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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W972GG6JB-3I TR

Name: W972GG6JB-3I TR
Brand: Winbond Electronics Corporation
SKU: W972GG6JB-3I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W972GG6JB-3I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 84-TFBGA

Datasheet:: W972GG6JB-3I TR.pdf

Description:: IC DRAM 2GBIT PARALLEL 84WBGA

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Product details

Overview

W972GG6JB-3I TR from Winbond is a 2Gb (128M × 16) DDR2 SDRAM organized as 16M words × 8 banks × 16 bits, rated for DDR2-667 (5-5-5) operation at -40°C to +95°C industrial temperature range, with 1.8 V ±0.1 V core and I/O supply, and integrated On-Die Termination (ODT) and Off-Chip Driver (OCD) impedance control.

For engineers reviewing the W972GG6JB-3I TR datasheet, W972GG6JB-3I TR pinout, W972GG6JB-3I TR application, or W972GG6JB-3I TR equivalent, this device serves as a drop-in-compatible industrial-grade memory component in embedded controllers, network interface cards, and industrial HMIs requiring JEDEC-compliant DDR2 timing, stable high-temperature refresh behavior, and source-synchronous DQS-aligned data transfer.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with DLL-aligned DQ/DQS timing, programmable CAS latency (CL = 3–7), additive latency (AL = 0–2), and write latency WL = RL − 1. It supports burst lengths of 4 and 8, posted CAS, auto-precharge, and both self-refresh and auto-refresh modes.

Functional operation relies on three extended mode registers (EMR1–EMR3) for configuring OCD calibration, ODT enable/disable, DLL enable/disable, and differential strobe mode, alongside a standard mode register for CL, BL, burst type, and WR. All commands-including activate, read, write, precharge, and refresh-are decoded synchronously on the rising edge of CLK relative to CLK.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	2 Gb (128M × 16), 16M words × 8 banks × 16 bits - defines usable capacity and bank-level parallelism for interleaved access.
Data Rate	DDR2-667 (333 MHz clock, 667 MT/s per pin) - sets maximum sustained bandwidth and system timing budget.
CAS Latency	CL = 3, 4, 5, 6, or 7 - directly determines minimum read access latency in clock cycles; CL=5 used for DDR2-667 compliance.
Supply Voltage	VDD/VDDQ = 1.8 V ± 0.1 V - mandates compatible 1.8 V power delivery and level-shifting for address/control/data buses.
Operating Temperature	-40°C ≤ TCASE ≤ 95°C - enables deployment in extended-temperature industrial environments without derating.
tREFI Refresh Interval	3.9 µs at 85°C < TCASE ≤ 95°C - requires doubled refresh command frequency versus standard JEDEC spec to maintain data retention.
Interface Standard	SSTL_18 - defines input threshold, output drive strength, and termination requirements for signal integrity.

Pinout & Package

Packaged in 84-ball WBGA (11 mm × 13 mm, 0.8 mm pitch), lead-free and RoHS-compliant, with separate VDD/VSS and VDDQ/VSSQ power/ground domains for noise isolation and signal integrity.

Pin/Terminal	Circuit Role	Design Meaning
A0–A13	Address Input	Row/column address bus; A10 controls auto-precharge on read/write commands.
BA0–BA2	Bank Select	Selects one of eight internal banks for concurrent row activation and independent access.
DQ0–DQ15	Bidirectional Data Bus	16-bit wide data path; supports byte masking via LDM/UDM during writes.
LDQS / UDQS	Lower/Upper Byte Data Strobe	Differential source-synchronous strobes aligned to DQ0–DQ7 and DQ8–DQ15; edge-aligned on reads, center-aligned on writes.
CLK / CLK	Differential Clock Input	Defines all synchronous timing; inputs latched at crossing of CLK rising and CLK falling edges.
CKE	Clock Enable	Asynchronous gate controlling internal clock tree activation; LOW disables all operations except self-refresh.
CS, RAS, CAS, WE	Command Inputs	Encoded command bus; CS enables rank selection; RAS/CAS/WE define active, read, write, precharge, refresh.
ODT	On-Die Termination Control	Active-HIGH signal enabling internal termination resistors on DQ/DQS lines to reduce stub reflections.
VREF	Input Reference Voltage	Reference for SSTL_18 input thresholds; must be maintained at VDDQ/2 ± 300 mV for valid logic sampling.

