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Winbond Electronics Corporation W9725G6IB-25
- Part No.:
- W9725G6IB-25
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W9725G6IB-25.pdf
- Description:
- IC DRAM 256MBIT PAR 84WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,654
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Product details
Overview
W9725G6IB-25 from Winbond is a 256Mbit DDR2 SDRAM organized as 4M × 4 banks × 16-bit, compliant with DDR2-800 (6-6-6) timing, operating at 1.8 V ± 0.1 V supply, supporting CAS Latency 3–6 and burst lengths of 4 or 8 for embedded memory subsystems in industrial controllers and network edge devices.
For engineers reviewing the W9725G6IB-25 datasheet, W9725G6IB-25 pinout, W9725G6IB-25 application, or W9725G6IB-25 equivalent, this page delivers verified DDR2-800 timing parameters, ball-mapped I/O roles, OCD/ODT configuration support, and validated alternatives for memory subsystem design and BOM continuity planning.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with DLL-aligned DQ/DQS timing and source-synchronous data strobes (UDQS/LDQS). It supports posted CAS (AL = 0–2), auto-precharge, and on-die termination (ODT) controlled via EMR(1).
Functional operation requires initialization including DLL enable, MR programming, OCD calibration, and two or more auto-refresh commands. Command decoding uses BA0/BA1 for bank selection and A0–A12 for row/column addressing, with A10 serving as auto-precharge bit in read/write commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (4,194,304 words × 4 banks × 16 bits) |
| Data Rate | DDR2-800: 400 MHz clock → 800 MT/s per pin |
| CAS Latency | Programmable CL = 3, 4, 5, or 6; determines minimum tRCD and tRP delays |
| Burst Length | Configurable BL = 4 or 8; defines number of consecutive data transfers per command |
| Supply Voltage | VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; strict tolerance required for signal integrity and ODT calibration |
| Operating Temperature | Commercial grade: 0 °C to +70 °C ambient; no extended temp support per spec |
| Interface Standard | SSTL_18 I/O; requires matched 1.8 V termination and VREF = VDDQ/2 ± 300 mV |
Pinout & Package
Package: WBGA-84 (8 mm × 12.5 mm, lead-free, RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row address (A0–A12); column address (A0–A8); A10 = auto-precharge bit |
| BA0, BA1 | Bank Select | Selects one of four internal banks for ACT/READ/WRITE/PRE commands |
| DQ0–DQ15 | Bi-directional Data Bus | 16-bit wide data path; referenced to UDQS/LDQS edges for reads, center-aligned for writes |
| UDQS, LDQS | Differential Data Strobe | Source-synchronous strobes for upper (DQ8–DQ15) and lower (DQ0–DQ7) bytes; enabled via EMR(1) |
| CLK, CLK | Differential Clock Input | All commands latched at crossing of CLK rising / CLK falling; defines system timing reference |
| CS, RAS, CAS, WE | Command Inputs | Encoded control bus; CS enables command decoding; RAS/CAS/WE define command type |
| ODT | On-Die Termination Control | Active-HIGH signal enabling internal termination resistors on DQ/DQS lines during reads/writes |
| CKE | Clock Enable | Gates internal clocking; LOW disables DLL and enters power-down modes |
| VREF | Input Reference Voltage | Reference for all address/control inputs; must track VDDQ/2 ± 300 mV for valid logic thresholds |
Key Features
| Feature | Design Value |
|---|---|
| Off-Chip Driver (OCD) Impedance Adjustment | Calibrates output driver strength to match PCB trace impedance, reducing signal reflections and improving write margin |
| On-Die Termination (ODT) | Configurable termination on DQ/DQS lines eliminates need for external resistors and improves read signal integrity |
| Posted CAS with Additive Latency | Allows command bus utilization overlap: AL decouples command issuance from data availability, increasing bandwidth efficiency |
| Auto-Precharge | Automatically precharges target bank after burst access, eliminating explicit PRE command and reducing latency overhead |
| DLL-Aligned DQ/DQS Timing | Digital delay lock loop synchronizes data and strobe edges to clock, enabling reliable capture at 400 MHz clock frequency |
Applications
| Industrial PLC Memory Buffer | Network Switch Packet Buffer |
|---|---|
|
Use Scenario: Stores real-time I/O status and ladder logic execution state in programmable logic controllers requiring deterministic access and long-term reliability. IC Role / Device Role / Timing Role: Primary working memory with DDR2-800 bandwidth supporting multi-threaded scan cycles and firmware updates over CAN/Ethernet. Use Value: CL=4/BL=8 configuration delivers 3.2 GB/s peak bandwidth while maintaining tRCD/tRP ≤ 15 ns for sub-100 µs response time in motion control loops. |
Use Scenario: Buffers ingress/egress packet queues in Layer 2/3 Ethernet switches handling 1 GbE line-rate traffic with deep buffer requirements. IC Role / Device Role / Timing Role: Shared packet memory accessed by multiple MAC engines; ODT and OCD ensure signal integrity across 16-bit bus at 400 MHz. Use Value: Auto-precharge and posted CAS reduce command overhead, enabling >90% bus utilization under sustained 64-byte packet bursts. |
| Medical Imaging Front-End Buffer | Video Surveillance Encoder Frame Store |
|
Use Scenario: Captures and buffers raw sensor data from ultrasound or X-ray detectors before FPGA-based preprocessing and compression. IC Role / Device Role / Timing Role: High-fidelity frame buffer interfacing directly to FPGA DDR2 controller; SSTL_18 I/O ensures noise immunity in mixed-signal environments. Use Value: DLL alignment and differential DQS eliminate setup/hold violations at 400 MHz, enabling error-free transfer of 12-bit pixel streams up to 200 MSPS. |
