Winbond Electronics Corporation W972GG6JB25I
- Part No.:
- W972GG6JB25I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W972GG6JB25I.pdf
- Description:
- IC DRAM 2GBIT PARALLEL 84WBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,650
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W972GG6JB25I from Winbond Electronics is a 2Gb (128M × 16) DDR2 SDRAM organized as 16M words × 8 banks × 16 bits, supporting DDR2-800 (5-5-5 or 6-6-6) operation at up to 400 MHz clock frequency with CL=5/6, tRCD/tRP=12.5 ns, and industrial temperature range of −40°C to +95°C. It features on-die termination (ODT), off-chip driver (OCD) impedance adjustment, posted CAS latency, and auto-precharge for embedded networking, industrial HMIs, and legacy controller-based systems.
For engineers reviewing the W972GG6JB25I datasheet, W972GG6JB25I pinout, W972GG6JB25I application, or W972GG6JB25I equivalent, key selection criteria include industrial-grade thermal reliability, SSTL_18 interface compliance, 84-ball WBGA package compatibility, and JEDEC DDR2-800 timing validation across full temperature range.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQ lines referenced to edge-aligned LDQS/UDQS (or single-ended DQS when configured) and DLL-aligned timing. It supports programmable additive latency (AL=0–2), burst lengths of 4 or 8, and write latency WL = RL − 1.
Functional control is managed via mode registers (MR) and extended mode registers (EMR1–EMR3), enabling dynamic configuration of ODT states, OCD calibration, DLL enable/disable, and drive strength. Power management includes precharged and active power-down modes, self-refresh with tREFI = 3.9 µS at 85–95°C, and burst refresh capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (128M × 16), 16M words × 8 banks × 16 bits - defines usable data width and bank parallelism for memory controllers. |
| Data Rate | DDR2-800 (400 MHz clock, 800 MT/s per pin) - sets maximum sustained bandwidth and system clock domain alignment. |
| CAS Latency | CL = 5 or 6 - determines minimum read access delay in clock cycles; impacts real-time latency-critical firmware execution. |
| tRCD / tRP | 12.5 ns min - defines shortest interval between ACTIVATE and READ/WRITE or PRECHARGE commands; constrains row cycle efficiency. |
| Operating Temp | −40°C to +95°C case temperature - enables deployment in uncooled industrial enclosures and automotive under-hood adjacent zones. |
| Supply Voltage | VDD/VDDQ = 1.8 V ± 0.1 V - requires tight-tolerance 1.8V LDO or DC-DC; VDDQ isolation from VDD improves signal integrity on DQ bus. |
| Package | 84-ball WBGA (11 mm × 13 mm, 0.8 mm pitch) - surface-mount footprint compatible with standard reflow profiles and IPC-7351B land patterns. |
Pinout & Package
W972GG6JB25I uses an 84-ball fine-pitch WBGA package (11 mm × 13 mm, 0.8 mm ball pitch) with RoHS-compliant lead-free finish and separate VDDQ/VSSQ planes for I/O noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A13 | Address Inputs | Row/column address bus; A10 controls auto-precharge; all sampled on CLK/CLK crossing - defines memory map granularity and bank activation sequence. |
| BA0–BA2 | Bank Select | 3-bit bank address; selects one of eight internal banks for concurrent row activation - enables interleaved access to hide tRC latency. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; SSTL_18 compliant - matches controller DQ voltage and termination requirements without level shifters. |
| LDQS / UDQS | Differential Data Strobe (Lower/Upper) | Source-synchronous strobes for DQ0–7 and DQ8–15; edge-aligned on reads, center-aligned on writes - enables precise timing capture in high-speed interfaces. |
| CKE | Clock Enable | Asynchronous enable for internal clock circuitry; LOW disables DLL and enters power-down - critical for low-power idle state control. |
| ODT | On-Die Termination Control | Registered HIGH enables internal termination resistors on DQ/DQS - eliminates need for external parallel termination and reduces board space. |
