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Winbond Electronics Corporation W972GG6KB-18

Part No.:
W972GG6KB-18
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
84-TFBGA
Datasheet:
AetrixW972GG6KB-18.pdf
Description:
IC DRAM 2GBIT PAR 84WBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,559

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Product details

Overview

W972GG6KB-18 from Winbond is a 2Gb (128M × 16) DDR2 SDRAM organized as 16M words × 8 banks × 16 bits, compliant with JEDEC DDR2-1066 (7-7-7) timing, operating at 1.8 V ± 0.1 V supply, and supporting CAS latencies of 3–7 for use in embedded computing, industrial controllers, and legacy communication baseband modules.

For engineers reviewing the W972GG6KB-18 datasheet, W972GG6KB-18 pinout, W972GG6KB-18 application, or W972GG6KB-18 equivalent, key selection considerations include its -18 speed grade timing (tCK = 1.875 ns min @ CL=7), on-die termination (ODT), OCD impedance calibration, differential clock interface (CLK/CLK), and WBGA-84 package compatibility with DDR2 memory subsystems requiring stable 1066 Mb/s/pin throughput.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with DLL-aligned DQ/DQS timing and source-synchronous I/O referenced to edge-aligned read data and center-aligned write data. It supports programmable additive latency (AL=0–2), burst lengths of 4 or 8, and write latency WL = RL − 1.

Functional operation includes auto-precharge, self-refresh and power-down modes (precharged/active), ODT control via dedicated ODT pin, and OCD calibration using EMR(1) with A7–A9. The device integrates eight independent 16-bit banks, each with row/column decoders, sense amplifiers, and prefetch buffers feeding a 16-bit bidirectional DQ bus.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2 Gb (128M × 16), organized as 16M × 8 banks × 16 bits - defines usable capacity and bank-level parallelism.
Data Rate DDR2-1066 (1066 Mb/s/pin), tCK = 1.875 ns min @ CL=7 - sets maximum synchronous transfer bandwidth per pin.
Voltage Supply VDD/VDDQ/VDDL = 1.8 V ± 0.1 V - requires tight-regulated 1.8 V rail; VSSQ isolation improves DQ noise immunity.
CAS Latency CL = 3, 4, 5, 6, or 7 - directly impacts read access delay; CL=7 required for full DDR2-1066 compliance.
Burst Length BL = 4 or 8 - determines number of consecutive data transfers per READ/WRITE command; affects bus efficiency.
On-Die Termination ODT enabled via dedicated ODT pin (ball K9) - eliminates external termination resistors, reduces signal reflections on DQ/DQS lines.
Package WBGA-84 (8 mm × 12.5 mm, RoHS-compliant, lead-free) - surface-mount footprint compatible with standard DDR2 layout rules.
Operating Temp 0°C ≤ TCASE ≤ 85°C - commercial-grade thermal envelope; not rated for extended industrial range without derating.

Pinout & Package

W972GG6KB-18 is packaged in an 84-ball WBGA (8 mm × 12.5 mm) with ball pitch of 0.8 mm. Power and ground balls are distributed across the array to minimize simultaneous switching noise; VDDQ/VSSQ pairs isolate DQ I/O supply domains.

Pin/Terminal Circuit Role Design Meaning
A0–A13 Address Input Row address (A0–A13) and column address (A0–A9); A10 controls auto-precharge - enables bank-selective memory access.
BA0–BA2 Bank Select Selects one of eight internal banks for ACTIVE/READ/WRITE/PRECHARGE commands - enables interleaved access across banks.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus - supports 16-bit wide memory transactions; paired with UDQS/LDQS for byte-level strobing.
UDQS / LDQS Differential Data Strobe Source-synchronous strobes for upper (DQ8–DQ15) and lower (DQ0–DQ7) bytes - edge-aligned on reads, center-aligned on writes.
CLK / CLK Differential Clock Input Samples all address/control inputs at crossing points - ensures setup/hold margin under skew; required for DDR2 timing compliance.
ODT On-Die Termination Control Active-HIGH signal enabling internal termination resistors - dynamically configurable per access to match line impedance.
CS, RAS, CAS, WE Command Inputs Define command opcode (e.g., ACTIVE, READ, WRITE, PRECHARGE) with CS as rank enable - synchronous to CLK/CLK edges.
VREF Input Reference Voltage Reference for address/control input thresholds - must track VDDQ/2 ±300 mV to ensure reliable command decoding.

Key Features

Feature Design Value
Off-Chip Driver (OCD) Calibration EMR(1)-based impedance tuning (A7–A9) adjusts output driver strength to match PCB trace impedance - improves signal integrity without external resistors.
Programmable Additive Latency (AL) AL = 0, 1, or 2 configurable via EMR(1) - decouples command issuance from data availability, increasing command bus utilization in high-throughput systems.
Source-Synchronous DQS Timing DQS/DQS strobes aligned to DQ transitions - eliminates clock-to-out skew; enables reliable >533 MHz data capture at system level.
Power-Down Modes Precharged and Active Power Down reduce IDD6 to ≤10 mA - extends standby time in battery-backed or low-power industrial applications.
Auto-Refresh & Self-Refresh tREFI = 7.8 µS (0–85°C), halved to 3.9 µS at 85–95°C - maintains data retention without host intervention during idle periods.
Write Data Mask (DM) LDM/UDM pins mask individual byte lanes during WRITE - enables partial-word updates without read-modify-write cycles.

Applications

Industrial PLC Memory Buffer Legacy Telecom Baseband

Use Scenario: Real-time I/O data buffering in programmable logic controllers with deterministic scan cycle timing.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency DDR2 memory buffer interfacing with ARM9 or MIPS-based MCUs via 16-bit bus.

