Winbond Electronics Corporation W9725G6KB25I TR
- Part No.:
- W9725G6KB25I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W9725G6KB25I TR.pdf
- Description:
- IC DRAM 256MBIT 84-WBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9725G6KB25I TR from Winbond is a 256M-bit DDR2 SDRAM organized as 4M × 4 banks × 16-bit, supporting DDR2-800 (5-5-5 or 6-6-6) operation at 1.8 V supply, with CAS latency options of 3–7 and burst lengths of 4/8, deployed in embedded industrial control and network interface memory subsystems.
For engineers reviewing the W9725G6KB25I TR datasheet, W9725G6KB25I TR pinout, W9725G6KB25I TR application, or W9725G6KB25I TR equivalent, key selection considerations include industrial temperature support (−40°C to +95°C), on-die termination (ODT), off-chip driver (OCD) impedance calibration, and SSTL_18 interface compliance for signal integrity in high-speed PCB layouts.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned to read data and center-aligned to write data. It integrates a DLL for precise DQ–DQS–clock alignment and supports posted CAS (AL = 0–2) to decouple command and data bus timing.
Functional operation includes auto-precharge, self-refresh, and power-down modes (precharged and active), with ODT programmable per bank via EMR(1) and OCD calibration enabled through extended mode register commands. All control/address inputs are sampled on the crossing of CLK rising and CLK falling edges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (4,194,304 words × 4 banks × 16 bits) |
| Data Rate | DDR2-800: up to 800 Mb/sec/pin (tCK min = 2.5 ns @ CL=5) |
| Supply Voltage | VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; separate VSSQ/VSSDL grounds improve noise immunity |
| CAS Latency | Programmable CL = 3, 4, 5, 6, or 7; determines minimum read access delay after column address |
| Burst Length | Fixed BL = 4 or 8; supports sequential or interleaved burst transfers without address reissuing |
| Operating Temperature | Industrial grade: −40°C ≤ TCASE ≤ 95°C - validated for extended thermal cycling in networking and automation hardware |
| Interface Standard | SSTL_18-compliant I/Os with differential clock (CLK/CLK) and bidirectional DQS/DQS strobes |
| Termination | On-Die Termination (ODT) and Off-Chip Driver (OCD) impedance adjustment for controlled impedance routing |
Pinout & Package
Packaged in lead-free, RoHS-compliant WBGA-84 (8 mm × 12.5 mm, 0.8 mm pitch), with dedicated VDDQ/VSSQ planes for I/O power integrity and isolated VDDL/VSSDL for DLL circuitry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Inputs | Row address (A0–A12); column address (A0–A8); A10 controls auto-precharge enable |
| BA0, BA1 | Bank Select | Selects one of four internal banks for activate/read/write/precharge commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; requires matched trace length and SSTL_18 termination |
| UDQS, LDQS | Differential Data Strobe | Upper/lower byte strobes; edge-aligned on reads, center-aligned on writes; enabled via EMR(1) |
| ODT | On-Die Termination Control | Active-HIGH signal enabling internal termination resistors during reads/writes to reduce stub reflections |
| CKE | Clock Enable | Gates internal clocking; LOW disables DLL and enters power-down; HIGH resumes synchronous operation |
| CS, RAS, CAS, WE | Command Interface | Encoded command inputs sampled on CLK/CLK crossing; define all operations including refresh and mode register load |
| VREF | Input Reference Voltage | Tracks VDDQ/2 ±300 mV; critical for stable input threshold across voltage/temperature variation |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Range | Guaranteed operation from −40°C to +95°C case temperature - suitable for uncooled industrial gateways and motor drives |
| Programmable Additive Latency (AL) | AL = 0, 1, or 2 enables posted CAS to hide command decode latency and increase bus utilization in burst-heavy workloads |
| OCD Impedance Calibration | Adjusts output driver strength via EMR(1) to match PCB trace impedance (e.g., 40 Ω or 60 Ω), reducing signal overshoot/undershoot |
| Self-Refresh Mode | IDD6 ≤ 6 mA at TCASE ≤ 85°C - maintains data retention during host sleep without external refresh controller intervention |
| Write Data Mask (DM) | LDM/UDM pins mask individual byte lanes during writes; sampled on both DQS edges for precise timing alignment |
| Power-Down Entry/Exit | Precharged Power Down reduces IDD1 by >85% with tXP ≤ 10 ns exit time - ideal for low-latency wake-up in real-time systems |
Applications
| Industrial PLC Memory Buffer | Network Switch Packet Buffer |
|---|---|
|
Use Scenario: Real-time I/O scanning and logic execution in programmable logic controllers requiring deterministic memory access under wide ambient temperature swings. IC Role / Device Role / Timing Role: Primary working memory for firmware execution and tag data storage, interfaced to ARM Cortex-M7 or RISC-V SoCs via 16-bit DDR2 bus. Use Value: Industrial temperature rating (−40°C to +95°C) and self-refresh current ≤6 mA ensure reliable operation in fanless enclosures without thermal derating. |
Use Scenario: Temporary packet buffering in Layer 2/L3 Ethernet switches handling 1 GbE line-rate traffic with bursty ingress/egress patterns. IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by multiple MAC engines and QoS schedulers using bank-interleaved bursts. Use Value: Bank-interleaved read current (IDD7 ≤ 135 mA) and tRC = 57.5 ns enable sustained 800 MT/s throughput across four banks without contention stalls. |
| Medical Imaging Front-End Controller | Automotive ADAS Camera Interface |
|
Use Scenario: Frame buffering and image preprocessing in portable ultrasound or digital X-ray units where EMI robustness and long-term reliability are critical. IC Role / Device Role / Timing Role: High-integrity frame store between analog front-end ADCs and FPGA-based image pipeline, operating under strict EMC requirements. Use Value: SSTL_18 I/Os with OCD-calibrated drivers and ODT reduce radiated emissions; RoHS/WBGA package eliminates lead-related corrosion risks. |
