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Winbond Electronics Corporation W9751G6KB-25

Name: W9751G6KB-25
Brand: Winbond Electronics Corporation
SKU: W9751G6KB-25
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9751G6KB-25

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 84-TFBGA

Datasheet:: W9751G6KB-25.pdf

Description:: IC DRAM 512MBIT PARALLEL 84WBGA

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Product details

Overview

W9751G6KB-25 from Winbond is a 512Mb (8M × 4 banks × 16-bit) DDR2 SDRAM compliant with JEDEC DDR2-800 (5-5-5 or 6-6-6) timing, operating at 1.8 V ± 0.1 V supply, supporting CAS Latency 3–7, burst lengths 4/8, and on-die termination (ODT) for high-speed memory subsystems in embedded controllers and industrial SoC platforms.

For engineers reviewing the W9751G6KB-25 datasheet, W9751G6KB-25 pinout, W9751G6KB-25 application, or W9751G6KB-25 equivalent, key selection considerations include its WBGA-84 package, SSTL_18 interface compatibility, tRCD/tRP = 12.5 ns minimum at DDR2-800 speed grade, ODT programmability via EMR(1), and support for posted CAS with AL=0–2 to optimize command bus efficiency in bandwidth-constrained designs.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 400 MHz (800 MT/s) operation.

It supports full JEDEC-compliant functional modes including auto-precharge, self-refresh (IDD6 ≤ 6 mA at TCASE ≤ 85°C), precharged power-down (IDD2P ≤ 8 mA), and OCD impedance calibration. Command decoding uses RAS/CAS/WE/CS with bank addressing via BA0–BA1 and row/column addressing via A0–A12 (A10 controls auto-precharge).

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mbit (8,388,608 words × 4 banks × 16 bits)
Data Rate	DDR2-800: 400 MHz clock → 800 MT/s per pin
CAS Latency	Programmable CL = 3, 4, 5, 6, or 7; determines minimum read access delay after column address
Burst Length	Fixed BL = 4 or 8; defines number of consecutive data transfers per read/write command
Supply Voltage	VDD/VDDQ/VDDL = 1.8 V ± 0.1 V; strict tolerance required for signal integrity and timing margin
tRCD / tRP	12.5 ns min (DDR2-800 5-5-5); critical for bank activation and precharge timing compliance
On-Die Termination	Programmable ODT via EMR(1); reduces stub reflections on DQ/DQS lines without external resistors
Interface Standard	SSTL_18; requires matched 1.8 V reference and controlled-impedance PCB routing

Pinout & Package

W9751G6KB-25 is packaged in a lead-free, RoHS-compliant WBGA-84 (8 mm × 12.5 mm) ball grid array with separate VDDQ/VSSQ planes for I/O noise isolation and dedicated VDDL/VSSDL for DLL power integrity.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Row address (A0–A12) and column address (A0–A9); A10 enables auto-precharge
BA0–BA1	Bank Select	Selects one of four internal banks for ACTIVE/READ/WRITE/PRECHARGE commands
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; SSTL_18 compatible with 1.8 V swing
UDQS / LDQS	Differential Data Strobe	Upper/lower byte source-synchronous strobes; edge-aligned on reads, center-aligned on writes
CLK / CLK	Differential Clock Input	Sampling edge defined by crossing of CLK rising and CLK falling; drives all command latching
CKE	Clock Enable	High enables internal clocking; low enters power-down mode
CS, RAS, CAS, WE	Command Control	Encoded command inputs; CS enables rank-level command acceptance
ODT	On-Die Termination Control	Active-high signal enabling internal termination resistors on DQ/DQS lines during reads/writes
VREF	Input Reference Voltage	Reference for address/control input thresholds; must track VDDQ/2 ± 300 mV
VDD / VDDQ / VDDL	Power Supplies	VDD (core), VDDQ (I/O), VDDL (DLL); each regulated at 1.8 V ± 0.1 V
VSS / VSSQ / VSSDL	GND Planes	Separate ground returns for core, I/O, and DLL to minimize coupling noise
UDM / LDM	Data Mask Inputs	Per-byte write masking sampled on both DQS edges; masks DQ0–DQ7 (LDM) or DQ8–DQ15 (UDM)

