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Winbond Electronics Corporation W9725G6JB25I
- Part No.:
- W9725G6JB25I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W9725G6JB25I.pdf
- Description:
- IC DRAM 256MBIT PAR 84WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,756
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Product details
Overview
W9725G6JB25I from Winbond is a 256M-bit DDR2 SDRAM organized as 4M words × 4 banks × 16 bits, operating at 1.8 V with DDR2-800 (5-5-5/6-6-6) speed grade, CAS latency 3–7, and 84-ball WBGA package. It supports on-die termination (ODT), off-chip driver (OCD) impedance adjustment, and auto-precharge for embedded networking and industrial control memory subsystems.
For engineers reviewing the W9725G6JB25I datasheet, W9725G6JB25I pinout, W9725G6JB25I application, or W9725G6JB25I equivalent, key selection criteria include tRCD/tRP timing compliance at -40°C to +95°C, SSTL_18 interface compatibility, ODT programmability, and WBGA-84 mechanical fit in space-constrained PCB layouts.
Technical Context
This DDR2 SDRAM uses differential clock inputs (CLK/CLK) with input sampling at clock crossings, and source-synchronous DQS/DQS strobes edge-aligned for reads and center-aligned for writes. DLL alignment ensures precise DQ-DQS timing across process/voltage/temperature.
It implements four independent banks with bank-select inputs (BA0/BA1), supports posted CAS (AL = 0–2), and enforces strict initialization sequence including EMRS commands for OCD calibration and DLL enable/disable. All command decoding occurs synchronously on rising CLK edges with CS, RAS, CAS, and WE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (4,194,304 × 16-bit × 4 banks) |
| Interface Standard | SSTL_18 - requires 1.8 V ±0.1 V VDD/VDDQ and matched termination |
| Speed Grade | DDR2-800 (5-5-5 or 6-6-6) - tCK(avg) ≤ 2.5 ns @ CL=5, tRCD/tRP ≥ 12.5 ns |
| CAS Latency | Programmable CL = 3, 4, 5, 6, or 7 - determines minimum read access delay after column address |
| Burst Length | 4 or 8 - defines number of consecutive data transfers per read/write command |
| Operating Temp | -40°C to +95°C case temperature - validated for industrial-grade reliability |
| Power Down Modes | Active and Precharged Power Down - reduces IDD to <10 mA while preserving state |
| Self Refresh Current | Max 6 mA - enables low-power retention during system sleep without external refresh |
Pinout & Package
Package: WBGA-84 (8 mm × 12.5 mm, 0.8 mm ball pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row address (A0–A12); column address (A0–A8); A10 controls auto-precharge |
| BA0, BA1 | Bank Select | Selects one of four internal banks for activate/read/write/precharge commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; VSSQ-isolated for noise immunity |
| UDQS, LDQS | Differential Data Strobe | Upper/lower byte strobes; edge-aligned on read, center-aligned on write; enabled via EMR(1) |
| ODT | On-Die Termination Control | Active-HIGH signal enabling internal termination resistors (75 Ω or 150 Ω) on DQ/DQS lines |
| CKE | Clock Enable | Gates internal clock circuitry; LOW disables DLL and enters power-down states |
| CS, RAS, CAS, WE | Command Inputs | Decode all operations (activate, read, write, precharge, refresh) on rising CLK edge |
| CLK, CLK | Differential Clock | Reference for all synchronous inputs; sampling occurs at crossing points |
Key Features
| Feature | Design Value |
|---|---|
| OCD Impedance Adjustment | Programmable output driver strength via EMR(1); calibrates DQ/DQS drive to match trace impedance |
| On-Die Termination (ODT) | Configurable 75 Ω or 150 Ω termination on DQ/DQS pins; eliminates external resistors and improves signal integrity |
| Posted CAS with AL | Additive Latency (AL = 0–2) decouples command bus occupancy from data return timing, increasing bus efficiency |
| Auto-Precharge | Automatic bank precharge triggered by burst end; eliminates explicit PRE command overhead in sequential access |
| DLL Alignment | Digital Delay Lock Loop dynamically aligns DQ and DQS edges to CLK crossings across PVT variation |
| Industrial Temp Range | Guaranteed operation from -40°C to +95°C case temperature - suitable for uncooled industrial enclosures |
Applications
| Industrial HMI Panels | Network Switch Buffers |
|---|---|
|
Use Scenario: Touch-enabled operator interfaces in factory automation requiring local frame buffer and firmware storage. IC Role / Device Role / Timing Role: Primary working memory for ARM-based controller; supplies burst-access graphics data to display engine. Use Value: DDR2-800 bandwidth (1.6 GB/s peak) sustains 1080p UI rendering; ODT+OCD minimizes signal reflections on 4-layer PCB traces. |
Use Scenario: Packet buffering in managed Ethernet switches handling 1 GbE line-rate traffic. IC Role / Device Role / Timing Role: Shared packet memory for ingress/egress queues; accessed concurrently by multiple MAC controllers. Use Value: Four-bank architecture enables interleaved reads/writes; tRC = 52.5 ns supports >19 M ops/sec random access throughput. |
| Medical Imaging Controllers | Automotive ADAS Gateways |
|
Use Scenario: Real-time image processing pipelines in portable ultrasound devices with thermal constraints. IC Role / Device Role / Timing Role: Frame store for FPGA-accelerated beamforming; operates in self-refresh during standby intervals. Use Value: IDD6 ≤ 6 mA self-refresh current extends battery life; -40°C to +95°C rating ensures reliability near heat-generating FPGAs. |
