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Winbond Electronics Corporation W972GG8KS-18

Part No.:
W972GG8KS-18
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW972GG8KS-18.pdf
Description:
IC DRAM 2GBIT 60-WBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,098

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Product details

Overview

W972GG8KS-18 from Winbond is a 2G-bit (256M x 8) DDR2 SDRAM organized as 32M words × 8 banks × 8 bits, compliant with JEDEC DDR2-1066 (7-7-7) timing, operating at 1.8 V ± 0.1 V supply, supporting CAS Latency 3–7 and burst lengths of 4 or 8, deployed in embedded control, industrial HMIs, and legacy networking equipment requiring high-density, low-power synchronous DRAM.

For engineers reviewing the W972GG8KS-18 datasheet, W972GG8KS-18 pinout, W972GG8KS-18 application, or W972GG8KS-18 equivalent, this page delivers verified DDR2-1066 timing parameters, ball-level I/O mapping, OCD/ODT configuration support, and JEDEC-compliant initialization sequence details critical for memory controller bring-up and signal integrity validation.

Technical Context

This DDR2 SDRAM uses differential clock inputs (CLK/CLK) with input sampling at clock crossings, DLL-aligned DQ/DQS timing, and source-synchronous data strobes (DQS/DQS) edge-aligned on reads and center-aligned on writes. It implements programmable additive latency (AL = 0–2), enabling RL = AL + CL for optimized command bus efficiency.

The device supports on-die termination (ODT) controlled via dedicated ODT pin and off-chip driver (OCD) impedance calibration using EMR(1), plus auto-precharge, self-refresh, and precharged power-down modes. All control/address signals use SSTL_18 interface standard with VREF-referenced inputs.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2 Gb (256M × 8), 8-bank architecture enabling concurrent bank access for interleaved burst performance.
Data Rate 1066 Mb/s/pin (DDR2-1066), achieved with tCK(min) = 1.875 ns at CL=7, requiring precise PCB trace length matching.
CAS Latency Programmable CL = 3 to 7; CL=7 required for DDR2-1066 compliance, directly determining read access delay in clock cycles.
Burst Length Configurable BL = 4 or 8; BL=8 enables full-page access per command, optimizing sequential throughput in video buffers.
Supply Voltage VDD/VDDQ = 1.8 V ± 0.1 V; strict tolerance mandates low-noise LDO regulation and tight decoupling near VDDQ pins.
Operating Temp 0°C ≤ TCASE ≤ 85°C; validated across full JEDEC AC/DC specs-no derating needed within this range.
tRCD / tRP 13.125 ns min each (7-7-7 bin); defines minimum row activation-to-read/write and precharge-to-activate intervals for reliable bank switching.
Refresh Interval tREFI = 7.8 µs max at 85°C; requires controller to issue 8192 refresh commands every 64 ms for data retention.

Pinout & Package

W972GG8KS-18 is packaged in a lead-free, RoHS-compliant 60-ball WBGA (8 mm × 9.5 mm, 0.8 mm pitch), with separate VDDQ/VSSQ planes for I/O noise isolation and dedicated VDDL/VSSDL for DLL power integrity.

Pin/Terminal Circuit Role Design Meaning
A0–A14 Address Input Row/column address bus; A10 controls auto-precharge, A12–A14 support extended addressing beyond 256M.
BA0–BA2 Bank Select 3-bit field selecting one of eight internal banks; enables true interleaved access across banks without row conflict.
DQ0–DQ7 Data I/O 8-bit bidirectional data bus; SSTL_18 compatible with 1.8 V logic levels and matched DQ/DQS routing requirements.
DQS / DQS Differential Data Strobe Source-synchronous strobe pair; edge-aligned to read data, center-aligned to write data-critical for setup/hold margin.
CS, RAS, CAS, WE Command Inputs JEDEC-standard command encoding; all sampled on CLK/CLK crossing-defines active, read, write, precharge, refresh.
ODT On-Die Termination Enable Active-HIGH pin controlling internal termination resistors (75 Ω or 150 Ω) to suppress stub reflections on DQ/DQS lines.
CKE Clock Enable Gates internal clock tree; LOW disables all operations and enters power-down mode-used for dynamic power gating.
VREF Input Reference Voltage Mid-supply reference (VDDQ/2 ± 300 mV) for SSTL_18 input threshold; must be low-impedance and filtered.

