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Winbond Electronics Corporation W972GG8KS25I TR
- Part No.:
- W972GG8KS25I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W972GG8KS25I TR.pdf
- Description:
- IC DRAM 2GBIT 60-WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,146
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Product details
Overview
W972GG8KS25I TR from Winbond Electronics is a 2Gb (256M × 8) DDR2 SDRAM organized in 8 banks, supporting DDR2-800 operation at 400 MHz clock frequency with CL=5 or CL=6 timing (5-5-5 or 6-6-6), 1.8 V core and I/O supply, and industrial temperature range (–40°C to +95°C). It serves as main system memory in embedded controllers, network processors, and industrial HMIs requiring reliable high-bandwidth data buffering.
For engineers reviewing the W972GG8KS25I TR datasheet, W972GG8KS25I TR pinout, W972GG8KS25I TR application, or W972GG8KS25I TR equivalent, key selection criteria include its industrial-grade thermal rating, on-die termination (ODT), OCD impedance calibration, differential clock interface (CLK/CLK), and SSTL_18-compatible ball-level signaling for signal integrity in dense PCB layouts.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with DLL-aligned DQ/DQS timing and source-synchronous read/write strobes. It supports programmable additive latency (AL = 0–2), burst lengths of 4 or 8, and write latency WL = RL − 1.
Functional control includes mode register (MR) and extended mode registers (EMR1–EMR3) for configuring CAS latency, ODT strength, OCD calibration, DLL enable/disable, and RDQS/DQS differential strobe mode. Power management features include precharged power down, self refresh (IDD6 ≤ 10 mA at TCASE ≤ 85°C), and auto-refresh with tREFI = 3.9 µS at 85–95°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (32M × 8 banks × 8 bits), enabling 256 MB byte-addressable capacity |
| Data Rate | DDR2-800 (400 MHz clock, 800 MT/s per pin), suitable for bandwidth-constrained industrial SoC interfaces |
| CAS Latency | Programmable CL = 3–7; W972GG8KS25I TR supports CL = 5 or 6 (5-5-5 / 6-6-6 JEDEC timing) |
| Supply Voltages | VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; separate VSSQ/VSSDL grounds isolate DQ/DLL noise paths |
| Operating Temperature | –40°C ≤ TCASE ≤ 95°C (industrial grade), validated with doubled refresh rate (tREFI = 3.9 µS) above 85°C |
| On-Die Termination | Programmable ODT (RZQ = 75 Ω or 150 Ω) via EMR(1), reducing external termination components |
| Interface Standard | SSTL_18-compliant inputs/outputs, compatible with standard DDR2 memory controllers |
Pinout & Package
Packaged in 60-ball WBGA (8 mm × 9.5 mm, 0.8 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | Row/column address bus; A10 controls auto-precharge, A12–A14 support bank-interleaved access |
| BA0–BA2 | Bank Select | 3-bit bank address enabling concurrent access across 8 banks for interleaved throughput |
| DQ0–DQ7 | Data I/O | 8-bit bidirectional data bus; matched loading with DQS/DM for timing closure |
| DQS, DQS | Differential Data Strobe | Source-synchronous edge-aligned (read) / center-aligned (write); enables DDR timing margin |
| CKE | Clock Enable | Asynchronous gate controlling internal clock tree activation/deactivation for power gating |
| CS, RAS, CAS, WE | Command Inputs | Standard DDR2 command bus decoded synchronously to CLK/CLK crossing points |
| ODT | On-Die Termination Control | Registered HIGH enables internal termination resistor; eliminates need for external parallel resistors |
| VREF | Input Reference Voltage | Tracks VDDQ/2 (±300 mV); critical for SSTL_18 input threshold stability across voltage/temp |
Key Features
| Feature | Design Value |
|---|---|
| OCD Impedance Calibration | Off-chip driver output impedance tuned via EMR(1) to match ZQ = 75 Ω reference, minimizing signal reflections |
| Programmable Additive Latency | AL = 0–2 configurable via EMR(1), decoupling command bus occupancy from data return timing |
| Differential Clock Interface | CLK/CLK differential pair reduces jitter sensitivity and improves setup/hold margins over single-ended clocks |
| Industrial Refresh Management | Self-refresh current IDD6 ≤ 10 mA at ≤85°C; tREFI = 3.9 µS enforced above 85°C via EMR(2) bit A7 |
| Write Data Mask (DM) | Per-byte masking sampled on both DQS edges, enabling partial writes without read-modify-write overhead |
Applications
| Industrial HMI Memory Buffer | Network Processor Frame Buffer |
|---|---|
Use Scenario: Touch-enabled factory-floor HMIs with real-time graphics rendering and local data logging. IC Role / Device Role / Timing Role: Primary working memory interfacing to ARM Cortex-A series SoCs via 8-bit DDR2 bus, handling GUI frame buffers and configuration storage. Use Value: Industrial temperature rating (–40°C to +95°C) ensures uninterrupted operation in uncontrolled enclosures; ODT and OCD reduce layout complexity and improve signal integrity at 400 MHz. | Use Scenario: Layer-2/Layer-3 packet forwarding engines in managed switches requiring low-latency buffer memory. IC Role / Device Role / Timing Role: Packet descriptor and payload buffer for multi-port ASICs, accessed via burst-8 reads/writes with AL=1 to hide command latency. Use Value: Precharged power-down mode cuts IDD1 by >50% during idle cycles; tRC = 57.5 ns (CL=5) enables fast bank switching for concurrent port buffering. |
| Medical Imaging Subsystem | Automated Test Equipment (ATE) |