Use Value: DDR2-1066 throughput supports >800 MB/s sustained burst reads, enabling fast tag database access and motion control loop execution.

Use Scenario: Frame storage and channel processing in 3G BTS baseband units using fixed-function DSPs.

IC Role / Device Role / Timing Role: Shared memory resource for multi-DSP data exchange and packet buffering in TD-SCDMA/LTE-FDD legacy platforms.

Use Value: On-die termination and OCD calibration maintain signal integrity across long PCB traces typical in telecom backplanes.

Medical Imaging Display Controller Automotive Infotainment Head Unit

Use Scenario: Frame buffer for high-resolution diagnostic display subsystems requiring flicker-free rendering.

IC Role / Device Role / Timing Role: Dedicated video memory mapped to GPU or display controller with burst-length-8 read optimization.

Use Value: CL=5/6 configuration delivers sub-15 ns read latency, enabling real-time pixel streaming at 1280×1024@60 Hz.

Use Scenario: Application code and UI asset storage in legacy automotive head units based on Freescale MPC5xxx SoCs.

IC Role / Device Role / Timing Role: Boot-time loaded program memory and runtime heap expansion for Linux-based infotainment stacks.

Use Value: WBGA-84 footprint and commercial temp rating align with automotive Tier-2 module design constraints and reflow profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT47H128M16HR-37E 1 Gb density (64M × 16), DDR2-800 (6-6-6), tCK = 2.5 ns min - lower bandwidth and capacity than W972GG6KB-18. Targeted at cost-sensitive consumer electronics where 1066 MT/s is unnecessary. Select when system clock budget allows ≥2.5 ns cycle time and 1 Gb capacity suffices.
IS42S16160F-6BLI 2 Gb density, DDR2-667 (5-5-5), tCK = 3.0 ns min - slower speed grade, wider tCK tolerance, industrial temp support (-40°C to +95°C). Suitable for extended-temperature deployments where DDR2-1066 timing margins are unattainable. Choose for harsh environments requiring guaranteed operation beyond 85°C case temperature.

Compared with W972GG6KB-18, MT47H128M16HR-37E offers lower cost and power but sacrifices 1066 MT/s performance and 2 Gb capacity; IS42S16160F-6BLI matches density and adds industrial temp range but trades 33% bandwidth reduction for thermal robustness.

Availability

W972GG6KB-18 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, legacy telecom baseband modules, medical imaging display controllers, and automotive infotainment head units requiring stable component supply across extended production lifecycles.

Supply support for W972GG6KB-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design heritage and JEDEC-compliant product validation.

The W972GG6KB series belongs to Winbond's DDR2 SDRAM product line, engineered for drop-in compatibility with legacy DDR2 memory controllers in industrial, networking, and medical equipment where long-term availability and JEDEC specification adherence are critical.

FAQ

What is the maximum data rate supported by W972GG6KB-18?

W972GG6KB-18 supports DDR2-1066 operation with a minimum clock period (tCK) of 1.875 ns at CAS Latency 7, delivering up to 1066 Mb/s per pin. This is validated per JEDEC specification JESD79-2F and confirmed in the -18 speed grade binning on page 5 of the datasheet.

Does W972GG6KB-18 require external termination resistors?

No. W972GG6KB-18 integrates on-die termination (ODT) controlled by the ODT pin (ball K9). When asserted HIGH, it enables internal termination resistors on DQ/DQS lines, eliminating the need for external resistors and simplifying PCB layout.

What is the purpose of the VREF pin on W972GG6KB-18?

The VREF pin (ball J2) provides the reference voltage for address and control input receivers. It must be maintained at VDDQ/2 ±300 mV to ensure correct logic threshold detection; deviation beyond this range risks command decode errors or initialization failure.

Can W972GG6KB-18 operate in self-refresh mode at 95°C case temperature?

Yes - but only when configured per note 4 on page 5: EMR(2) bit A7 must be set to "1", and auto-refresh interval must be halved to tREFI = 3.9 µS (i.e., doubled refresh frequency). This is explicitly supported for -18-grade parts at 85–95°C.

How many banks does W972GG6KB-18 have, and how are they selected?

W972GG6KB-18 contains eight independent memory banks, selected using the BA0–BA2 signals (balls L2, L3, L1). Each ACTIVE, READ, WRITE, or PRECHARGE command targets exactly one bank, enabling bank-interleaved access to improve effective bandwidth.

W972GG6KB-18 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
84-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
2Gbit
Memory Organization:
128M x 16
Memory Interface:
Parallel
Clock Frequency:
533 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
58.125 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-WBGA (8x12.5)

W972GG6KB-18 FAQ

1.How can I place an order for W972GG6KB-18 through Aetrix?

Please submit a Request for Quotation (RFQ) for W972GG6KB-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W972GG6KB-18 reliable?

The price and inventory of W972GG6KB-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG6KB-18 is usually 5 days.

3.What payment methods are accepted for W972GG6KB-18?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG6KB-18 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W972GG6KB-18?

W972GG6KB-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W972GG6KB-18 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W972GG6KB-18?

For technical support, including W972GG6KB-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG6KB-18 requirements.

6.How does Aetrix verify that W972GG6KB-18 is sourced from the original manufacturer or authorized distributors?

All W972GG6KB-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG6KB-18 meets industry standards.

7.What is the process for return or replacement of W972GG6KB-18?

All W972GG6KB-18 units undergo pre-shipment inspection (PSI). If there is an issue with W972GG6KB-18, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W972GG6KB-18 part is unused and in its original packaging.

Return procedure for W972GG6KB-18:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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