Winbond Electronics Corporation W972GG8JB-25
- Part No.:
- W972GG8JB-25
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W972GG8JB-25.pdf
- Description:
- IC DRAM 2GBIT PARALLEL 60WBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W972GG8JB-25 from Winbond is a 2G-bit DDR2 SDRAM organized as 32M × 8 banks × 8 bits, operating at DDR2-800 speed (5-5-5 or 6-6-6 timing), with 1.8 V ±0.1 V supply, SSTL_18 interface, and support for CAS latencies 3–7. It serves as main memory in embedded computing, industrial controllers, and legacy networking equipment requiring reliable synchronous DRAM with on-die termination and OCD calibration.
For engineers reviewing the W972GG8JB-25 datasheet, W972GG8JB-25 pinout, W972GG8JB-25 application, or W972GG8JB-25 equivalent, key selection considerations include its -25 speed grade timing compliance, WBGA-60 package footprint, ODT and OCD programmability, burst length flexibility (4/8), and industrial-grade thermal compatibility up to 85°C case temperature.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned to read data and center-aligned to write data. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 400 MHz (200 MHz clock) operation under DDR2-800 timing.
It supports programmable additive latency (AL = 0–2), auto-precharge, self-refresh, and power-down modes (active and precharged). Command decoding uses CS, RAS, CAS, WE, and BA0–BA2, with address A0–A14 selecting rows/columns and A10 controlling auto-precharge - all latched on differential clock crossings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (32M words × 8 banks × 8 bits); enables 256 MB byte-addressable memory space per device. |
| Data Rate | 800 Mb/s per pin (DDR2-800); requires 200 MHz differential clock with tCK = 2.5–8 ns depending on CL. |
| CAS Latency | Programmable CL = 3, 4, 5, 6, or 7; determines minimum clock cycles between READ command and first valid data output. |
| Burst Length | Configurable BL = 4 or 8; defines number of consecutive data transfers per READ/WRITE command. |
| Supply Voltage | VDD/VDDQ/VDDL = 1.8 V ±0.1 V; mandates tight regulation and separate DQ power domain (VDDQ/VSSQ) for signal integrity. |
| On-Die Termination | ODT pin-controlled termination (Rtt = 75 Ω or 150 Ω); reduces stub reflections on high-speed DQ/DQS buses without external resistors. |
| OCD Calibration | Off-Chip Driver impedance adjustment via EMR(1); matches output driver strength to PCB trace impedance for optimal write eye margin. |
Pinout & Package
W972GG8JB-25 is packaged in a 60-ball WBGA (11 mm × 11.5 mm, 0.8 mm pitch), lead-free and RoHS-compliant. Ball layout follows JEDEC-standard DDR2 SDRAM pinout with dedicated VDDQ/VSSQ domains and isolated DLL power (VDDL/VSSDL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | Row/column address bus; A10 controls auto-precharge; all sampled on CLK/CLK crossing. |
| BA0–BA2 | Bank Select | Selects one of eight internal banks for ACTIVE/READ/WRITE/PRECHARGE commands. |
| DQ0–DQ7 | Data I/O | 8-bit bidirectional data bus; referenced to DQS/DQS; requires matched trace lengths for timing closure. |
| DQS / DQS | Differential Data Strobe | Source-synchronous strobe; edge-aligned to read data, center-aligned to write data; enables DDR timing margin. |
| ODT | On-Die Termination Control | Active-HIGH signal enabling internal termination resistor (75 Ω or 150 Ω) on DQ/DQS lines during reads/writes. |
| CS, RAS, CAS, WE | Command Inputs | Decode all DDR2 commands (e.g., ACTIVATE, READ, WRITE, PRECHARGE, REFRESH); sampled on CLK rising edge. |
| CLK / CLK | Differential Clock Input | Primary timing reference; all address/control inputs latched at crossing point; defines maximum 200 MHz base frequency. |
| CKE | Clock Enable | Gates internal clocking; LOW disables DLL and enters power-down; HIGH resumes synchronous operation. |
| DM/RDQS | Data Mask / Read Strobe | DM masks write data on both DQS edges; RDQS mode enabled via EMR(1)[A11] for differential read strobe function. |
