching - reduces output skew and ensures consistent drive strength across voltage/temperature
Auto-PrechargeBuilt-in precharge after burst read/write - simplifies controller logic and reduces command overhead
Self-Refresh ModeAutonomous refresh at IDD6 ≤ 8 mA - maintains data retention during CPU sleep without external refresh commands
Industrial Temperature Range−40°C to +95°C case temperature - validated for continuous operation in harsh industrial and transportation environments

Applications

Industrial HMI SystemsNetwork Edge Routers

Use Scenario: Touch-enabled operator panels in factory automation requiring responsive GUI rendering and real-time process data display.

IC Role / Device Role / Timing Role: Primary system memory buffering video frame buffers, UI assets, and control state tables with DDR2-1066 bandwidth.

Use Value: CL=6 and tRCD=11.25 ns enable sub-25 ns average read latency, supporting 60 Hz UI updates with minimal stutter under multi-tasking loads.

Use Scenario: Packet buffering and forwarding tables in Layer 3 enterprise switches operating in temperature-controlled telecom cabinets.

IC Role / Device Role / Timing Role: High-throughput packet buffer memory interfaced to MIPS-based network processors via 8-bit DDR2 bus.

Use Value: ODT and OCD calibration maintain signal integrity at 533 MHz across 8-layer PCB backplanes, reducing bit error rates below 1e−12.

Medical Imaging ControllersRailway Signaling Units

Use Scenario: Real-time image reconstruction engines in portable ultrasound devices where compact size and thermal management are critical.

IC Role / Device Role / Timing Role: Frame store memory for FPGA-accelerated beamforming, accepting parallel 8-bit pixel streams at 1066 Mbps.

Use Value: Self-refresh current ≤ 8 mA allows >4-hour battery-backed operation during standby without data loss.

Use Scenario: Safety-critical train control logic units deployed in railcar underfloor enclosures exposed to wide ambient swings.

IC Role / Device Role / Timing Role: Firmware and runtime variable storage for SIL-3 certified microcontrollers executing cyclic redundancy checks.

Use Value: −40°C to +95°C qualification and 60-ball WBGA mechanical robustness ensure reliable operation through vibration and thermal cycling per EN 50121-3-2.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT47H128M8HQ-37E1 G-bit DDR2-800 (CL=5, tRCD=12.5 ns); 60-ball FBGA; same VDD/VDDQ but no OCD calibrationLimited to 400 MHz max; lacks dynamic impedance tuning - requires tighter layout control for signal integritySelect when DDR2-800 bandwidth suffices and cost sensitivity outweighs need for DDR2-1066 headroom
IS42S16160F-6BLI256M × 16-bit configuration (2 G-bit total); DDR2-667 (CL=5); 84-ball FBGA; no ODT pin, ODT controlled via EMR onlyWider 16-bit bus increases throughput but demands more PCB layers; lacks dedicated ODT pin for fast mode switchingChoose for higher aggregate bandwidth in space-tolerant designs where 16-bit interface simplifies controller integration

Compared with MT47H128M8HQ-37E and IS42S16160F-6BLI, W971GG8NB-18I delivers higher bandwidth (1066 Mbps vs. 800/667 Mbps), dedicated ODT pin control for dynamic termination, and OCD calibration - making it optimal for thermally constrained, high-reliability DDR2-1066 designs where signal integrity and industrial temperature margin are critical.

Availability

W971GG8NB-18I is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical imaging controllers, and railway signaling units requiring stable component supply with guaranteed long-term availability and full traceability.

Supply support for W971GG8NB-18I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W971GG8NB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for applications demanding extended temperature operation, JEDEC-compliant timing stability, and robust signal integrity features like ODT and OCD calibration.

FAQ

What is the maximum data rate supported by the W971GG8NB-18I?

The W971GG8NB-18I supports a maximum data rate of 1066 Mbps (DDR2-1066), achieved with a 533 MHz differential clock frequency and CL=6 timing (tCK = 1.875 ns). This rating is guaranteed across the full industrial temperature range of −40°C to +95°C, as verified in the December 2020 datasheet revision A02.

Does the W971GG8NB-18I require external termination resistors?

No, the W971GG8NB-18I integrates programmable On-Die Termination (ODT) controlled via the dedicated ODT pin and EMR(1) register settings. When enabled, internal termination resistors eliminate the need for external resistors on DQ and DQS lines, simplifying PCB layout and improving signal integrity at 533 MHz.

How does OCD calibration improve signal integrity in the W971GG8NB-18I?

OCD calibration in the W971GG8NB-18I dynamically adjusts the output driver impedance of DQ/DQS pins to match the PCB trace impedance. This reduces signal reflections and skew across voltage and temperature variations, ensuring stable setup/hold margins - especially critical for reliable 1066 Mbps operation in dense industrial PCBs.

What is the purpose of the VREF pin on the W971GG8NB-18I?

The VREF pin on the W971GG8NB-18I provides the reference voltage (target 0.9 V) for SSTL_18 input receivers. It must be stabilized to VDDQ/2 ±300 mV and remain valid before CKE activation. Accurate VREF ensures correct logic-level sampling of address, command, and control signals under varying noise and supply conditions.

Can the W971GG8NB-18I operate in self-refresh mode at +95°C?

Yes, the W971GG8NB-18I supports self-refresh mode across its full industrial temperature range, including +95°C case temperature. At this temperature, the device doubles the auto-refresh frequency (tREFI = 3.9 µS) via EMR(2) configuration (A7 = 1), maintaining data retention with IDD6 ≤ 8 mA - confirmed in the December 2020 datasheet section 4 and note 4.

W971GG8NB-18I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SSTL_18
Clock Frequency:
533 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
58.125 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 95°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-VFBGA (8x9.5)

W971GG8NB-18I FAQ

1.How can I place an order for W971GG8NB-18I through Aetrix?

Please submit a Request for Quotation (RFQ) for W971GG8NB-18I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W971GG8NB-18I reliable?

The price and inventory of W971GG8NB-18I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W971GG8NB-18I is usually 5 days.

3.What payment methods are accepted for W971GG8NB-18I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W971GG8NB-18I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W971GG8NB-18I?

W971GG8NB-18I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W971GG8NB-18I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W971GG8NB-18I?

For technical support, including W971GG8NB-18I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W971GG8NB-18I requirements.

6.How does Aetrix verify that W971GG8NB-18I is sourced from the original manufacturer or authorized distributors?

All W971GG8NB-18I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W971GG8NB-18I meets industry standards.

7.What is the process for return or replacement of W971GG8NB-18I?

All W971GG8NB-18I units undergo pre-shipment inspection (PSI). If there is an issue with W971GG8NB-18I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W971GG8NB-18I part is unused and in its original packaging.

Return procedure for W971GG8NB-18I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W971GG8NB-18I Tags

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