Use Scenario: Vision processing buffer in surround-view camera ECUs, supporting simultaneous 4-channel MIPI CSI-2 input with real-time stitching. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for FPGA or ASIC vision processors performing stereo disparity and object detection. Use Value: DDR2-800 speed grade with CL=5 and tRCD = 12.5 ns ensures sub-20 ns read-to-write turnaround for ping-pong frame buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H64M4HQ-25E IT:C | Micron DDR2-800 (5-5-5), 256Mb, 64M×4, same 1.8 V, but 60-ball FBGA; no OCD calibration | Requires external series termination; less flexible for impedance-mismatched layouts | Preferred when footprint compatibility with legacy Micron designs is required and OCD is not needed |
| IS42S16160F-25BLI | ISSI DDR2-800 (5-5-5), 256Mb, 16M×16, 84-ball WBGA, supports AL=0–2 but lacks ODT programmability | No per-bank ODT control; fixed termination only - limits multi-rank signal integrity tuning | Valid for cost-sensitive industrial boards where ODT flexibility is secondary to BOM consolidation |
Compared with W9725G6KB25I TR, MT47H64M4HQ-25E IT:C offers identical speed and temperature but lacks OCD calibration, while IS42S16160F-25BLI matches the package and speed but omits programmable ODT - making W9725G6KB25I TR uniquely suited for high-signal-integrity DDR2 designs requiring both on-die termination and driver tuning.
Availability
W9725G6KB25I TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9725G6KB25I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and trusted computing solutions, with over 30 years of DRAM design heritage.
The W97 series targets industrial and networking applications demanding extended temperature operation, low-power self-refresh, and advanced signal integrity features like OCD and programmable ODT - distinguishing it from consumer-grade DDR2 offerings.
FAQ
What is the maximum operating frequency supported by W9725G6KB25I TR?
W9725G6KB25I TR supports DDR2-800 operation, achieving up to 800 megatransfers per second (MT/s) with a minimum clock period (tCK) of 2.5 ns at CAS Latency 5. This speed grade is validated across the full industrial temperature range (−40°C to +95°C), and the device also supports slower DDR2-667 operation if system timing margins require relaxation.
Does W9725G6KB25I TR support on-die termination (ODT) and how is it configured?
Yes, W9725G6KB25I TR supports programmable on-die termination (ODT) via Extended Mode Register 1 (EMR1). ODT is enabled by driving the ODT pin HIGH and configuring resistance values (e.g., 75 Ω, 150 Ω, or 50 Ω) through EMR1 bits A9–A7. This eliminates the need for external parallel termination resistors on DQ/DQS lines, improving signal integrity in point-to-point and multi-drop DDR2 topologies.
How does the OCD (Off-Chip Driver) calibration function work in W9725G6KB25I TR?
OCD calibration in W9725G6KB25I TR adjusts the output driver impedance of DQ and DQS pins to match PCB trace impedance (typically 40 Ω or 60 Ω). It is initiated via EMR1 commands with specific A9–A7 bit patterns, followed by a calibration sequence that compares internal reference voltages. The calibrated value is retained until next reset or reprogramming, ensuring consistent drive strength across voltage and temperature.
What is the purpose of the VDDL and VSSDL pins on W9725G6KB25I TR?
VDDL (J1) and VSSDL (J7) are dedicated power and ground supplies for the internal DLL (Delay-Locked Loop) circuitry in W9725G6KB25I TR. Isolating DLL power from core (VDD) and I/O (VDDQ) domains minimizes noise coupling into the clock alignment path, preserving DQ–DQS–CLK timing accuracy and reducing jitter - critical for maintaining setup/hold margins at DDR2-800 speeds.
Can W9725G6KB25I TR be used in place of the -25 speed grade part?
W9725G6KB25I TR is functionally identical to W9725G6KB-25 in electrical and timing specifications (DDR2-800, 5-5-5 or 6-6-6), differing only in its extended industrial temperature qualification (−40°C to +95°C vs. 0°C to +85°C). Pinout, package, and initialization sequence are identical, allowing direct substitution where wider thermal operation is required - no layout or firmware changes are needed.
W9725G6KB25I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- -
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 57.5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (8x12.5)
W9725G6KB25I TR FAQ
1.How can I place an order for W9725G6KB25I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9725G6KB25I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9725G6KB25I TR reliable?
The price and inventory of W9725G6KB25I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9725G6KB25I TR is usually 5 days.
3.What payment methods are accepted for W9725G6KB25I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9725G6KB25I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9725G6KB25I TR?
W9725G6KB25I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9725G6KB25I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9725G6KB25I TR?
For technical support, including W9725G6KB25I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9725G6KB25I TR requirements.
6.How does Aetrix verify that W9725G6KB25I TR is sourced from the original manufacturer or authorized distributors?
All W9725G6KB25I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9725G6KB25I TR meets industry standards.
7.What is the process for return or replacement of W9725G6KB25I TR?
All W9725G6KB25I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9725G6KB25I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9725G6KB25I TR part is unused and in its original packaging.
Return procedure for W9725G6KB25I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9725G6KB25I TR Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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