Winbond Electronics Corporation W972GG8JB-3 TR

Overview

W972GG8JB-3 TR from Winbond Electronics is a 2G-bit DDR2 SDRAM organized as 32M × 8 banks × 8 bits, operating at DDR2-667 speed (5-5-5 timing), with 1.8 V ±0.1 V core and I/O supply, SSTL_18 interface, and support for CAS latencies 3–7. It serves as main memory in embedded industrial controllers requiring stable low-power operation under 0°C to 85°C.

For engineers reviewing the W972GG8JB-3 TR datasheet, W972GG8JB-3 TR pinout, W972GG8JB-3 TR application, or W972GG8JB-3 TR equivalent, key selection considerations include its -3 speed grade timing compliance, on-die termination (ODT), OCD impedance calibration, auto-precharge capability, and WBGA-60 package compatibility with legacy DDR2 memory interfaces.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling reliable high-speed signaling up to 333 MHz clock frequency (667 Mb/s/pin).

Functional control includes programmable additive latency (AL = 0–2), write latency = read latency − 1, burst lengths of 4 or 8, and extended mode registers (EMR1–EMR3) configuring ODT, OCD, RDQS enablement, and DLL state. Power management features include active and precharged power-down modes, self-refresh (max 12 mA at ≤85°C), and burst refresh.

Key Specifications

Pinout & Package

W972GG8JB-3 TR uses a 60-ball fine-pitch wafer-level ball grid array (WBGA) package measuring 11 mm × 11.5 mm with 0.8 mm ball pitch. The package supports standard DDR2 layout rules including separate VDDQ/VSSQ planes for data I/O noise isolation and dedicated VDDL/VSSDL for DLL circuitry.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Compared with MT47H64M8CF-3:H and IS42S16400F-3BL, W972GG8JB-3 TR offers optimal fit for space-constrained industrial designs needing 2G-bit in WBGA-60, direct SSTL_18 compatibility, and integrated ODT/OCD-without requiring layout changes or bus-width adaptation.

Availability

W972GG8JB-3 TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, medical imaging, and automotive infotainment systems requiring stable component supply, long-lifecycle support, and guaranteed DDR2-667 timing compliance.

Supply support for W972GG8JB-3 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM products for industrial, communications, and consumer markets.

The W972GG8JB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for applications demanding extended temperature operation, robust signal integrity, and long-term supply stability in mission-critical embedded systems.

FAQ

What is the maximum clock frequency supported by W972GG8JB-3 TR?

W972GG8JB-3 TR supports a maximum clock frequency of 333 MHz, corresponding to DDR2-667 data rate (667 Mb/s per pin). This is defined by its -3 speed grade, requiring tCK(min) = 3.0 ns at CL=5 and meeting JEDEC JESD79-2F 5-5-5 timing bin specifications for tRCD, tRP, and tRC.

Does W972GG8JB-3 TR support on-die termination (ODT)?

Yes, W972GG8JB-3 TR supports programmable on-die termination (ODT) via the ODT pin and extended mode registers. When ODT is asserted HIGH, internal 75 Ω or 150 Ω termination is enabled on DQ and DQS pins during read/write operations, eliminating need for external termination resistors and improving signal integrity in point-to-point or stubbed topologies.

What package type and dimensions does W972GG8JB-3 TR use?

W972GG8JB-3 TR uses a RoHS-compliant, lead-free wafer-level ball grid array (WBGA) package with 60 solder balls arranged in a 11 mm × 11.5 mm body size and 0.8 mm ball pitch. This compact footprint supports high-density PCB layouts typical in industrial and networking equipment where space is constrained.

Can W972GG8JB-3 TR operate in self-refresh mode, and what is its typical current draw?

Yes, W972GG8JB-3 TR supports self-refresh mode to retain data during system sleep. Its typical self-refresh current is ≤12 mA at case temperatures ≤85°C, as specified in the datasheet's IDD6 parameter. This enables low-power standby operation in battery-backed or energy-sensitive embedded applications without data loss.

Is W972GG8JB-3 TR compatible with standard DDR2 controllers?

Yes, W972GG8JB-3 TR is fully compliant with JEDEC DDR2 SDRAM standard JESD79-2F and interoperates with industry-standard DDR2 memory controllers. It supports all mandatory DDR2 features including DLL-aligned timing, SSTL_18 I/O, burst lengths 4/8, CAS latencies 3–7, and command encoding per the DDR2 protocol - ensuring drop-in compatibility in existing DDR2 designs.