| VREF | Input Reference Voltage | Midpoint reference (VDDQ/2 ±300 mV) for all address/control input thresholds; must be decoupled and stable. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CAS Latency (CL) | CL = 3–7 allows optimization for latency vs. bandwidth trade-offs across different controller designs and system clocks. |
| Auto-Precharge Support | Integrated auto-precharge on burst completion eliminates explicit PRECHARGE command overhead, simplifying memory controller logic. |
| On-Die Termination (ODT) | Configurable Rtt (75 Ω/150 Ω) reduces signal reflections on DQ/DQS lines, enabling robust 400 MT/s operation without external termination. |
| OCD Impedance Calibration | Adjusts DQ driver strength to match PCB impedance, improving write eye height and reducing timing skew across the byte lane. |
| Self-Refresh Mode | IDD6 ≤ 12 mA at TCASE ≤ 85°C enables low-power retention during system idle, critical for fanless industrial systems. |
Applications
| Industrial PLC Memory | Legacy Network Switch Buffer |
|---|---|
|
Use Scenario: Real-time control logic execution in programmable logic controllers with deterministic I/O response. IC Role / Device Role / Timing Role: Primary working memory for firmware execution and process data buffering; operates under DDR2-800 (5-5-5) timing with CL=5 for balanced latency and throughput. Use Value: Stable 85°C case temperature rating and ODT-enabled signal integrity ensure reliable operation in unventilated control cabinets. |
Use Scenario: Packet buffering and forwarding table storage in Layer 2 Ethernet switches using legacy DDR2-based SoCs. IC Role / Device Role / Timing Role: Shared system memory for switch fabric and management CPU; configured with BL=8 and AL=1 to maximize burst efficiency on sequential packet payloads. Use Value: Auto-precharge and posted CAS reduce command bus contention, increasing effective bandwidth for multi-port traffic bursts. |
| Medical Imaging Display Controller | Automotive Infotainment Head Unit |
|
Use Scenario: Frame buffer and UI rendering memory in diagnostic ultrasound or X-ray display subsystems. IC Role / Device Role / Timing Role: High-reliability video memory supporting dual-channel 16-bit interfaces; uses OCD calibration to maintain write margin across temperature drift. Use Value: WBGA-60 package minimizes board area while VDDQ/VSSQ isolation prevents display noise coupling into analog front-end circuits. |
Use Scenario: Application memory for infotainment OS and navigation stack in automotive head units with legacy DDR2 platforms. IC Role / Device Role / Timing Role: Main memory for ARM9/ARM11-based SoCs; configured with CL=4 and tRCD/tRP = 12.5 ns to meet automotive ECU timing budgets. Use Value: Self-refresh current ≤12 mA extends backup power hold-up time during ignition cycling, preserving UI state across restarts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H64M8CB-25E:H | Same density (512M × 8), DDR2-800, but FBGA-60 package with different ball map; no OCD calibration; fixed ODT only. | Requires PCB redesign due to incompatible pinout; lacks OCD tuning for marginal layouts. | Choose if migrating from Micron platform or when OCD is unnecessary and layout reuse is not required. |
| IS42S32800J-25BLI | 32M × 32-bit (1 Gb) configuration; wider bus; same -25 speed grade and WBGA-90 package; supports CL=4–6 only. | Delivers 4× data width per access but demands 32-bit controller interface and larger footprint. | Choose when higher bandwidth per cycle is needed and controller supports x32 interface; not drop-in compatible. |
Compared with W972GG8JB-25, MT47H64M8CB-25E:H offers identical timing but no OCD tuning, while IS42S32800J-25BLI trades pin compatibility for wider bus width - making W972GG8JB-25 optimal for cost-sensitive, space-constrained x8 DDR2 upgrades where signal integrity tuning is essential.
