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Winbond Electronics Corporation W9751G6KB-18

Part No.:
W9751G6KB-18
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
84-TFBGA
Datasheet:
AetrixW9751G6KB-18.pdf
Description:
IC DRAM 512MBIT PAR 84WBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,956

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Product details

Overview

W9751G6KB-18 from Winbond Electronics is a 512Mbit DDR2 SDRAM organized as 8,388,608 words × 4 banks × 16 bits, operating at 1.8 V ± 0.1 V with DDR2-1066 (7-7-7) timing and CAS latency options of 3–7. It supports differential clocking (CLK/CLK), bi-directional DQS strobes, and on-die termination for high-speed memory subsystems in embedded controllers and networking equipment.

For engineers reviewing the W9751G6KB-18 datasheet, W9751G6KB-18 pinout, W9751G6KB-18 application, or W9751G6KB-18 equivalent, key selection criteria include its -18 speed grade compliance with JEDEC DDR2-1066, 84-ball WBGA package, SSTL_18 interface, and support for OCD calibration, auto-precharge, and self-refresh modes across 0°C to 85°C operation.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture with two data transfers per clock cycle, using DLL-aligned DQ/DQS timing and edge-aligned read / center-aligned write data strobes. Its command interface accepts active, read, write, precharge, refresh, and power-down commands synchronized to differential CLK/CLK edges.

The device integrates four independent 128Mbit banks with shared address/control bus, supports burst lengths of 4 or 8, and features programmable additive latency (AL = 0–2), enabling RL = AL + CL configurations up to RL = 9. On-die termination (ODT) and off-chip driver (OCD) impedance adjustment are controlled via extended mode registers EMR(1) and EMR(2).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mbit (8,388,608 × 4 banks × 16 bits)
Data Rate 1066 Mb/sec/pin (DDR2-1066, tCK min = 1.875 ns @ CL=7)
Voltage Supply VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; VREF tracks VDDQ/2
CAS Latency Programmable CL = 3, 4, 5, 6, or 7; supports RL = AL + CL up to 9
Burst Length Fixed BL = 4 or 8; supports burst interrupt and auto-precharge
Timing Parameters tRCD/tRP/tRC min = 13.125/13.125/58.125 ns (DDR2-1066 grade)
Power Consumption IDD0 ≤ 105 mA (active), IDD6 ≤ 6 mA (self-refresh, TCASE ≤ 85°C)
Interface Standard SSTL_18 compliant inputs/outputs; differential CLK/CLK and DQS/DQS

Pinout & Package

W9751G6KB-18 is packaged in an 84-ball WBGA (8 mm × 12.5 mm, RoHS-compliant, lead-free) with separate VDD/VDDQ/VDDL supplies and isolated VSSQ/VSSDL grounds for noise immunity.

Pin/Terminal Circuit Role Design Meaning
A0–A12 Address Input Row address (A0–A12); column address (A0–A9); A10 controls auto-precharge
BA0–BA1 Bank Select Selects one of four internal banks for command targeting
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; supports byte masking via LDM/UDM
LDQS / UDQS Differential Data Strobe Lower/upper byte source-synchronous strobes; edge-aligned (read), center-aligned (write)
CLK / CLK Differential Clock Input Commands latched at crossing of CLK rising and CLK falling edges
CKE Clock Enable High enables internal clocking; low enters power-down mode
CS, RAS, CAS, WE Command Inputs Encoded command set (e.g., ACTIVE, READ, WRITE, PRECHARGE, REFRESH)
ODT On-Die Termination Control Registered HIGH enables internal termination resistor for signal integrity
VREF Input Reference Voltage Reference for all address/control inputs; must track VDDQ/2 ±300 mV

Key Features

Feature Design Value
DDR2-1066 Speed Grade Guaranteed 1066 Mb/sec/pin performance with 7-7-7 timing at 0°C–85°C
Programmable Additive Latency AL = 0–2 enables optimized command-to-data efficiency in high-bandwidth systems
On-Die Termination (ODT) Dynamic ODT control via EMR(1) improves signal integrity without external resistors
Off-Chip Driver Calibration OCD impedance adjustment ensures consistent drive strength across voltage/temperature
Self-Refresh Mode IDD6 ≤ 6 mA retention current enables low-power standby in battery-backed applications
Auto-Precharge Support Integrated auto-precharge on burst end reduces controller overhead and simplifies timing

Applications

Networking Switch ASIC Memory Industrial PLC Main Memory

Use Scenario: High-throughput packet buffering in Layer 2/3 switching ASICs requiring sustained 1066 MT/s bandwidth.

IC Role / Device Role / Timing Role: Primary DDR2 working memory interfaced directly to switch fabric controller with SSTL_18 signaling.

Use Value: 512Mbit density and DDR2-1066 speed enable ≥128 KB packet buffer depth with sub-10 ns tRCD access.

Use Scenario: Deterministic runtime memory for real-time logic execution in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile program/data storage accessed by ARM Cortex-M7 or RISC-V MCU with tight timing margins.

Use Value: Self-refresh mode (IDD6 ≤ 6 mA) and industrial-grade reliability support unattended 24/7 operation in harsh environments.

Medical Imaging Display Buffer Automotive ADAS Video Preprocessing

Use Scenario: Frame buffering for high-resolution diagnostic displays (e.g., ultrasound, MRI) requiring glitch-free pixel streaming.

