Winbond Electronics Corporation W972GG8KS-18
- Part No.:
- W972GG8KS-18
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W972GG8KS-18.pdf
- Description:
- IC DRAM 2GBIT 60-WBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,098
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W972GG8KS-18 from Winbond is a 2G-bit (256M x 8) DDR2 SDRAM organized as 32M words × 8 banks × 8 bits, compliant with JEDEC DDR2-1066 (7-7-7) timing, operating at 1.8 V ± 0.1 V supply, supporting CAS Latency 3–7 and burst lengths of 4 or 8, deployed in embedded control, industrial HMIs, and legacy networking equipment requiring high-density, low-power synchronous DRAM.
For engineers reviewing the W972GG8KS-18 datasheet, W972GG8KS-18 pinout, W972GG8KS-18 application, or W972GG8KS-18 equivalent, this page delivers verified DDR2-1066 timing parameters, ball-level I/O mapping, OCD/ODT configuration support, and JEDEC-compliant initialization sequence details critical for memory controller bring-up and signal integrity validation.
Technical Context
This DDR2 SDRAM uses differential clock inputs (CLK/CLK) with input sampling at clock crossings, DLL-aligned DQ/DQS timing, and source-synchronous data strobes (DQS/DQS) edge-aligned on reads and center-aligned on writes. It implements programmable additive latency (AL = 0–2), enabling RL = AL + CL for optimized command bus efficiency.
The device supports on-die termination (ODT) controlled via dedicated ODT pin and off-chip driver (OCD) impedance calibration using EMR(1), plus auto-precharge, self-refresh, and precharged power-down modes. All control/address signals use SSTL_18 interface standard with VREF-referenced inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256M × 8), 8-bank architecture enabling concurrent bank access for interleaved burst performance. |
| Data Rate | 1066 Mb/s/pin (DDR2-1066), achieved with tCK(min) = 1.875 ns at CL=7, requiring precise PCB trace length matching. |
| CAS Latency | Programmable CL = 3 to 7; CL=7 required for DDR2-1066 compliance, directly determining read access delay in clock cycles. |
| Burst Length | Configurable BL = 4 or 8; BL=8 enables full-page access per command, optimizing sequential throughput in video buffers. |
| Supply Voltage | VDD/VDDQ = 1.8 V ± 0.1 V; strict tolerance mandates low-noise LDO regulation and tight decoupling near VDDQ pins. |
| Operating Temp | 0°C ≤ TCASE ≤ 85°C; validated across full JEDEC AC/DC specs-no derating needed within this range. |
| tRCD / tRP | 13.125 ns min each (7-7-7 bin); defines minimum row activation-to-read/write and precharge-to-activate intervals for reliable bank switching. |
| Refresh Interval | tREFI = 7.8 µs max at 85°C; requires controller to issue 8192 refresh commands every 64 ms for data retention. |
Pinout & Package
W972GG8KS-18 is packaged in a lead-free, RoHS-compliant 60-ball WBGA (8 mm × 9.5 mm, 0.8 mm pitch), with separate VDDQ/VSSQ planes for I/O noise isolation and dedicated VDDL/VSSDL for DLL power integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | Row/column address bus; A10 controls auto-precharge, A12–A14 support extended addressing beyond 256M. |
| BA0–BA2 | Bank Select | 3-bit field selecting one of eight internal banks; enables true interleaved access across banks without row conflict. |
| DQ0–DQ7 | Data I/O | 8-bit bidirectional data bus; SSTL_18 compatible with 1.8 V logic levels and matched DQ/DQS routing requirements. |
| DQS / DQS | Differential Data Strobe | Source-synchronous strobe pair; edge-aligned to read data, center-aligned to write data-critical for setup/hold margin. |
| CS, RAS, CAS, WE | Command Inputs | JEDEC-standard command encoding; all sampled on CLK/CLK crossing-defines active, read, write, precharge, refresh. |
| ODT | On-Die Termination Enable | Active-HIGH pin controlling internal termination resistors (75 Ω or 150 Ω) to suppress stub reflections on DQ/DQS lines. |
| CKE | Clock Enable | Gates internal clock tree; LOW disables all operations and enters power-down mode-used for dynamic power gating. |