Use Scenario: Portable ultrasound devices capturing and preprocessing real-time echo data streams. IC Role / Device Role / Timing Role: High-throughput frame store between ADC front-end and DSP engine, operating in burst-8 read/write with DM masking for partial updates. Use Value: SSTL_18 interface ensures compatibility with medical-grade FPGA memory controllers; VREF tracking guarantees stable input thresholds under varying load conditions. | Use Scenario: High-speed digital pattern generators performing deterministic waveform playback and capture. IC Role / Device Role / Timing Role: Pattern memory storing multi-gigabit test vectors, accessed via sequential burst-4 reads with posted CAS to maximize controller efficiency. Use Value: DLL alignment and differential DQS minimize jitter-induced timing errors; tRCD = 12.5 ns (CL=5) supports tight setup windows for 400 MHz operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H128M8HQ-25E IT:C | 1 Gb density (128M × 8), same DDR2-800 speed grade, but only 60-ball FBGA (same footprint), no industrial temp option (–40°C to +95°C not guaranteed) | Lower capacity limits use in high-resolution display buffers; lacks full industrial thermal validation above 85°C | Select when 128 MB capacity suffices and ambient temperature stays ≤85°C |
| IS42S16160F-25BLI | 256M × 16 organization (512 Mb total), 86-pin TSOP-II, CL=5, industrial temp, but wider 16-bit bus increases routing complexity and controller compatibility constraints | Requires 16-bit memory controller interface; incompatible with 8-bit-only SoCs used in cost-sensitive industrial designs | Select only if system architecture supports 16-bit data path and board space permits TSOP-II package |
Compared with MT47H128M8HQ-25E IT:C and IS42S16160F-25BLI, W972GG8KS25I TR uniquely delivers 256 MB capacity in an 8-bit-wide, industrial-grade WBGA package with full ODT/OCD support-making it optimal for space-constrained, thermally demanding embedded systems where pin count and thermal reliability are primary constraints.
Availability
W972GG8KS25I TR is available at Aetrix Electronics and suitable for industrial HMIs, network processors, medical imaging subsystems, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W972GG8KS25I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W972GG8KS product line delivers JEDEC-compliant DDR2 SDRAM optimized for industrial and networking applications where extended temperature operation, signal integrity, and long-term supply stability are critical design requirements.
FAQ
What is the maximum supported data rate for W972GG8KS25I TR?
W972GG8KS25I TR supports DDR2-800 operation at 400 MHz clock frequency, delivering 800 MT/s per pin. This speed grade is validated for CL=5 (5-5-5) and CL=6 (6-6-6) timings across –40°C to +95°C, with tRCD = 12.5 ns and tRP = 12.5 ns minimum at CL=5. The device does not support DDR2-1066 (–18 speed grade) operation.
Does W972GG8KS25I TR require external termination resistors?
No. W972GG8KS25I TR integrates programmable on-die termination (ODT) with selectable 75 Ω or 150 Ω values controlled via EMR(1). When ODT is enabled (ODT pin HIGH), internal termination replaces external parallel resistors on DQ/DQS lines, simplifying PCB layout and improving signal integrity at 400 MHz.
How is the industrial temperature range implemented in W972GG8KS25I TR?
W972GG8KS25I TR achieves –40°C to +95°C operation through enhanced refresh management: at TCASE > 85°C, tREFI is halved to 3.9 µS (vs. 7.8 µS at ≤85°C) via EMR(2) bit A7 = 1, and self-refresh current remains ≤10 mA. This is validated per JEDEC JESD22-A108 and requires proper VREF tracking and power ramp sequencing per datasheet Section 8.1.
Can W972GG8KS25I TR operate with single-ended DQS instead of differential DQS/DQS?
Yes. W972GG8KS25I TR supports both modes: differential DQS/DQS (enabled via EMR(1)[A10] = 0) and single-ended DQS (EMR(1)[A10] = 1). In single-ended mode, ball A2 (NU/RDQS) becomes no-connect, and DQS functions as a single-ended strobe aligned to read data and centered on write data-maintaining full timing compliance at DDR2-800 speeds.
What is the purpose of OCD calibration in W972GG8KS25I TR?
OCD (Off-Chip Driver) calibration in W972GG8KS25I TR adjusts the output driver impedance of DQ/DQS pins to match a ZQ reference resistor (typically 75 Ω), minimizing signal reflections and improving eye diagram margins. Calibration is executed post-initialization using EMR(1) commands and requires a dedicated ZQ pin connection per JEDEC DDR2 specification.
W972GG8KS25I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- -
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 57.5 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-WBGA (8x9.5)
W972GG8KS25I TR FAQ
1.How can I place an order for W972GG8KS25I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W972GG8KS25I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W972GG8KS25I TR reliable?
The price and inventory of W972GG8KS25I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W972GG8KS25I TR is usually 5 days.
3.What payment methods are accepted for W972GG8KS25I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W972GG8KS25I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W972GG8KS25I TR?
W972GG8KS25I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W972GG8KS25I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W972GG8KS25I TR?
For technical support, including W972GG8KS25I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W972GG8KS25I TR requirements.
6.How does Aetrix verify that W972GG8KS25I TR is sourced from the original manufacturer or authorized distributors?
All W972GG8KS25I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W972GG8KS25I TR meets industry standards.
7.What is the process for return or replacement of W972GG8KS25I TR?
All W972GG8KS25I TR units undergo pre-shipment inspection (PSI). If there is an issue with W972GG8KS25I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W972GG8KS25I TR part is unused and in its original packaging.
Return procedure for W972GG8KS25I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W972GG8KS25I TR Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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