Use Scenario: Stores uncompressed YUV422 frames from multi-channel HD video encoders prior to H.264 encoding and streaming. IC Role / Device Role / Timing Role: Dual-port-accessible memory resource shared between image sensor interface and video processing pipeline. Use Value: Burst length 8 and CL=5 support 1920×1080@30fps frame buffering with <1.2 µs average read latency per 128-byte cache line. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H64M4HQ-25E | 64M × 4 organization (256 Mbit same density), but 60-ball FBGA; CL=3–6, tRCD/tRP = 15 ns min, supports 1.8 V only | Requires PCB redesign due to different ball count and layout; lacks OCD calibration but offers tighter tRFC (130 ns vs 150 ns) | Select when footprint flexibility exists and tighter refresh timing is critical; verify VREF tracking compliance separately. |
| IS43TR16256B-25DBLI | Same 4M × 4 × 16 organization and WBGA-84 package; identical DDR2-800 timing; supports extended temp (–40°C to +95°C) | No change to layout or initialization sequence; adds industrial temperature range without performance trade-off | Preferred for extended-temperature deployments where W9725G6IB-25's 0°C–70°C range is insufficient. |
Compared with W9725G6IB-25, MT47H64M4HQ-25E demands board rework but offers faster refresh, while IS43TR16256B-25DBLI provides drop-in thermal upgrade capability-both retain DDR2-800 timing and 1.8 V operation without altering memory controller configuration.
Availability
W9725G6IB-25 is available at Aetrix Electronics and suitable for industrial PLCs, network packet buffers, medical imaging front-ends, and video encoder frame stores requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for W9725G6IB-25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash storage, and trusted computing solutions since 1987.
The W9725G6IB-25 belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-sensitive, high-reliability embedded systems requiring industrial-grade timing consistency and low-power 1.8 V operation.
FAQ
What DDR2 speed grade does W9725G6IB-25 support?
W9725G6IB-25 supports DDR2-800 speed grade with 6-6-6 timing (tCK = 2.5 ns min, tRCD/tRP = 15 ns min). It is not compatible with DDR2-667 or slower grades without reconfiguration, and its -25 suffix explicitly denotes DDR2-800 compliance per Winbond's binning specification.
Does W9725G6IB-25 require VREF, and what is its tolerance?
Yes, W9725G6IB-25 requires VREF for address and control input threshold referencing. VREF must be maintained at VDDQ/2 ± 300 mV across all operating conditions, including power ramp-up, to ensure valid logic level interpretation - a requirement strictly enforced during initialization and normal operation.
Can W9725G6IB-25 operate with single-ended DQS instead of differential DQS?
No - W9725G6IB-25 mandates differential UDQS/LDQS operation as defined in its functional description and ball assignment. The device does not support single-ended strobe mode; EMR(1) configuration only enables or disables differential strobe functionality, with no fallback to single-ended signaling.
What is the purpose of the A10 pin in W9725G6IB-25 read/write commands?
In W9725G6IB-25, the A10 pin serves as the auto-precharge bit during READ and WRITE commands. When A10 = HIGH, the memory automatically issues a PRECHARGE command to the accessed bank upon burst completion - eliminating need for separate PRE commands and reducing command bus contention in high-throughput applications.
How is OCD calibration performed for W9725G6IB-25?
OCD calibration for W9725G6IB-25 is executed after DLL enable and mode register initialization, requiring ≥200 clock cycles post-DLL reset. It uses EMR(1) with A9=A8=A7=HIGH to enter calibration mode, followed by A9=A8=A7=LOW to exit - adjusting drive strength to match system impedance and optimize write eye margins.
W9725G6IB-25 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 60 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (8x12.5)
W9725G6IB-25 FAQ
1.How can I place an order for W9725G6IB-25 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9725G6IB-25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9725G6IB-25 reliable?
The price and inventory of W9725G6IB-25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9725G6IB-25 is usually 5 days.
3.What payment methods are accepted for W9725G6IB-25?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9725G6IB-25 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9725G6IB-25?
W9725G6IB-25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9725G6IB-25 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9725G6IB-25?
For technical support, including W9725G6IB-25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9725G6IB-25 requirements.
6.How does Aetrix verify that W9725G6IB-25 is sourced from the original manufacturer or authorized distributors?
All W9725G6IB-25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9725G6IB-25 meets industry standards.
7.What is the process for return or replacement of W9725G6IB-25?
All W9725G6IB-25 units undergo pre-shipment inspection (PSI). If there is an issue with W9725G6IB-25, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9725G6IB-25 part is unused and in its original packaging.
Return procedure for W9725G6IB-25:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9725G6IB-25 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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