| VREF | Input Reference Voltage | Mid-supply reference (VDDQ/2 ± 300 mV) for SSTL_18 input threshold; must be low-impedance and filtered. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Additive Latency (AL) | AL = 0–2 enables RL = AL + CL tuning to balance command bus utilization and read latency-critical for real-time interrupt response. |
| OCD Impedance Calibration | EMR(1)-based off-chip driver tuning matches output impedance to transmission line Z₀, reducing signal overshoot/undershoot on DQ lines. |
| On-Die Termination (ODT) | Pin-controlled 75 Ω / 150 Ω termination eliminates need for external parallel resistors on DQ/DQS, simplifying layout and improving SI at 533 MHz. |
| Self-Refresh Mode | IDD6 ≤ 10 mA at TCASE ≤ 85°C enables low-power retention during system sleep-supports battery-backed operation in HMIs. |
| Precharged Power Down | Reduces IDD to < 20 mA while preserving row open state; allows fast wake-up (< 10 ns) without reinitialization-ideal for bursty I/O workloads. |
| Write Data Mask (DM) | Per-byte masking via DM sampled on both DQS edges enables partial writes without read-modify-write-essential for efficient register updates. |
Applications
| Industrial HMI Systems | Legacy Networking Equipment |
|---|---|
Use Scenario: Touch-enabled factory floor operator panels with local video buffering and firmware update storage. IC Role / Device Role / Timing Role: Primary frame buffer and code execution memory interfaced to ARM9/ARM11 SoCs with DDR2 controllers. Use Value: 256M × 8 density provides 256 MB of contiguous RAM for dual-display rendering; DDR2-1066 bandwidth sustains 720p video overlay without frame drops. |
Use Scenario: Enterprise switches and routers using legacy MIPS-based control planes requiring cost-optimized, pin-compatible memory upgrade. IC Role / Device Role / Timing Role: Boot ROM replacement and packet buffer memory for ASIC/FPGA-based forwarding engines. Use Value: JEDEC DDR2-1066 compliance ensures drop-in compatibility with existing DDR2-800 designs; -18 speed grade enables higher throughput without board redesign. |
| Medical Diagnostic Devices | Automotive Infotainment Gateways |
Use Scenario: Portable ultrasound machines needing deterministic memory access for real-time image reconstruction pipelines. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for FPGA-accelerated beamforming and DICOM compression. Use Value: Programmable CL and AL allow fine-grained latency tuning to meet hard real-time deadlines; ODT+OCD support ensures clean eye diagrams at 533 MHz. |
Use Scenario: In-vehicle head units running Linux-based IVI stacks with multi-application concurrency and audio/video playback. IC Role / Device Role / Timing Role: Main system memory for ARM Cortex-A series processors handling CAN/LIN gateway services and multimedia decoding. Use Value: Self-refresh current ≤ 10 mA enables low-power idle states during vehicle sleep mode; SSTL_18 interface guarantees interoperability with automotive-grade controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H64M8CB-37E:H (Micron) | Same 256M × 8 density, DDR2-1066, but uses 84-ball FBGA; CL=7 timing identical; no OCD calibration support. | Requires PCB footprint change; lacks OCD tuning-may need tighter layout tolerances for signal integrity at 533 MHz. | Select when sourcing flexibility is prioritized over OCD optimization; verify VREF stability and ODT resistor values match. |
| IS42S32800J-6BL (ISSI) | 32M × 32 (1 Gb) configuration-different width; DDR2-800 only (-25 speed grade); CL=5/6, not CL=7; same WBGA-60 package. | Not pin-compatible due to 32-bit bus width; requires controller reconfiguration and layout revision for x32 vs x8 interface. | Consider only for bandwidth-scaling upgrades where x32 interface is supported; not a direct functional substitute for W972GG8KS-18. |
Compared with MT47H64M8CB-37E:H and IS42S32800J-6BL, the W972GG8KS-18 uniquely combines x8 bus width, WBGA-60 footprint, DDR2-1066 timing, and OCD calibration-making it optimal for space-constrained, signal-integrity-sensitive industrial designs where layout reuse and margin control are critical.