Availability
W972GG8JB-25 is available at Aetrix Electronics and suitable for industrial automation, legacy networking infrastructure, and medical display systems requiring stable component supply, long-lifecycle support, and verified DDR2-800 interoperability.
Supply support for W972GG8JB-25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and trusted computing solutions, with over 30 years of DRAM design heritage.
The W972GG8JB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, engineered for extended temperature operation, signal integrity robustness, and long-term availability in embedded systems where DDR3/DDR4 migration is impractical.
FAQ
What DDR2 speed grade does W972GG8JB-25 support?
W972GG8JB-25 supports DDR2-800 operation with two timing bin options: 5-5-5 (tRCD/tRP = 12.5 ns) or 6-6-6 (same parameters at relaxed timing). It achieves 400 MHz clock frequency with 800 MT/s data rate, validated across 0°C to 85°C case temperature range. The -25 suffix explicitly denotes this speed grade per Winbond's ordering nomenclature.
Does W972GG8JB-25 support on-die termination (ODT)?
Yes, W972GG8JB-25 supports ODT via the dedicated ODT pin, enabling programmable termination resistance (75 Ω or 150 Ω) on DQ and DQS lines during read/write operations. This feature eliminates need for external termination resistors and improves signal integrity on high-speed DDR2 buses - confirmed in Section 2 (Features) and Section 6 (Ball Description) of the datasheet.
What package type and footprint does W972GG8JB-25 use?
W972GG8JB-25 uses a 60-ball WBGA package measuring 11 mm × 11.5 mm with 0.8 mm pitch, lead-free and RoHS-compliant. Its ball map follows JEDEC-standard DDR2 SDRAM layout, including segregated VDDQ/VSSQ and VDDL/VSSDL domains - detailed in Sections 5 and 12 of the datasheet and verified on Winbond's official product page.
Can W972GG8JB-25 operate with CAS Latency 3?
Yes, W972GG8JB-25 supports CAS Latency 3 at DDR2-800 speed, with minimum tCK = 5 ns (200 MHz clock). This is explicitly listed in Table 4 (KEY PARAMETERS) under "@CL = 3" row, and confirmed in Section 2 (FEATURES) as "CAS Latency: 3, 4, 5, 6 and 7". CL=3 enables lowest read latency for real-time control applications.
Is OCD calibration supported on W972GG8JB-25?
Yes, W972GG8JB-25 supports Off-Chip Driver (OCD) impedance calibration via Extended Mode Register EMR(1), allowing fine-tuning of DQ output driver strength to match PCB trace impedance. This capability is documented in Section 2 (FEATURES), Section 8.2.3, and Figure 1 initialization flow - critical for achieving robust write timing margins in high-density layouts.
W972GG8JB-25 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 57.5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-WBGA (11x11.5)
W972GG8JB-25 FAQ
1.How can I place an order for W972GG8JB-25 through Aetrix?
Please submit a Request for Quotation (RFQ) for W972GG8JB-25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W972GG8JB-25 reliable?
The price and inventory of W972GG8JB-25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG8JB-25 is usually 5 days.
3.What payment methods are accepted for W972GG8JB-25?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG8JB-25 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W972GG8JB-25?
W972GG8JB-25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W972GG8JB-25 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W972GG8JB-25?
For technical support, including W972GG8JB-25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG8JB-25 requirements.
6.How does Aetrix verify that W972GG8JB-25 is sourced from the original manufacturer or authorized distributors?
All W972GG8JB-25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG8JB-25 meets industry standards.
7.What is the process for return or replacement of W972GG8JB-25?
All W972GG8JB-25 units undergo pre-shipment inspection (PSI). If there is an issue with W972GG8JB-25, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W972GG8JB-25 part is unused and in its original packaging.
Return procedure for W972GG8JB-25:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W972GG8JB-25 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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