| VREF | Input Reference Voltage | Reference for address/control input thresholds; must track VDDQ/2 ±300 mV - ensures robust command decoding across voltage/temperature variation. |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Range | Rated for −40°C to +95°C case temperature with validated DDR2-800 (5-5-5) timing - supports fanless industrial PCs and railway signaling hardware without derating. |
| On-Die Termination (ODT) | Programmable termination resistance on DQ/DQS pins - eliminates external 50 Ω resistors, reduces PCB layer count, and improves signal eye margin at 400 MHz. |
| Off-Chip Driver (OCD) Calibration | Dynamic impedance tuning of output drivers using EMR(1) - compensates for process/voltage/temperature drift to maintain consistent slew rate and overshoot control. |
| Posted CAS with Additive Latency | AL = 0–2 configurable via EMR(1); RL = AL + CL - decouples command issuance from data availability, increasing command bus utilization in burst-heavy workloads. |
| Self-Refresh at High Temp | tREFI = 3.9 µS at 85–95°C (doubled refresh rate) with EMR(2) A7=1 - maintains data retention during thermal stress without host intervention. |
Applications
| Industrial Human-Machine Interface | Legacy Industrial Controller Memory |
|---|---|
Use Scenario: Touchscreen HMI running Linux-based UI with local graphics buffer and real-time PLC communication stack. IC Role / Device Role / Timing Role: Primary system memory for ARM Cortex-A8/A9 SoC, providing 16-bit wide DDR2-800 bandwidth to sustain 60 fps GUI rendering and deterministic I/O response. Use Value: −40°C to +95°C rating allows direct mounting inside sealed metal enclosures; ODT and OCD reduce layout sensitivity to trace length mismatches in compact 4-layer boards. | Use Scenario: Retrofit memory upgrade for aging programmable logic controller (PLC) with FPGA-based memory controller supporting DDR2 interface. IC Role / Device Role / Timing Role: Drop-in replacement for obsolete DDR2-667 modules, leveraging identical 84-ball WBGA footprint and JEDEC-compatible command set. Use Value: DDR2-800 speed grade increases instruction fetch throughput by ~20% over DDR2-667; industrial temp grade avoids cold-start failures in outdoor substations. |
| Network Edge Router Buffer | Medical Diagnostic Imaging Cache |
Use Scenario: Packet buffering in fanless enterprise edge router handling 1 Gbps line rate with deep QoS queues and ACL tables. IC Role / Device Role / Timing Role: Shared packet buffer for dual-core MIPS processor and traffic manager ASIC, operating in bank-interleaved mode to sustain >1.2 GB/s aggregate bandwidth. Use Value: Bank-interleaved read current (IDD7 = 250 mA max) validated for continuous operation; tRC = 57.5 ns enables sub-60 ns average row cycle time under load. | Use Scenario: Frame cache in portable ultrasound device requiring rapid image reconstruction from sensor streams with strict EMI limits. IC Role / Device Role / Timing Role: Low-noise memory buffer between ADC interface and DSP engine, using VDDQ/VSSQ isolation and ODT to suppress switching noise coupling into analog front-end. Use Value: Separate VDDQ/VSSQ planes and SSTL_18 signaling reduce radiated emissions below CISPR 11 Class B limits; self-refresh at 95°C maintains uptime during prolonged scanning sessions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H128M16HR-25E | Same density (2Gb), same 84-ball FBGA, DDR2-800 (5-5-5), but rated 0°C to +85°C only - no industrial temp support. | Not suitable for deployments requiring operation below 0°C or above 85°C; requires thermal derating or heatsinking in warm environments. | Select only if ambient temperature stays within commercial range and cost is primary constraint. |
| IS42S16160F-3BL | Same 2Gb × 16, 84-ball FBGA, DDR2-667 (5-5-5), industrial −40°C to +85°C - lower speed grade, wider tRCD/tRP (15 ns), no 95°C support. | Limited to ≤333 MHz clock; insufficient for bandwidth-intensive video buffering or multi-threaded control stacks. | Choose when system clock is fixed at ≤333 MHz and full 95°C operation is unnecessary. |
Compared with MT47H128M16HR-25E and IS42S16160F-3BL, W972GG6JB25I uniquely delivers DDR2-800 performance with validated −40°C to +95°C operation and integrated ODT/OCD - eliminating external termination components while maintaining JEDEC compliance across the full industrial envelope.