Use Scenario: Central domain controller aggregating CAN, Ethernet, and sensor data in next-gen vehicle architectures. IC Role / Device Role / Timing Role: System memory for real-time OS and middleware; co-located with automotive-grade MCU. Use Value: W9725G6JB25I's AEC-Q200-aligned qualification (25A variant) and ODT support reduce EMI in high-noise chassis environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H64M4HQ-25E | 64M × 4 organization (256 Mbit), same DDR2-800 speed grade, but 90-ball FBGA package (11×13 mm) | Larger footprint; higher I/O count enables future scalability but requires PCB redesign | Choose when board layout allows larger package and long-term roadmap includes higher-density DDR2 upgrades |
| IS42S16400F-25BLI | Same 4M × 4 × 16 organization and WBGA-84 package, but rated only to +85°C (not +95°C) | Lacks extended industrial temperature margin; unsuitable for sealed, high-ambient enclosures | Acceptable for commercial-extended temp designs where case temperature stays ≤85°C |
Compared with MT47H64M4HQ-25E and IS42S16400F-25BLI, W9725G6JB25I uniquely delivers +95°C operation in the compact WBGA-84 footprint while maintaining full DDR2-800 timing compliance - critical for thermally constrained industrial and automotive edge nodes.
Availability
W9725G6JB25I is available at Aetrix Electronics and suitable for industrial HMI panels, network switch buffers, and medical imaging controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9725G6JB25I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W9725G6JB25I belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for reliable, high-bandwidth memory in thermally demanding embedded systems where extended temperature operation and signal integrity are mandatory.
FAQ
What is the guaranteed operating temperature range for W9725G6JB25I?
W9725G6JB25I is specified for industrial operation from -40°C to +95°C case temperature (TCASE), verified per JEDEC JESD22-A104 and JESD22-A108 standards. This rating applies to the -25I suffix variant and is confirmed in the device's AC characteristics tables and revision history notes.
Does W9725G6JB25I support differential DQS operation?
Yes, W9725G6JB25I supports differential data strobes via UDQS/UDQS and LDQS/LDQS pairs, enabled by setting the appropriate bit in Extended Mode Register 1 (EMR(1)) using an EMRS command. When enabled, strobes are edge-aligned with read data and center-aligned with write data.
What is the minimum tRCD and tRP timing for W9725G6JB25I at DDR2-800 speed?
For W9725G6JB25I at DDR2-800 speed grade (-25/-25I/-25A), the minimum tRCD and tRP are both 12.5 ns, corresponding to five clock cycles at tCK(avg) = 2.5 ns. These values are explicitly listed in the KEY PARAMETERS table under "DDR2-800" row and "Min." column for tRCD and tRP.
How is On-Die Termination (ODT) configured on W9725G6JB25I?
ODT on W9725G6JB25I is controlled by the ODT pin (ball K9) and programmed via Extended Mode Register 1 (EMR(1)). The ODT pin must be driven HIGH to enable termination, and the resistance value (75 Ω or 150 Ω) is selected by EMR(1) bits A1–A0. Configuration occurs during initialization after power-up and clock stabilization.
Is W9725G6JB25I pin-compatible with other Winbond DDR2 SDRAMs in the W9725G6JB family?
Yes, all W9725G6JB variants-including W9725G6JB-18, W9725G6JB-25, W9725G6JB-25I, W9725G6JB-25A, and W9725G6JB-3-share identical WBGA-84 ball mapping, pin functions, and electrical interface. Only speed grade, temperature rating, and internal timing parameters differ between suffixes.
W9725G6JB25I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 52.5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (8x12.5)
W9725G6JB25I FAQ
1.How can I place an order for W9725G6JB25I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9725G6JB25I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9725G6JB25I reliable?
The price and inventory of W9725G6JB25I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9725G6JB25I is usually 5 days.
3.What payment methods are accepted for W9725G6JB25I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9725G6JB25I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9725G6JB25I?
W9725G6JB25I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9725G6JB25I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9725G6JB25I?
For technical support, including W9725G6JB25I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9725G6JB25I requirements.
6.How does Aetrix verify that W9725G6JB25I is sourced from the original manufacturer or authorized distributors?
All W9725G6JB25I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9725G6JB25I meets industry standards.
7.What is the process for return or replacement of W9725G6JB25I?
All W9725G6JB25I units undergo pre-shipment inspection (PSI). If there is an issue with W9725G6JB25I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9725G6JB25I part is unused and in its original packaging.
Return procedure for W9725G6JB25I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9725G6JB25I Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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