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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W972GG6KB-18 TR

Name: W972GG6KB-18 TR
Brand: Winbond Electronics Corporation
SKU: W972GG6KB-18 TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W972GG6KB-18 TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 84-TFBGA

Datasheet:: W972GG6KB-18 TR.pdf

Description:: IC DRAM 2GBIT PAR 84WBGA

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Product details

Overview

W972GG6KB-18 TR from Winbond Electronics is a 2Gb (16M × 8 banks × 16-bit) DDR2 SDRAM compliant with JEDEC DDR2-1066 (7-7-7) timing, operating at 1.8 V ± 0.1 V supply, supporting CAS Latency 3–7 and burst lengths of 4 or 8. It delivers 1066 Mb/sec/pin data rates and is used in embedded networking, industrial HMIs, and legacy computing platforms requiring high-density, low-voltage DDR2 memory.

For engineers reviewing the W972GG6KB-18 TR datasheet, W972GG6KB-18 TR pinout, W972GG6KB-18 TR application, or W972GG6KB-18 TR equivalent, key selection criteria include DDR2-1066 timing compliance, WBGA-84 ball package compatibility, SSTL_18 interface voltage tolerance, and support for OCD calibration and ODT-controlled signal integrity in multi-drop memory channels.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 533 MHz operation (tCK = 1.875 ns min at CL=7).

The device supports programmable additive latency (AL=0–2), auto-precharge, on-die termination (ODT), and off-chip driver (OCD) impedance adjustment via EMR(1). It features four power-down modes-precharged, active, self-refresh, and burst refresh-with IDD6 ≤ 10 mA at TCASE ≤ 85°C.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	2 Gb (16,777,216 words × 8 banks × 16 bits); enables 256 MB of 16-bit wide memory per chip in system designs.
Data Rate	DDR2-1066 (533 MHz clock, 1066 MT/s); supports high-bandwidth interfaces in legacy x86 and ARM-based controllers.
CAS Latency	Programmable CL = 3–7; allows tuning for timing margin vs. latency trade-offs in varying PCB trace lengths and load conditions.
Burst Length	BL = 4 or 8; matches standard DDR2 controller burst patterns for cache line transfers and sequential access efficiency.
Supply Voltage	VDD/VDDQ = 1.8 V ± 0.1 V; requires tightly regulated 1.8 V rail with separate VDDQ for I/O noise isolation.
Package	WBGA-84 (8 mm × 12.5 mm, 0.8 mm pitch); surface-mount compatible with standard reflow profiles and IPC-7351B footprint.
Operating Temp	0°C ≤ TCASE ≤ 85°C; validated for commercial-temperature industrial applications without derating.
Interface Standard	SSTL_18; mandates 1.8 V reference-compatible drivers/receivers and controlled-impedance routing (Z₀ ≈ 50 Ω).

Pinout & Package

W972GG6KB-18 TR uses an 84-ball WBGA package (8 mm × 12.5 mm, 0.8 mm pitch) with lead-free, RoHS-compliant construction. Ball layout follows JEDEC MO-245AC, with dedicated VSSQ/VDDQ planes for I/O power integrity and isolated VDDL/VSSDL for DLL circuitry.

Pin/Terminal	Circuit Role	Design Meaning
A0–A13	Address Inputs	Row/column address bus; A10 controls auto-precharge on read/write commands-critical for bank management in burst sequences.
BA0–BA2	Bank Select	3-bit bank address; selects one of eight internal banks for concurrent activation-enables interleaved access to hide tRC latency.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte-level masking via LDM/UDM-essential for partial writes without read-modify-write cycles.
LDQS / UDQS	Differential Data Strobe	Source-synchronous strobes for lower/upper bytes; edge-aligned on reads, center-aligned on writes-enables precise timing capture at 533 MHz.
CLK / CLK	Differential Clock Input	Primary timing reference; all commands latched at crossing points-requires matched-length differential routing and 100 Ω termination.
ODT	On-Die Termination Control	Active-HIGH register-controlled termination; dynamically enables 75 Ω or 150 Ω resistors on DQ/DQS lines to suppress reflections in point-to-point or stubbed topologies.
CKE	Clock Enable	Asynchronous enable for internal clock tree; LOW disables DLL and enters power-down-used for dynamic power gating during idle periods.
VREF	Input Reference Voltage	Mid-supply reference (VDDQ/2 ± 300 mV); sets switching threshold for all address/control inputs-must be decoupled and routed as analog-sensitive net.