IC Role / Device Role / Timing Role: Dual-port frame store synchronized to display controller and image acquisition engine via shared DQS domains.

Use Value: Bi-directional DQS strobes with edge/center alignment ensure precise read/write timing margin for 1080p@60Hz video streams.

Use Scenario: Real-time sensor fusion buffer in automotive camera radar preprocessing units operating under ASIL-B constraints.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory for CNN inference engines with burst-interrupt capability for priority interrupts.

Use Value: Burst interrupt (BL=8, RL=3) enables immediate context switch during emergency object detection without full burst completion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT47H64M16HR-37E 64M × 16-bit, DDR2-800 (6-6-6), 84-ball FBGA, 1.8 V; no ODT pin-termination controlled via mode register only Limited to 800 MT/s; lacks dedicated ODT pin for dynamic termination switching during burst sequences Choose when system uses fixed-impedance routing and does not require per-burst ODT toggling.
IS42S16100E-6BLI 64M × 16-bit, DDR2-667 (5-5-5), 60-ball TSOP-II, 1.8 V; supports CL=3–5 only; no OCD calibration Lower speed grade and smaller density (1 Gbit vs 512 Mbit); no DLL enable/disable via EMRS; no VDDL/VSSDL isolation Choose for cost-sensitive, space-constrained designs where 667 MT/s and TSOP packaging suffice.

Compared with MT47H64M16HR-37E and IS42S16100E-6BLI, the W9751G6KB-18 delivers higher bandwidth (1066 MT/s), finer-grained ODT control via dedicated pin, and OCD calibration for stable drive strength-critical for high-speed, multi-load DDR2 channels.

Availability

W9751G6KB-18 is available at Aetrix Electronics and suitable for networking infrastructure, industrial automation, medical imaging, and automotive ADAS applications requiring stable component supply, long-term lifecycle support, and JEDEC-compliant DDR2-1066 performance.

Supply support for W9751G6KB-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, communications, and consumer markets.

The W9751G6KB-18 belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-effective, high-reliability memory subsystems in resource-constrained embedded systems requiring JEDEC-compliant DDR2 operation at extended temperature ranges.

FAQ

What is the maximum data rate supported by the W9751G6KB-18?

The W9751G6KB-18 supports DDR2-1066 operation with a maximum data rate of 1066 Mb/sec/pin, corresponding to a minimum clock period (tCK) of 1.875 ns at CAS Latency 7. This speed grade is validated across 0°C to 85°C case temperature and complies fully with JEDEC DDR2 specification 7-7-7 timing parameters.

Does the W9751G6KB-18 support on-die termination (ODT) and how is it controlled?

Yes, the W9751G6KB-18 supports on-die termination (ODT) controlled via both a dedicated ODT pin and extended mode register EMR(1). When the ODT pin is asserted HIGH, internal termination resistors are enabled; EMR(1) allows fine-grained configuration of ODT resistance values (75 Ω, 150 Ω, or off) for optimal signal integrity across varying load conditions.

What package type and ball count does the W9751G6KB-18 use?

The W9751G6KB-18 uses an 84-ball WBGA package measuring 8 mm × 12.5 mm with RoHS-compliant, lead-free construction. Ball layout follows JEDEC MO-270AB standard, featuring separate VDDQ/VSSQ planes, isolated DLL power/ground (VDDL/VSSDL), and dedicated DQS strobe pairs for upper and lower data bytes.

Can the W9751G6KB-18 operate in self-refresh mode and what is its typical current draw?

Yes, the W9751G6KB-18 supports self-refresh mode for low-power retention. At case temperatures ≤ 85°C, its maximum self-refresh current (IDD6) is 6 mA. At 85°C < TCASE ≤ 95°C, IDD6 remains ≤ 6 mA when configured with doubled refresh rate (tREFI = 3.9 µS) via EMR(2) bit A7.

How is burst length and burst type configured on the W9751G6KB-18?

Burst length (BL = 4 or 8) and burst type (sequential or interleaved) are programmed via the Mode Register Set (MRS) command using address bits A0–A2. The W9751G6KB-18 does not support on-the-fly burst length change; configuration is static after initialization and applies globally across all banks and operations.

W9751G6KB-18 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
84-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
512Mbit
Memory Organization:
32M x 16
Memory Interface:
Parallel
Clock Frequency:
533 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
58.125 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-WBGA (8x12.5)

W9751G6KB-18 FAQ

1.How can I place an order for W9751G6KB-18 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9751G6KB-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9751G6KB-18 reliable?

The price and inventory of W9751G6KB-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9751G6KB-18 is usually 5 days.

3.What payment methods are accepted for W9751G6KB-18?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9751G6KB-18 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9751G6KB-18?

W9751G6KB-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9751G6KB-18 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9751G6KB-18?

For technical support, including W9751G6KB-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9751G6KB-18 requirements.

6.How does Aetrix verify that W9751G6KB-18 is sourced from the original manufacturer or authorized distributors?

All W9751G6KB-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9751G6KB-18 meets industry standards.

7.What is the process for return or replacement of W9751G6KB-18?

All W9751G6KB-18 units undergo pre-shipment inspection (PSI). If there is an issue with W9751G6KB-18, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9751G6KB-18 part is unused and in its original packaging.

Return procedure for W9751G6KB-18:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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