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Winbond Electronics Corporation W972GG6JB-18
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- Part No.:
- W972GG6JB-18
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W972GG6JB-18.pdf
- Description:
- IC DRAM 2GBIT PAR 84WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,183
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Product details
Overview
W972GG6JB-18 from Winbond is a 2Gb (128M × 16) DDR2 SDRAM organized as 16M words × 8 banks × 16 bits, compliant with JEDEC DDR2-1066 (7-7-7) timing, operating at 1.8 V ± 0.1 V supply, and supporting CAS latencies of 3–7 for high-bandwidth memory subsystems in embedded networking and industrial control systems.
For engineers reviewing the W972GG6JB-18 datasheet, W972GG6JB-18 pinout, W972GG6JB-18 application, or W972GG6JB-18 equivalent, key selection criteria include DDR2-1066 speed grade compliance, SSTL_18 interface compatibility, on-die termination (ODT), OCD impedance calibration, and WBGA-84 package layout constraints.
Technical Context
This DDR2 SDRAM uses differential clock inputs (CLK/CLK) synchronized to command/address latching at clock crossings, and source-synchronous DQS/DQS strobes edge-aligned with read data and center-aligned with write data. It integrates a DLL to align DQ and DQS transitions with system clock edges, enabling stable 533 MHz operation (tCK = 1.875 ns min at CL=7).
Functional operation includes programmable additive latency (AL=0–2), auto-precharge, burst lengths of 4 or 8, write latency = read latency − 1, and dual-mode ODT control via dedicated ODT pin. The device supports full JEDEC-compliant power-down modes (precharged and active), self-refresh down to 12 mA, and temperature-compensated refresh intervals up to 95°C for industrial-grade variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (128M × 16), 16M words × 8 banks × 16 bits - defines usable capacity and bank-level parallelism for interleaved access. |
| Speed Grade | DDR2-1066 (7-7-7), tCK = 1.875 ns min - enables 1066 Mb/s/pin transfer rate with guaranteed tRCD/tRP/tRC timing margins. |
| Voltage Supply | VDD/VDDQ = 1.8 V ± 0.1 V - mandates tight regulation and decoupling design for signal integrity and power stability. |
| CAS Latency | CL = 3 to 7 - selectable via mode register to balance latency vs. bandwidth across system clock frequencies. |
| Burst Length | BL = 4 or 8 - determines contiguous data fetch size per read/write command, affecting bus efficiency and controller scheduling. |
| Interface Standard | SSTL_18 - requires matched-impedance routing, controlled slew rates, and proper VREF (VDDQ/2 ± 300 mV) referencing. |
| On-Die Termination | ODT pin-controlled (not mode-register only) - enables dynamic termination activation during reads/writes to suppress reflections on DQ/DQS lines. |
| Package | WBGA-84 (11 mm × 13 mm, 0.8 mm pitch) - defines PCB footprint, thermal dissipation path, and BGA reflow profile requirements. |
Pinout & Package
W972GG6JB-18 is packaged in an 84-ball WBGA (11 mm × 13 mm, 0.8 mm pitch) with lead-free, RoHS-compliant construction. Ball assignment follows JEDEC-standard DDR2 SDRAM layout with separate VDDQ/VSSQ planes for I/O noise isolation and dedicated DLL power (VDDL)/ground (VSSDL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A13 | Address Input | Row address (A0–A13); column address (A0–A9); A10 controls auto-precharge - defines memory addressing granularity and bank activation scope. |
| BA0–BA2 | Bank Select | Selects one of eight internal banks for concurrent row activation - enables bank interleaving to hide tRC latency. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus - supports x16 interface configuration without data bus multiplexing or glue logic. |
| UDQS/UDQS, LDQS/LDQS | Differential Data Strobe | Source-synchronous strobes for upper/lower byte - edge-aligned on reads, center-aligned on writes; enables precise timing capture at 533 MHz. |
| ODT | On-Die Termination Control | Active-HIGH pin enables internal termination resistors - eliminates need for external termination on DQ/DQS lines, reducing BOM count and board area. |
| CLK/CLK | Differential Clock Input | System clock reference for all command/address sampling - crossing detection ensures robust setup/hold margin under skew. |
| CKE | Clock Enable | Gates internal clock distribution - controls entry/exit from power-down modes and enables low-power idle states. |