Availability
W972GG8KS-18 is available at Aetrix Electronics and suitable for industrial HMIs, legacy networking equipment, medical diagnostic devices, and automotive infotainment gateways requiring stable component supply, long-lifecycle support, and JEDEC-compliant DDR2-1066 performance.
Supply support for W972GG8KS-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM, with ISO 9001-certified manufacturing and global distribution.
The W972GG8KS-18 belongs to Winbond's DDR2 SDRAM product line, engineered for cost-sensitive, high-reliability industrial and networking applications where JEDEC compliance, thermal robustness, and long-term supply stability are mandatory.
FAQ
What is the maximum clock frequency supported by the W972GG8KS-18?
The W972GG8KS-18 supports DDR2-1066 operation with a minimum clock period (tCK) of 1.875 ns, corresponding to a 533 MHz differential clock frequency. This is validated under JEDEC conditions with CL=7, tRCD=7, and tRP=7 timing-ensuring full-speed operation in compliant systems without derating.
Does the W972GG8KS-18 require external termination resistors?
No-the W972GG8KS-18 integrates on-die termination (ODT) controlled via the dedicated ODT pin, supporting 75 Ω or 150 Ω termination values. This eliminates the need for external parallel resistors on DQ/DQS lines, reducing BOM count and improving signal integrity at 533 MHz operation.
How is the W972GG8KS-18 initialized after power-up?
The W972GG8KS-18 requires a strict 13-step JEDEC initialization sequence: stable power and clock for 200 µs, CKE assertion, precharge-all, EMRS to EMR(2)/EMR(3), DLL enable/reset, MRS programming, OCD calibration, and ≥2 auto-refresh commands before normal operation-detailed in Section 8.1 of the datasheet.
Can the W972GG8KS-18 operate in self-refresh mode at 85°C?
Yes-the W972GG8KS-18 guarantees self-refresh current (IDD6) ≤ 10 mA at TCASE ≤ 85°C, enabling reliable data retention during extended system sleep. At 85°C, tREFI remains 7.8 µs, requiring the memory controller to maintain standard refresh timing without acceleration.
What is the purpose of the DM/RDQS pin on the W972GG8KS-18?
The DM/RDQS pin serves dual functions: as DM (Data Mask) during write operations to enable byte-level masking, and as RDQS (Read Data Strobe) when enabled via EMR(1). Its loading matches DQ/DQS, ensuring timing consistency-critical for partial writes and differential read strobe support.
W972GG8KS-18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- -
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 58.125 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-WBGA (8x9.5)
W972GG8KS-18 FAQ
1.How can I place an order for W972GG8KS-18 through Aetrix?
Please submit a Request for Quotation (RFQ) for W972GG8KS-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W972GG8KS-18 reliable?
The price and inventory of W972GG8KS-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG8KS-18 is usually 5 days.
3.What payment methods are accepted for W972GG8KS-18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG8KS-18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W972GG8KS-18?
W972GG8KS-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W972GG8KS-18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W972GG8KS-18?
For technical support, including W972GG8KS-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG8KS-18 requirements.
6.How does Aetrix verify that W972GG8KS-18 is sourced from the original manufacturer or authorized distributors?
All W972GG8KS-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG8KS-18 meets industry standards.
7.What is the process for return or replacement of W972GG8KS-18?
All W972GG8KS-18 units undergo pre-shipment inspection (PSI). If there is an issue with W972GG8KS-18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W972GG8KS-18 part is unused and in its original packaging.
Return procedure for W972GG8KS-18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W972GG8KS-18 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