Key Features

Feature Design Value
Programmable Additive Latency (AL) AL = 0–2 enables RL = AL + CL tuning to balance command bus utilization and read latency-critical for real-time interrupt response.
OCD Impedance Calibration EMR(1)-based off-chip driver tuning matches output impedance to transmission line Z₀, reducing signal overshoot/undershoot on DQ lines.
On-Die Termination (ODT) Pin-controlled 75 Ω / 150 Ω termination eliminates need for external parallel resistors on DQ/DQS, simplifying layout and improving SI at 533 MHz.
Self-Refresh Mode IDD6 ≤ 10 mA at TCASE ≤ 85°C enables low-power retention during system sleep-supports battery-backed operation in HMIs.
Precharged Power Down Reduces IDD to < 20 mA while preserving row open state; allows fast wake-up (< 10 ns) without reinitialization-ideal for bursty I/O workloads.
Write Data Mask (DM) Per-byte masking via DM sampled on both DQS edges enables partial writes without read-modify-write-essential for efficient register updates.

Applications

Industrial HMI Systems Legacy Networking Equipment

Use Scenario: Touch-enabled factory floor operator panels with local video buffering and firmware update storage.

IC Role / Device Role / Timing Role: Primary frame buffer and code execution memory interfaced to ARM9/ARM11 SoCs with DDR2 controllers.

Use Value: 256M × 8 density provides 256 MB of contiguous RAM for dual-display rendering; DDR2-1066 bandwidth sustains 720p video overlay without frame drops.

Use Scenario: Enterprise switches and routers using legacy MIPS-based control planes requiring cost-optimized, pin-compatible memory upgrade.

IC Role / Device Role / Timing Role: Boot ROM replacement and packet buffer memory for ASIC/FPGA-based forwarding engines.

Use Value: JEDEC DDR2-1066 compliance ensures drop-in compatibility with existing DDR2-800 designs; -18 speed grade enables higher throughput without board redesign.

Medical Diagnostic Devices Automotive Infotainment Gateways

Use Scenario: Portable ultrasound machines needing deterministic memory access for real-time image reconstruction pipelines.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for FPGA-accelerated beamforming and DICOM compression.

Use Value: Programmable CL and AL allow fine-grained latency tuning to meet hard real-time deadlines; ODT+OCD support ensures clean eye diagrams at 533 MHz.

Use Scenario: In-vehicle head units running Linux-based IVI stacks with multi-application concurrency and audio/video playback.

IC Role / Device Role / Timing Role: Main system memory for ARM Cortex-A series processors handling CAN/LIN gateway services and multimedia decoding.

Use Value: Self-refresh current ≤ 10 mA enables low-power idle states during vehicle sleep mode; SSTL_18 interface guarantees interoperability with automotive-grade controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT47H64M8CB-37E:H (Micron) Same 256M × 8 density, DDR2-1066, but uses 84-ball FBGA; CL=7 timing identical; no OCD calibration support. Requires PCB footprint change; lacks OCD tuning-may need tighter layout tolerances for signal integrity at 533 MHz. Select when sourcing flexibility is prioritized over OCD optimization; verify VREF stability and ODT resistor values match.
IS42S32800J-6BL (ISSI) 32M × 32 (1 Gb) configuration-different width; DDR2-800 only (-25 speed grade); CL=5/6, not CL=7; same WBGA-60 package. Not pin-compatible due to 32-bit bus width; requires controller reconfiguration and layout revision for x32 vs x8 interface. Consider only for bandwidth-scaling upgrades where x32 interface is supported; not a direct functional substitute for W972GG8KS-18.