Key Features

Feature	Design Value
Programmable Additive Latency (AL)	AL = 0–2 configurable via EMR(1); decouples command issuance from data availability-improves bus utilization when tRCD > tRP.
OCD Impedance Calibration	Adjusts output driver strength to match PCB trace impedance (±10%); reduces signal overshoot/undershoot and improves eye opening at 533 MHz.
On-Die Termination (ODT)	Configurable 75 Ω / 150 Ω termination on DQ/DQS pins; eliminates external resistors and simplifies routing in multi-rank DIMMs or SoC memory interfaces.
Auto-Precharge	Automatic bank precharge triggered by burst end; removes software overhead for explicit PRE commands-reduces latency in sequential access patterns.
DLL-Enabled Timing Alignment	Digital delay-locked loop locks DQ/DQS phase to CLK; maintains setup/hold margins across voltage/temperature-required for stable DDR2-1066 operation.
Four Power-Down Modes	Precharged PD, Active PD, Self Refresh, Burst Refresh; enables <10 mA standby current (IDD6) while preserving data-critical for low-power industrial gateways.

Applications

Industrial HMI Controllers	Legacy Networking Routers
Use Scenario: Touch-enabled factory-floor HMIs running real-time Linux with GUI rendering and local data logging. IC Role / Device Role / Timing Role: Primary program/data memory for ARM Cortex-A8/A9 SoCs; provides 256 MB of 16-bit DDR2 bandwidth at 1066 MT/s. Use Value: DDR2-1066 timing headroom accommodates longer PCB traces in metal-enclosed enclosures, while ODT and OCD ensure signal integrity without external termination components.	Use Scenario: Fixed-configuration enterprise routers using MIPS-based network processors with integrated DDR2 controllers. IC Role / Device Role / Timing Role: System memory for packet buffering, ACL table storage, and firmware execution; operates in dual-rank configuration with matched tRCD/tRP. Use Value: Programmable CL and AL allow fine-tuning to match processor-specific timing constraints, reducing timing closure effort during board bring-up.
Medical Diagnostic Terminals	Automated Test Equipment (ATE)
Use Scenario: Portable ultrasound imaging terminals requiring deterministic memory access for real-time image reconstruction pipelines. IC Role / Device Role / Timing Role: Frame buffer and processing scratchpad memory; leverages burst interleaving across 8 banks to sustain >800 MB/s throughput. Use Value: Auto-precharge and bank interleave reduce effective tRC latency, enabling consistent frame rate delivery under variable workload conditions.	Use Scenario: Modular ATE mainframes performing high-speed digital pattern generation and acquisition with tight jitter budgets. IC Role / Device Role / Timing Role: High-reliability memory for test vector storage and result buffering; operates in extended temperature range with full AC spec compliance. Use Value: WBGA-84 package withstands thermal cycling in production test environments, while IDD7 ≤ 280 mA ensures stable power delivery during burst-intensive test sequences.

Industrial HMI Controllers

Legacy Networking Routers

Use Scenario: Touch-enabled factory-floor HMIs running real-time Linux with GUI rendering and local data logging.

IC Role / Device Role / Timing Role: Primary program/data memory for ARM Cortex-A8/A9 SoCs; provides 256 MB of 16-bit DDR2 bandwidth at 1066 MT/s.

Use Value: DDR2-1066 timing headroom accommodates longer PCB traces in metal-enclosed enclosures, while ODT and OCD ensure signal integrity without external termination components.

Use Scenario: Fixed-configuration enterprise routers using MIPS-based network processors with integrated DDR2 controllers.

IC Role / Device Role / Timing Role: System memory for packet buffering, ACL table storage, and firmware execution; operates in dual-rank configuration with matched tRCD/tRP.

Use Value: Programmable CL and AL allow fine-tuning to match processor-specific timing constraints, reducing timing closure effort during board bring-up.

Medical Diagnostic Terminals

Automated Test Equipment (ATE)

Use Scenario: Portable ultrasound imaging terminals requiring deterministic memory access for real-time image reconstruction pipelines.

IC Role / Device Role / Timing Role: Frame buffer and processing scratchpad memory; leverages burst interleaving across 8 banks to sustain >800 MB/s throughput.

Use Value: Auto-precharge and bank interleave reduce effective tRC latency, enabling consistent frame rate delivery under variable workload conditions.

Use Scenario: Modular ATE mainframes performing high-speed digital pattern generation and acquisition with tight jitter budgets.

IC Role / Device Role / Timing Role: High-reliability memory for test vector storage and result buffering; operates in extended temperature range with full AC spec compliance.

Use Value: WBGA-84 package withstands thermal cycling in production test environments, while IDD7 ≤ 280 mA ensures stable power delivery during burst-intensive test sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MT47H128M16HR-37E	1 Gb density (128M × 16), DDR2-800 (CL=5, tCK=2.5 ns), FBGA-84 package, same 1.8 V supply.	Limited to 800 MT/s; suitable only where bandwidth demand is ≤6.4 GB/s and board layout cannot support DDR2-1066 timing margins.	Select when cost sensitivity outweighs bandwidth needs and existing layout lacks DDR2-1066 signal integrity validation.
IS42S16160F-6BLI	2 Gb density, DDR2-667 (CL=5, tCK=3.0 ns), same WBGA-84 package, industrial temp (-40°C to +95°C).	Lower speed grade; requires relaxed tRCD/tRP (15 ns min) and higher tREFI (7.8 µs) - less demanding on controller PLL and refresh scheduling.	Choose for extended-temperature deployments where DDR2-1066 stability cannot be guaranteed across full thermal range.