| CS, RAS, CAS, WE | Command Inputs | Define instruction set (activate, read, write, precharge, refresh) - sampled synchronously with CLK/CLK crossing for deterministic command decoding. |
Key Features
| Feature | Design Value |
|---|---|
| Off-Chip Driver (OCD) Impedance Calibration | Programmable output driver strength via EMR(1) - matches trace impedance to minimize signal reflections and improve eye margin at 533 MHz. |
| Dynamic On-Die Termination (ODT) | Pin-controlled ODT activation - allows real-time termination enable/disable per access type (read vs. write), optimizing signal integrity without fixed resistor networks. |
| Posted CAS with Additive Latency | AL = 0–2 configurable via EMR(1) - decouples command bus occupancy from data return timing, increasing command bus utilization in burst-heavy workloads. |
| Self-Refresh Current ≤ 12 mA | Low-power retention mode at TCASE ≤ 85°C - enables extended battery-backed operation or thermal throttling without host intervention. |
| Industrial Temperature Support (via -25I/-3I variants) | -40°C to +95°C operation with doubled refresh rate - meets extended thermal requirements for transportation, energy, and factory automation applications. |
| Write Data Mask (UDM/LDM) | Per-byte masking sampled on both DQS edges - enables partial-word writes without read-modify-write cycles, reducing bus traffic and latency. |
Applications
| Industrial HMI Controllers | Network Switch Packet Buffers |
|---|---|
|
Use Scenario: Real-time display rendering and touch response in panel-mounted HMIs deployed in factory environments with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Primary working memory interfaced to ARM Cortex-A series SoCs via 16-bit DDR2 bus, providing low-latency access to GUI frame buffers and firmware variables. Use Value: DDR2-1066 bandwidth sustains 60 fps video overlay while OCD calibration and ODT ensure signal integrity across 4-layer PCB traces up to 8 cm. |
Use Scenario: Temporary storage of ingress/egress Ethernet frames in Layer 2 managed switches handling 1 Gbps line-rate traffic. IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by MAC controllers and switching fabric, requiring bank interleaving and auto-precharge for throughput continuity. Use Value: 8-bank architecture and tRC = 58.125 ns minimum enable >95% bus utilization under sustained 128-byte frame bursts, minimizing packet loss. |
| Medical Imaging Edge Processors | Automotive ADAS Camera Modules |
|
Use Scenario: Local image buffering in portable ultrasound devices where EMI resilience and thermal reliability are critical during clinical use. IC Role / Device Role / Timing Role: High-fidelity frame store for FPGA-based beamforming engines, operating in burst-read mode with RL=5 and BL=8 to feed parallel processing pipelines. Use Value: Differential DQS strobes and SSTL_18 signaling reduce jitter-induced pixel errors; VDDQ/VSSQ separation lowers crosstalk between analog front-end and digital memory domains. |
Use Scenario: Embedded vision processing in rear-view and surround-view camera ECUs subjected to automotive temperature cycling (-40°C to +85°C). IC Role / Device Role / Timing Role: Frame buffer for TI TDA2x or NXP S32V234 SoCs, supporting simultaneous capture (write) and analysis (read) with bank conflict avoidance. Use Value: Precharged power-down mode reduces IDD1 current to <96 mA during idle periods between video frames, extending module power budget headroom. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H128M16HR-37E | 1 Gb density, DDR2-800 (6-6-6), 84-ball FBGA, same VDD/VDDQ but no pin-compatible ODT pin - ODT controlled via EMR only. | Limited to lower bandwidth systems; lacks pin-level ODT control for dynamic termination switching. | Choose when cost sensitivity outweighs need for DDR2-1066 speed and hardware ODT flexibility. |
| IS42S16160F-6BLI | 2 Gb density, DDR2-667 (5-5-5), 84-ball FBGA, identical pinout and ODT pin, but slower tCK = 3 ns min and higher IDD0 = 80 mA. | Compatible footprint and control interface, but insufficient for 533 MHz clock domain; suitable for legacy designs. | Choose only if system clock is ≤333 MHz and thermal budget permits higher standby current. |
Compared with MT47H128M16HR-37E and IS42S16160F-6BLI, W972GG6JB-18 delivers 33% higher bandwidth, hardware ODT control for adaptive signal integrity, and tighter tRCD/tRP timing - making it optimal for new designs targeting DDR2-1066 performance within industrial thermal envelopes.
