Winbond Electronics Corporation W9751G6KB-18
- Part No.:
- W9751G6KB-18
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 84-TFBGA
- Datasheet:
-
W9751G6KB-18.pdf
- Description:
- IC DRAM 512MBIT PAR 84WBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,956
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Product details
Overview
W9751G6KB-18 from Winbond Electronics is a 512Mbit DDR2 SDRAM organized as 8,388,608 words × 4 banks × 16 bits, operating at 1.8 V ± 0.1 V with DDR2-1066 (7-7-7) timing and CAS latency options of 3–7. It supports differential clocking (CLK/CLK), bi-directional DQS strobes, and on-die termination for high-speed memory subsystems in embedded controllers and networking equipment.
For engineers reviewing the W9751G6KB-18 datasheet, W9751G6KB-18 pinout, W9751G6KB-18 application, or W9751G6KB-18 equivalent, key selection criteria include its -18 speed grade compliance with JEDEC DDR2-1066, 84-ball WBGA package, SSTL_18 interface, and support for OCD calibration, auto-precharge, and self-refresh modes across 0°C to 85°C operation.
Technical Context
This DDR2 SDRAM implements a double-data-rate architecture with two data transfers per clock cycle, using DLL-aligned DQ/DQS timing and edge-aligned read / center-aligned write data strobes. Its command interface accepts active, read, write, precharge, refresh, and power-down commands synchronized to differential CLK/CLK edges.
The device integrates four independent 128Mbit banks with shared address/control bus, supports burst lengths of 4 or 8, and features programmable additive latency (AL = 0–2), enabling RL = AL + CL configurations up to RL = 9. On-die termination (ODT) and off-chip driver (OCD) impedance adjustment are controlled via extended mode registers EMR(1) and EMR(2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (8,388,608 × 4 banks × 16 bits) |
| Data Rate | 1066 Mb/sec/pin (DDR2-1066, tCK min = 1.875 ns @ CL=7) |
| Voltage Supply | VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; VREF tracks VDDQ/2 |
| CAS Latency | Programmable CL = 3, 4, 5, 6, or 7; supports RL = AL + CL up to 9 |
| Burst Length | Fixed BL = 4 or 8; supports burst interrupt and auto-precharge |
| Timing Parameters | tRCD/tRP/tRC min = 13.125/13.125/58.125 ns (DDR2-1066 grade) |
| Power Consumption | IDD0 ≤ 105 mA (active), IDD6 ≤ 6 mA (self-refresh, TCASE ≤ 85°C) |
| Interface Standard | SSTL_18 compliant inputs/outputs; differential CLK/CLK and DQS/DQS |
Pinout & Package
W9751G6KB-18 is packaged in an 84-ball WBGA (8 mm × 12.5 mm, RoHS-compliant, lead-free) with separate VDD/VDDQ/VDDL supplies and isolated VSSQ/VSSDL grounds for noise immunity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Row address (A0–A12); column address (A0–A9); A10 controls auto-precharge |
| BA0–BA1 | Bank Select | Selects one of four internal banks for command targeting |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte masking via LDM/UDM |
| LDQS / UDQS | Differential Data Strobe | Lower/upper byte source-synchronous strobes; edge-aligned (read), center-aligned (write) |
| CLK / CLK | Differential Clock Input | Commands latched at crossing of CLK rising and CLK falling edges |
| CKE | Clock Enable | High enables internal clocking; low enters power-down mode |
| CS, RAS, CAS, WE | Command Inputs | Encoded command set (e.g., ACTIVE, READ, WRITE, PRECHARGE, REFRESH) |
| ODT | On-Die Termination Control | Registered HIGH enables internal termination resistor for signal integrity |
| VREF | Input Reference Voltage | Reference for all address/control inputs; must track VDDQ/2 ±300 mV |
Key Features
| Feature | Design Value |
|---|---|
| DDR2-1066 Speed Grade | Guaranteed 1066 Mb/sec/pin performance with 7-7-7 timing at 0°C–85°C |
| Programmable Additive Latency | AL = 0–2 enables optimized command-to-data efficiency in high-bandwidth systems |
| On-Die Termination (ODT) | Dynamic ODT control via EMR(1) improves signal integrity without external resistors |
| Off-Chip Driver Calibration | OCD impedance adjustment ensures consistent drive strength across voltage/temperature |
| Self-Refresh Mode | IDD6 ≤ 6 mA retention current enables low-power standby in battery-backed applications |
| Auto-Precharge Support | Integrated auto-precharge on burst end reduces controller overhead and simplifies timing |
Applications
| Networking Switch ASIC Memory | Industrial PLC Main Memory |
|---|---|
|
Use Scenario: High-throughput packet buffering in Layer 2/3 switching ASICs requiring sustained 1066 MT/s bandwidth. IC Role / Device Role / Timing Role: Primary DDR2 working memory interfaced directly to switch fabric controller with SSTL_18 signaling. Use Value: 512Mbit density and DDR2-1066 speed enable ≥128 KB packet buffer depth with sub-10 ns tRCD access. |
Use Scenario: Deterministic runtime memory for real-time logic execution in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile program/data storage accessed by ARM Cortex-M7 or RISC-V MCU with tight timing margins. Use Value: Self-refresh mode (IDD6 ≤ 6 mA) and industrial-grade reliability support unattended 24/7 operation in harsh environments. |
| Medical Imaging Display Buffer | Automotive ADAS Video Preprocessing |
|
Use Scenario: Frame buffering for high-resolution diagnostic displays (e.g., ultrasound, MRI) requiring glitch-free pixel streaming. IC Role / Device Role / Timing Role: Dual-port frame store synchronized to display controller and image acquisition engine via shared DQS domains. Use Value: Bi-directional DQS strobes with edge/center alignment ensure precise read/write timing margin for 1080p@60Hz video streams. |