Key Features

Feature	Design Value
On-Die Termination (ODT)	Configurable termination resistance on DQ/DQS pins eliminates need for external parallel termination, reducing PCB routing complexity and improving signal integrity at 333 MHz.
Off-Chip Driver (OCD) Calibration	Programmable output driver impedance matching via EMR1 allows dynamic tuning to trace impedance, minimizing overshoot/undershoot in high-speed layouts.
Differential DQS Strobes	Separate LDQS/UDQS pairs for lower/upper bytes support source-synchronous timing with precise edge- and center-alignment-critical for reliable DDR2-667 timing closure.
Industrial Temperature Support	Guaranteed operation from -40°C to +95°C with validated tREFI = 3.9 µs refresh interval ensures data retention in harsh thermal environments without firmware intervention.
Auto-Precharge & Burst Modes	Hardware-controlled auto-precharge on burst reads/writes reduces command overhead and enables efficient sequential access across rows within same bank.

Applications

Industrial HMI Systems	Network Interface Cards
Use Scenario: Touchscreen-based human-machine interfaces in factory automation panels operating continuously at ambient temperatures up to 95°C. IC Role / Device Role / Timing Role: Primary program/data memory for ARM Cortex-A8/A9 SoCs, providing low-latency access to GUI assets and real-time control buffers. Use Value: Industrial temperature rating and guaranteed 3.9 µs refresh interval eliminate thermal-induced data loss, while ODT/OCD support clean signal integrity on compact 4-layer PCBs.	Use Scenario: Gigabit Ethernet adapters in telecom edge routers requiring deterministic packet buffering and DMA coherency. IC Role / Device Role / Timing Role: Shared packet buffer memory interfaced to MAC controller via DDR2 PHY, supporting burst transfers aligned to 64-byte cache lines. Use Value: DDR2-667 bandwidth meets line-rate buffering needs; differential DQS alignment and programmable CL ensure timing margin under variable load conditions.
Embedded Media Processors	Medical Imaging Controllers
Use Scenario: Video decode pipelines in digital signage players handling 1080p H.264 streams with real-time OSD overlay rendering. IC Role / Device Role / Timing Role: Frame buffer and intermediate decode buffer for video processing ASICs, accessed via AXI or similar bus bridges. Use Value: 16-bit bus width and 8-burst capability match typical video line widths; auto-precharge minimizes latency between successive macroblock fetches.	Use Scenario: Ultrasound beamforming modules where raw ADC data must be buffered before FPGA-based filtering and reconstruction. IC Role / Device Role / Timing Role: High-reliability temporary storage for time-critical sensor data, interfaced to FPGA fabric with strict setup/hold timing constraints. Use Value: SSTL_18 compatibility and DLL-aligned DQ/DQS ensure robust timing closure at 333 MHz; industrial temp grade supports sealed chassis with passive cooling.

Industrial HMI Systems

Network Interface Cards

Use Scenario: Touchscreen-based human-machine interfaces in factory automation panels operating continuously at ambient temperatures up to 95°C.

IC Role / Device Role / Timing Role: Primary program/data memory for ARM Cortex-A8/A9 SoCs, providing low-latency access to GUI assets and real-time control buffers.

Use Value: Industrial temperature rating and guaranteed 3.9 µs refresh interval eliminate thermal-induced data loss, while ODT/OCD support clean signal integrity on compact 4-layer PCBs.

Use Scenario: Gigabit Ethernet adapters in telecom edge routers requiring deterministic packet buffering and DMA coherency.

IC Role / Device Role / Timing Role: Shared packet buffer memory interfaced to MAC controller via DDR2 PHY, supporting burst transfers aligned to 64-byte cache lines.

Use Value: DDR2-667 bandwidth meets line-rate buffering needs; differential DQS alignment and programmable CL ensure timing margin under variable load conditions.

Embedded Media Processors

Medical Imaging Controllers

Use Scenario: Video decode pipelines in digital signage players handling 1080p H.264 streams with real-time OSD overlay rendering.

IC Role / Device Role / Timing Role: Frame buffer and intermediate decode buffer for video processing ASICs, accessed via AXI or similar bus bridges.

Use Value: 16-bit bus width and 8-burst capability match typical video line widths; auto-precharge minimizes latency between successive macroblock fetches.

Use Scenario: Ultrasound beamforming modules where raw ADC data must be buffered before FPGA-based filtering and reconstruction.

IC Role / Device Role / Timing Role: High-reliability temporary storage for time-critical sensor data, interfaced to FPGA fabric with strict setup/hold timing constraints.

Use Value: SSTL_18 compatibility and DLL-aligned DQ/DQS ensure robust timing closure at 333 MHz; industrial temp grade supports sealed chassis with passive cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MT47H128M16HR-3E IT:C	Same density (2Gb), DDR2-667, but uses 96-ball FBGA; CL=5 fixed; no OCD calibration; only supports -40°C to +90°C.	Limited to designs with larger board area and existing Micron DDR2 layout; lacks dynamic driver tuning for marginal traces.	Choose when footprint compatibility with legacy Micron designs exists and OCD is not required.
IS42S16160F-3BLI	Same 84-ball WBGA package and industrial temp range; DDR2-667; CL=5; includes ODT but no OCD; tREFI = 7.8 µs max at 95°C (requires external refresh management).	Suitable for cost-sensitive industrial systems where external refresh control is acceptable and driver tuning is unnecessary.	Choose when pinout compatibility is critical and simplified register configuration is preferred over OCD flexibility.

