Winbond Electronics Corporation W972GG8KB25I TR

Overview

W972GG8KB25I TR from Winbond is a 2G-bit DDR2 SDRAM organized as 32M × 8 banks × 8 bits, supporting DDR2-800 (5-5-5 or 6-6-6) operation at 400 MHz clock frequency with CL=5/6, tRCD=12.5 ns, and industrial temperature range of −40°C to +95°C. It features on-die termination (ODT), off-chip driver (OCD) impedance adjustment, and SSTL_18 interface for high-signal-integrity memory subsystems in embedded networking and industrial control systems.

For engineers reviewing the W972GG8KB25I TR datasheet, W972GG8KB25I TR pinout, W972GG8KB25I TR application, or W972GG8KB25I TR equivalent, this page delivers verified timing parameters, ball function mapping, industrial-grade thermal validation, ODT/OCD configuration logic, and JEDEC-compliant DDR2-800 interoperability details required for reliable PCB layout and firmware initialization sequence design.

Technical Context

This DDR2 SDRAM implements a synchronous, double-data-rate architecture with differential CLK/CLK inputs and source-synchronous DQS/DQS strobes aligned edge-to-read and center-to-write data. Its internal DLL aligns DQ and DQS transitions to clock edges, enabling stable 400 MHz operation under industrial thermal stress.

The device supports programmable additive latency (AL=0–2), burst lengths of 4 or 8, and write latency = read latency − 1 (WL = RL − 1). Command decoding relies on BA0–BA2 bank select lines and A0–A14 address lines, with A10 controlling auto-precharge and EMR(1)/EMR(2) registers configuring OCD calibration, ODT enable/disable, and DLL reset behavior.

Key Specifications

Pinout & Package

Packaged in RoHS-compliant, lead-free WBGA-60 (8 mm × 12.5 mm) with 0.8 mm ball pitch. Ball assignment follows JEDEC-standard DDR2 layout optimized for signal routing and thermal dissipation in dense PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Compared with MT47H64M8CB-37E:H and IS42S32800J-3BLI, the W972GG8KB25I TR provides highest density (2 Gbit) in smallest footprint (WBGA-60), full industrial temperature coverage, and native 8-bit bus alignment - making it optimal for space-constrained, thermally demanding embedded systems requiring single-chip memory expansion.

Availability

W972GG8KB25I TR is available at Aetrix Electronics and suitable for industrial PLCs, network infrastructure equipment, medical imaging subsystems, and automotive ADAS modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W972GG8KB25I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W972GG8KB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for embedded systems requiring extended temperature operation, JEDEC compliance, and long-term supply assurance without performance derating.

FAQ

What is the maximum supported clock frequency for W972GG8KB25I TR?

The W972GG8KB25I TR supports DDR2-800 operation at 400 MHz clock frequency (200 MHz fundamental), validated across its full industrial temperature range of −40°C to +95°C. This corresponds to a minimum tCK of 2.5 ns for CL=5/6 configurations, with timing margins maintained per JEDEC JESD79-2F specification.

Does W972GG8KB25I TR support on-die termination (ODT)?

Yes, W972GG8KB25I TR supports programmable on-die termination via the ODT pin and EMR(1) register settings. When ODT is asserted HIGH, internal 75 Ω or 150 Ω termination resistors are enabled on DQ/DQS lines, eliminating the need for external parallel termination and improving signal integrity in point-to-point or fly-by topologies.

How is the refresh interval handled at 95°C for W972GG8KB25I TR?

At case temperatures above 85°C up to 95°C, W972GG8KB25I TR requires doubled refresh frequency: tREFI = 3.9 µS (vs. 7.8 µS at ≤85°C). This is achieved by issuing Auto Refresh commands twice as often, and is enabled by setting A7=1 in EMR(2), ensuring data retention under high-temperature stress without external intervention.

What package type and ball count does W972GG8KB25I TR use?

W972GG8KB25I TR uses a RoHS-compliant, lead-free WBGA-60 package measuring 8 mm × 12.5 mm with 0.8 mm ball pitch. The 60-ball layout follows JEDEC-standard DDR2 pinout, including dedicated VDDQ/VSSQ planes and isolated DLL power (VDDL/VSSDL) for noise-sensitive analog circuitry.

Can W972GG8KB25I TR be used in place of W972GG8KB-25?

Yes, W972GG8KB25I TR is functionally identical to W972GG8KB-25 in electrical and timing specifications (DDR2-800, 5-5-5/6-6-6), but adds guaranteed operation from −40°C to +95°C. No PCB or firmware changes are required; the "I" suffix denotes extended temperature qualification, not pin or logic differences.