Use Scenario: Real-time sensor fusion buffer in automotive camera radar preprocessing units operating under ASIL-B constraints. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for CNN inference engines with burst-interrupt capability for priority interrupts. Use Value: Burst interrupt (BL=8, RL=3) enables immediate context switch during emergency object detection without full burst completion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT47H64M16HR-37E | 64M × 16-bit, DDR2-800 (6-6-6), 84-ball FBGA, 1.8 V; no ODT pin-termination controlled via mode register only | Limited to 800 MT/s; lacks dedicated ODT pin for dynamic termination switching during burst sequences | Choose when system uses fixed-impedance routing and does not require per-burst ODT toggling. |
| IS42S16100E-6BLI | 64M × 16-bit, DDR2-667 (5-5-5), 60-ball TSOP-II, 1.8 V; supports CL=3–5 only; no OCD calibration | Lower speed grade and smaller density (1 Gbit vs 512 Mbit); no DLL enable/disable via EMRS; no VDDL/VSSDL isolation | Choose for cost-sensitive, space-constrained designs where 667 MT/s and TSOP packaging suffice. |
Compared with MT47H64M16HR-37E and IS42S16100E-6BLI, the W9751G6KB-18 delivers higher bandwidth (1066 MT/s), finer-grained ODT control via dedicated pin, and OCD calibration for stable drive strength-critical for high-speed, multi-load DDR2 channels.
Availability
W9751G6KB-18 is available at Aetrix Electronics and suitable for networking infrastructure, industrial automation, medical imaging, and automotive ADAS applications requiring stable component supply, long-term lifecycle support, and JEDEC-compliant DDR2-1066 performance.
Supply support for W9751G6KB-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, communications, and consumer markets.
The W9751G6KB-18 belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-effective, high-reliability memory subsystems in resource-constrained embedded systems requiring JEDEC-compliant DDR2 operation at extended temperature ranges.
FAQ
What is the maximum data rate supported by the W9751G6KB-18?
The W9751G6KB-18 supports DDR2-1066 operation with a maximum data rate of 1066 Mb/sec/pin, corresponding to a minimum clock period (tCK) of 1.875 ns at CAS Latency 7. This speed grade is validated across 0°C to 85°C case temperature and complies fully with JEDEC DDR2 specification 7-7-7 timing parameters.
Does the W9751G6KB-18 support on-die termination (ODT) and how is it controlled?
Yes, the W9751G6KB-18 supports on-die termination (ODT) controlled via both a dedicated ODT pin and extended mode register EMR(1). When the ODT pin is asserted HIGH, internal termination resistors are enabled; EMR(1) allows fine-grained configuration of ODT resistance values (75 Ω, 150 Ω, or off) for optimal signal integrity across varying load conditions.
What package type and ball count does the W9751G6KB-18 use?
The W9751G6KB-18 uses an 84-ball WBGA package measuring 8 mm × 12.5 mm with RoHS-compliant, lead-free construction. Ball layout follows JEDEC MO-270AB standard, featuring separate VDDQ/VSSQ planes, isolated DLL power/ground (VDDL/VSSDL), and dedicated DQS strobe pairs for upper and lower data bytes.
Can the W9751G6KB-18 operate in self-refresh mode and what is its typical current draw?
Yes, the W9751G6KB-18 supports self-refresh mode for low-power retention. At case temperatures ≤ 85°C, its maximum self-refresh current (IDD6) is 6 mA. At 85°C < TCASE ≤ 95°C, IDD6 remains ≤ 6 mA when configured with doubled refresh rate (tREFI = 3.9 µS) via EMR(2) bit A7.
How is burst length and burst type configured on the W9751G6KB-18?
Burst length (BL = 4 or 8) and burst type (sequential or interleaved) are programmed via the Mode Register Set (MRS) command using address bits A0–A2. The W9751G6KB-18 does not support on-the-fly burst length change; configuration is static after initialization and applies globally across all banks and operations.
W9751G6KB-18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 84-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR2
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 58.125 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 84-WBGA (8x12.5)
W9751G6KB-18 FAQ
1.How can I place an order for W9751G6KB-18 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9751G6KB-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9751G6KB-18 reliable?
The price and inventory of W9751G6KB-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9751G6KB-18 is usually 5 days.
3.What payment methods are accepted for W9751G6KB-18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9751G6KB-18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9751G6KB-18?
W9751G6KB-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9751G6KB-18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9751G6KB-18?
For technical support, including W9751G6KB-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9751G6KB-18 requirements.
6.How does Aetrix verify that W9751G6KB-18 is sourced from the original manufacturer or authorized distributors?
All W9751G6KB-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9751G6KB-18 meets industry standards.
7.What is the process for return or replacement of W9751G6KB-18?
All W9751G6KB-18 units undergo pre-shipment inspection (PSI). If there is an issue with W9751G6KB-18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9751G6KB-18 part is unused and in its original packaging.
Return procedure for W9751G6KB-18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9751G6KB-18 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT21CS01-STUM10-T
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AT24C08C-STUM-T
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