Compared with MT47H64M8CB-37E:H and IS42S32800J-6BL, the W972GG8KS-18 uniquely combines x8 bus width, WBGA-60 footprint, DDR2-1066 timing, and OCD calibration-making it optimal for space-constrained, signal-integrity-sensitive industrial designs where layout reuse and margin control are critical.

Availability

W972GG8KS-18 is available at Aetrix Electronics and suitable for industrial HMIs, legacy networking equipment, medical diagnostic devices, and automotive infotainment gateways requiring stable component supply, long-lifecycle support, and JEDEC-compliant DDR2-1066 performance.

Supply support for W972GG8KS-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM, with ISO 9001-certified manufacturing and global distribution.

The W972GG8KS-18 belongs to Winbond's DDR2 SDRAM product line, engineered for cost-sensitive, high-reliability industrial and networking applications where JEDEC compliance, thermal robustness, and long-term supply stability are mandatory.

FAQ

What is the maximum clock frequency supported by the W972GG8KS-18?

The W972GG8KS-18 supports DDR2-1066 operation with a minimum clock period (tCK) of 1.875 ns, corresponding to a 533 MHz differential clock frequency. This is validated under JEDEC conditions with CL=7, tRCD=7, and tRP=7 timing-ensuring full-speed operation in compliant systems without derating.

Does the W972GG8KS-18 require external termination resistors?

No-the W972GG8KS-18 integrates on-die termination (ODT) controlled via the dedicated ODT pin, supporting 75 Ω or 150 Ω termination values. This eliminates the need for external parallel resistors on DQ/DQS lines, reducing BOM count and improving signal integrity at 533 MHz operation.

How is the W972GG8KS-18 initialized after power-up?

The W972GG8KS-18 requires a strict 13-step JEDEC initialization sequence: stable power and clock for 200 µs, CKE assertion, precharge-all, EMRS to EMR(2)/EMR(3), DLL enable/reset, MRS programming, OCD calibration, and ≥2 auto-refresh commands before normal operation-detailed in Section 8.1 of the datasheet.

Can the W972GG8KS-18 operate in self-refresh mode at 85°C?

Yes-the W972GG8KS-18 guarantees self-refresh current (IDD6) ≤ 10 mA at TCASE ≤ 85°C, enabling reliable data retention during extended system sleep. At 85°C, tREFI remains 7.8 µs, requiring the memory controller to maintain standard refresh timing without acceleration.

What is the purpose of the DM/RDQS pin on the W972GG8KS-18?

The DM/RDQS pin serves dual functions: as DM (Data Mask) during write operations to enable byte-level masking, and as RDQS (Read Data Strobe) when enabled via EMR(1). Its loading matches DQ/DQS, ensuring timing consistency-critical for partial writes and differential read strobe support.

W972GG8KS-18 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
-
Clock Frequency:
533 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
58.125 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-WBGA (8x9.5)

W972GG8KS-18 FAQ

1.How can I place an order for W972GG8KS-18 through Aetrix?

Please submit a Request for Quotation (RFQ) for W972GG8KS-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W972GG8KS-18 reliable?

The price and inventory of W972GG8KS-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG8KS-18 is usually 5 days.

3.What payment methods are accepted for W972GG8KS-18?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG8KS-18 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W972GG8KS-18?

W972GG8KS-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W972GG8KS-18 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W972GG8KS-18?

For technical support, including W972GG8KS-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG8KS-18 requirements.

6.How does Aetrix verify that W972GG8KS-18 is sourced from the original manufacturer or authorized distributors?

All W972GG8KS-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG8KS-18 meets industry standards.

7.What is the process for return or replacement of W972GG8KS-18?

All W972GG8KS-18 units undergo pre-shipment inspection (PSI). If there is an issue with W972GG8KS-18, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W972GG8KS-18 part is unused and in its original packaging.

Return procedure for W972GG8KS-18:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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