Compared with MT47H128M16HR-37E and IS42S16160F-6BLI, W972GG6KB-18 TR delivers 33% higher peak bandwidth and tighter timing (7-7-7 vs. 5-5-5), but demands stricter layout control and higher refresh rate at elevated temperatures-making it optimal for performance-critical commercial-temperature applications with validated DDR2-1066 channel design.

Availability

W972GG6KB-18 TR is available at Aetrix Electronics and suitable for industrial HMIs, legacy networking equipment, and medical diagnostic terminals requiring stable component supply, long-lifecycle support, and JEDEC-compliant DDR2-1066 memory performance.

Supply support for W972GG6KB-18 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM products for industrial, automotive, and communications markets.

W972GG6KB-18 TR belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-sensitive, high-reliability embedded systems needing JEDEC-compliant DDR2 memory with extended longevity and commercial-temperature robustness.

FAQ

What is the maximum data rate supported by the W972GG6KB-18 TR?

The W972GG6KB-18 TR supports DDR2-1066 operation, delivering a maximum data rate of 1066 megatransfers per second per pin. This corresponds to a 533 MHz clock frequency with a minimum clock period (tCK) of 1.875 ns at CAS Latency 7. The -18 speed grade is fully compliant with JEDEC specification JESD79-2F for DDR2-1066 (7-7-7) timing parameters.

Does the W972GG6KB-18 TR support on-die termination (ODT)?

Yes, the W972GG6KB-18 TR supports programmable on-die termination (ODT) via the ODT pin and Extended Mode Register EMR(1). It offers selectable termination resistance values (75 Ω or 150 Ω) on DQ and DQS pins to improve signal integrity in point-to-point and multi-drop memory configurations without requiring external resistors.

What package type and ball count does the W972GG6KB-18 TR use?

The W972GG6KB-18 TR uses a lead-free, RoHS-compliant WBGA (Wafer-Level Ball Grid Array) package with 84 solder balls arranged in an 8 mm × 12.5 mm footprint and 0.8 mm pitch. This package conforms to JEDEC MO-245AC and supports standard reflow soldering processes used in high-volume electronics manufacturing.

Can the W972GG6KB-18 TR operate in industrial temperature ranges?

No-the W972GG6KB-18 TR is rated for 0°C ≤ TCASE ≤ 85°C only. For industrial temperature operation (-40°C to +95°C), Winbond offers the W972GG6KB-25I and W972GG6KB-3I variants, which are functionally identical but qualified across the extended range with doubled refresh rate at high temperature.

What is the role of the VREF pin on the W972GG6KB-18 TR?

The VREF pin on the W972GG6KB-18 TR provides the reference voltage for all address, command, and control input receivers. It must be maintained at VDDQ/2 ± 300 mV and decoupled with low-ESR capacitance. Accurate VREF tracking is mandatory for reliable command decoding and prevents false command latching during voltage transients or noise events.

W972GG6KB-18 TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 84-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM - DDR2

Memory Size:: 2Gbit

Memory Organization:: 128M x 16

Memory Interface:: Parallel

Clock Frequency:: 533 MHz

Write Cycle Time - Word, Page:: 15ns

Access Time:: 58.125 ns

Voltage - Supply:: 1.7V ~ 1.9V

Operating Temperature:: 0°C ~ 85°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 84-WBGA (8x12.5)

W972GG6KB-18 TR FAQ

1.How can I place an order for W972GG6KB-18 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W972GG6KB-18 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W972GG6KB-18 TR reliable?

The price and inventory of W972GG6KB-18 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG6KB-18 TR is usually 5 days.

3.What payment methods are accepted for W972GG6KB-18 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG6KB-18 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W972GG6KB-18 TR?

W972GG6KB-18 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W972GG6KB-18 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W972GG6KB-18 TR?

For technical support, including W972GG6KB-18 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG6KB-18 TR requirements.

6.How does Aetrix verify that W972GG6KB-18 TR is sourced from the original manufacturer or authorized distributors?

All W972GG6KB-18 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG6KB-18 TR meets industry standards.

7.What is the process for return or replacement of W972GG6KB-18 TR?

All W972GG6KB-18 TR units undergo pre-shipment inspection (PSI). If there is an issue with W972GG6KB-18 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W972GG6KB-18 TR part is unused and in its original packaging.

Return procedure for W972GG6KB-18 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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