Availability
W972GG6JB-18 is available at Aetrix Electronics and suitable for industrial HMI controllers, network switch packet buffers, medical imaging edge processors, and automotive ADAS camera modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for W972GG6JB-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
W972GG6JB-18 belongs to Winbond's DDR2 SDRAM product line, engineered for high-reliability embedded systems demanding JEDEC-compliant timing, extended temperature operation, and robust signal integrity features like OCD and pin-controlled ODT.
FAQ
What is the maximum operating frequency supported by W972GG6JB-18?
W972GG6JB-18 supports DDR2-1066 operation with a minimum clock period (tCK) of 1.875 ns, corresponding to a 533 MHz clock frequency and 1066 Mb/s per pin data rate. This speed grade is validated under JEDEC DDR2-1066 (7-7-7) timing specifications at 0°C to 85°C case temperature.
Does W972GG6JB-18 require external termination resistors?
No, W972GG6JB-18 integrates on-die termination (ODT) controlled by the dedicated ODT pin, eliminating the need for external resistors on DQ and DQS lines. When ODT is asserted HIGH, internal termination resistors (typically 75 Ω or 150 Ω, configurable via EMR) are enabled to match transmission line impedance.
How is the W972GG6JB-18 initialized after power-up?
W972GG6JB-18 requires a strict 13-step initialization sequence: stable power ramp, 200 µs clock stabilization, CKE assertion, precharge-all, two EMRS commands (to EMR2 and EMR3), DLL enable, DLL reset, second precharge-all, two auto-refresh commands, MRS programming, and OCD calibration - all documented in Section 8.1 of the datasheet.
Can W972GG6JB-18 operate in industrial temperature ranges?
The W972GG6JB-18 variant is rated for 0°C to 85°C case temperature. For industrial operation from -40°C to 95°C, Winbond offers the W972GG6JB-25I and W972GG6JB-3I variants, which maintain full JEDEC AC/DC specifications across that range with doubled refresh rate at high temperature.
What package type and ball pitch does W972GG6JB-18 use?
W972GG6JB-18 uses an 84-ball WBGA package measuring 11 mm × 13 mm with 0.8 mm ball pitch. It employs lead-free, RoHS-compliant materials and separates VDDQ/VSSQ planes to isolate I/O power from core logic, improving noise immunity in mixed-signal PCB layouts.
W972GG6JB-18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 58.125 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (11x13)
W972GG6JB-18 FAQ
1.How can I place an order for W972GG6JB-18 through Aetrix?
Please submit a Request for Quotation (RFQ) for W972GG6JB-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W972GG6JB-18 reliable?
The price and inventory of W972GG6JB-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG6JB-18 is usually 5 days.
3.What payment methods are accepted for W972GG6JB-18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG6JB-18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W972GG6JB-18?
W972GG6JB-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W972GG6JB-18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W972GG6JB-18?
For technical support, including W972GG6JB-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG6JB-18 requirements.
6.How does Aetrix verify that W972GG6JB-18 is sourced from the original manufacturer or authorized distributors?
All W972GG6JB-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG6JB-18 meets industry standards.
7.What is the process for return or replacement of W972GG6JB-18?
All W972GG6JB-18 units undergo pre-shipment inspection (PSI). If there is an issue with W972GG6JB-18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W972GG6JB-18 part is unused and in its original packaging.
Return procedure for W972GG6JB-18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W972GG6JB-18 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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