Compared with MT47H128M16HR-3E IT:C and IS42S16160F-3BLI, the W972GG6JB-3I TR uniquely combines 84-ball WBGA compatibility, full OCD calibration, and guaranteed 3.9 µs tREFI at 95°C-enabling robust, layout-efficient DDR2 integration in thermally constrained industrial systems without external timing compensation.

Availability

W972GG6JB-3I TR is available at Aetrix Electronics and suitable for industrial HMIs, network interface cards, embedded media processors, and medical imaging controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W972GG6JB-3I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory, flash, and logic ICs, with global distribution and automotive/industrial qualification programs.

The W972GG6JB-3I TR belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for embedded systems demanding extended temperature operation, JEDEC compliance, and signal integrity features like ODT and OCD calibration.

FAQ

What is the maximum operating temperature supported by the W972GG6JB-3I TR?

The W972GG6JB-3I TR is fully specified and guaranteed to operate from -40°C to +95°C case temperature. At temperatures above 85°C, it requires doubling the auto-refresh command frequency to maintain tREFI = 3.9 µs, which is enabled via EMR(2) bit A7. This behavior is validated per JEDEC JESD79-2F and documented in the official Winbond datasheet revision A03.

Does the W972GG6JB-3I TR support differential DQS signaling?

Yes, the W972GG6JB-3I TR supports differential DQS signaling via dedicated LDQS/LDQS and UDQS/UDQS ball pairs. This mode is enabled through EMR(1) configuration (A10 = HIGH), and provides edge-aligned read strobes and center-aligned write strobes-essential for achieving timing margin at DDR2-667 speeds. The default single-ended mode remains available if differential routing is not implemented.

How does On-Die Termination (ODT) function on the W972GG6JB-3I TR?

ODT on the W972GG6JB-3I TR is controlled by the ODT pin (Ball K9), which enables internal termination resistors on DQ, DQS, and DM lines when driven HIGH. Termination values are set via EMR(1) bits A1–A0 and are configurable to 75 Ω, 150 Ω, or 50 Ω (depending on VDDQ). This eliminates the need for external parallel termination resistors and improves signal integrity on point-to-point or fly-by DDR2 topologies.

What is the purpose of OCD calibration in the W972GG6JB-3I TR?

OCD (Off-Chip Driver) calibration in the W972GG6JB-3I TR adjusts the output driver impedance of DQ/DQS pins to match PCB trace impedance-typically 50 Ω. It is executed via a dedicated initialization sequence after power-up and uses EMR(1) to store calibrated values. This feature compensates for process/voltage/temperature variation and reduces signal distortion, especially critical in high-density industrial PCBs with tight routing constraints.

Can the W972GG6JB-3I TR be used as a direct replacement for the W972GG6JB-3?

Yes, the W972GG6JB-3I TR is a direct replacement for the commercial-grade W972GG6JB-3 in industrial applications, sharing identical pinout, timing parameters, and electrical specifications-except for extended temperature support (-40°C to +95°C vs. 0°C to +85°C) and mandatory 3.9 µs tREFI at high temperature. No PCB or firmware changes are required beyond verifying refresh controller configuration for elevated temperature operation.

W972GG6JB-3I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 84-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM - DDR2

Memory Size:: 2Gbit

Memory Organization:: 128M x 16

Memory Interface:: Parallel

Clock Frequency:: 333 MHz

Write Cycle Time - Word, Page:: 15ns

Access Time:: 60 ns

Voltage - Supply:: 1.7V ~ 1.9V

Operating Temperature:: -40°C ~ 95°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 84-WBGA (11x13)

W972GG6JB-3I TR FAQ

1.How can I place an order for W972GG6JB-3I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W972GG6JB-3I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W972GG6JB-3I TR reliable?

The price and inventory of W972GG6JB-3I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG6JB-3I TR is usually 5 days.

3.What payment methods are accepted for W972GG6JB-3I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG6JB-3I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W972GG6JB-3I TR?

W972GG6JB-3I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W972GG6JB-3I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W972GG6JB-3I TR?

For technical support, including W972GG6JB-3I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG6JB-3I TR requirements.

6.How does Aetrix verify that W972GG6JB-3I TR is sourced from the original manufacturer or authorized distributors?

All W972GG6JB-3I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG6JB-3I TR meets industry standards.

7.What is the process for return or replacement of W972GG6JB-3I TR?

All W972GG6JB-3I TR units undergo pre-shipment inspection (PSI). If there is an issue with W972GG6JB-3I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W972GG6JB-3I TR part is unused and in its original packaging.

Return procedure for W972GG6JB-3I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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