Availability
W972GG6JB25I is available at Aetrix Electronics and suitable for industrial HMIs, legacy controller upgrades, and network edge buffering requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature performance.
Supply support for W972GG6JB25I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.
The W972GG6JB series targets cost-sensitive, thermally demanding applications where DDR2 remains the optimal balance of bandwidth, power, and controller maturity - particularly in brownfield industrial upgrades and long-lifecycle infrastructure equipment.
FAQ
What is the maximum clock frequency supported by W972GG6JB25I?
W972GG6JB25I supports a maximum clock frequency of 400 MHz, enabling DDR2-800 data rates (800 MT/s). This is validated for both 5-5-5 and 6-6-6 timing configurations across its full industrial temperature range of −40°C to +95°C, with tCK(min) = 2.5 ns at CL=5/6. The device does not support DDR2-1066 operation.
Does W972GG6JB25I require external termination resistors?
No, W972GG6JB25I integrates on-die termination (ODT) controlled via the ODT pin and extended mode registers. When enabled, it provides programmable termination on DQ and DQS lines, eliminating the need for external 50 Ω parallel resistors and simplifying PCB layout. External termination is optional only if ODT is disabled in system configuration.
How is the industrial temperature rating of W972GG6JB25I validated?
W972GG6JB25I is fully characterized and guaranteed to meet all JEDEC DDR2 AC/DC specifications - including tRCD, tRP, tRC, and IDD parameters - across −40°C ≤ TCASE ≤ 95°C. At 85–95°C, it requires doubled refresh rate (tREFI = 3.9 µS) enabled via EMR(2) bit A7, and self-refresh current remains ≤12 mA per JEDEC spec.
Can W972GG6JB25I be used as a drop-in replacement for DDR2-667 memory modules?
W972GG6JB25I is pin-compatible and electrically compatible with DDR2-667 modules using the same 84-ball WBGA package and SSTL_18 interface, but operates at higher speed (DDR2-800). As a drop-in replacement, it requires controller firmware support for DDR2-800 timing parameters (e.g., tRCD = 12.5 ns vs. 15 ns) and may deliver improved bandwidth without hardware changes.
What is the purpose of the VDDL and VSSDL pins on W972GG6JB25I?
VDDL (J1) and VSSDL (J7) are dedicated power and ground supplies for the internal delay-locked loop (DLL) circuitry. Isolating DLL biasing from main VDD/VSS prevents switching noise from degrading DLL stability and clock-to-data alignment accuracy - critical for maintaining tAC and tDQSS margins at 400 MHz operation. W972GG6JB25I requires clean, low-noise 1.8 V on VDDL.
W972GG6JB25I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 57.5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (11x13)
W972GG6JB25I FAQ
1.How can I place an order for W972GG6JB25I through Aetrix?
Please submit a Request for Quotation (RFQ) for W972GG6JB25I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W972GG6JB25I reliable?
The price and inventory of W972GG6JB25I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG6JB25I is usually 5 days.
3.What payment methods are accepted for W972GG6JB25I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG6JB25I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W972GG6JB25I?
W972GG6JB25I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W972GG6JB25I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W972GG6JB25I?
For technical support, including W972GG6JB25I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG6JB25I requirements.
6.How does Aetrix verify that W972GG6JB25I is sourced from the original manufacturer or authorized distributors?
All W972GG6JB25I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG6JB25I meets industry standards.
7.What is the process for return or replacement of W972GG6JB25I?
All W972GG6JB25I units undergo pre-shipment inspection (PSI). If there is an issue with W972GG6JB25I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W972GG6JB25I part is unused and in its original packaging.
Return procedure for W972GG6JB25I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W972GG6JB25I Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

.jpg)