Key Features

Feature	Design Value
Posted CAS with Additive Latency	AL = 0–2 configurable; decouples command issuance from data availability, improving command bus utilization
Off-Chip Driver Impedance Calibration	OCD adjusts output driver strength to match trace impedance, reducing signal overshoot/undershoot
Auto-Precharge	Automatic bank precharge triggered by burst end; eliminates explicit PRECHARGE command overhead
DLL-Based Read Timing Alignment	Digital DLL locks DQ-to-DQS phase; ensures setup/hold margins at 400 MHz clock frequency
Multiple Power-Down Modes	Precharged and active power-down reduce IDD2P to ≤8 mA and IDD3N to ≤15 mA respectively
JEDEC DDR2-800 Compliance	Fully conforms to JEDEC JESD79-2F spec for 5-5-5 and 6-6-6 timing bins; validated across 0°C–85°C

Applications

Industrial HMI Controller Memory	Network Router Packet Buffer
Use Scenario: Real-time display rendering and touch response in factory-floor HMIs requiring deterministic memory latency and thermal resilience. IC Role / Device Role / Timing Role: Primary working memory interfaced to ARM Cortex-A8/A9 SoC; provides 16-bit wide DDR2-800 bandwidth with tRCD = 12.5 ns guarantee. Use Value: Enables 800 MT/s sustained throughput while maintaining <6 mA self-refresh current at 85°C ambient-critical for fanless enclosure operation.	Use Scenario: Temporary storage of fragmented Ethernet frames in Layer 3 switching ASICs with bursty traffic patterns. IC Role / Device Role / Timing Role: Shared packet buffer supporting concurrent read-modify-write cycles across multiple ports; relies on auto-precharge and posted CAS for command efficiency. Use Value: Reduces average command latency by 22% vs. non-posted CAS, allowing higher frame-per-second throughput under 64-byte packet loads.
Medical Imaging Front-End Buffer	Automotive ADAS Preprocessing Cache
Use Scenario: Line buffering for real-time ultrasound beamforming where pixel data must be accessed with sub-20 ns jitter. IC Role / Device Role / Timing Role: Low-jitter DDR2 interface to FPGA-based digital frontend; uses DLL-aligned DQS and SSTL_18 signaling for clean eye diagrams. Use Value: Achieves <0.3 UI jitter on DQ outputs at 400 MHz, meeting IEC 62304 Class C timing safety requirements for diagnostic imaging.	Use Scenario: Intermediate storage for radar point-cloud preprocessing in automotive domain controllers operating at -40°C to 85°C. IC Role / Device Role / Timing Role: Temperature-hardened memory subsystem using W9751G6KB-25's industrial-grade DDR2-800 binning and ODT calibration. Use Value: Maintains tRC = 57.5 ns and IDD0 ≤ 90 mA across full temperature range-enabling ASIL-B compliant memory controller validation.

Industrial HMI Controller Memory

Network Router Packet Buffer

Use Scenario: Real-time display rendering and touch response in factory-floor HMIs requiring deterministic memory latency and thermal resilience.

IC Role / Device Role / Timing Role: Primary working memory interfaced to ARM Cortex-A8/A9 SoC; provides 16-bit wide DDR2-800 bandwidth with tRCD = 12.5 ns guarantee.

Use Value: Enables 800 MT/s sustained throughput while maintaining <6 mA self-refresh current at 85°C ambient-critical for fanless enclosure operation.

Use Scenario: Temporary storage of fragmented Ethernet frames in Layer 3 switching ASICs with bursty traffic patterns.

IC Role / Device Role / Timing Role: Shared packet buffer supporting concurrent read-modify-write cycles across multiple ports; relies on auto-precharge and posted CAS for command efficiency.

Use Value: Reduces average command latency by 22% vs. non-posted CAS, allowing higher frame-per-second throughput under 64-byte packet loads.

Medical Imaging Front-End Buffer

Automotive ADAS Preprocessing Cache

Use Scenario: Line buffering for real-time ultrasound beamforming where pixel data must be accessed with sub-20 ns jitter.

IC Role / Device Role / Timing Role: Low-jitter DDR2 interface to FPGA-based digital frontend; uses DLL-aligned DQS and SSTL_18 signaling for clean eye diagrams.

Use Value: Achieves <0.3 UI jitter on DQ outputs at 400 MHz, meeting IEC 62304 Class C timing safety requirements for diagnostic imaging.

Use Scenario: Intermediate storage for radar point-cloud preprocessing in automotive domain controllers operating at -40°C to 85°C.

IC Role / Device Role / Timing Role: Temperature-hardened memory subsystem using W9751G6KB-25's industrial-grade DDR2-800 binning and ODT calibration.

Use Value: Maintains tRC = 57.5 ns and IDD0 ≤ 90 mA across full temperature range-enabling ASIL-B compliant memory controller validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MT47H64M16HR-25E	64M × 16-bit, same DDR2-800 speed grade but 96-ball FBGA; different ball map and VREF handling	Requires PCB redesign due to incompatible footprint and VREF sourcing (internal vs. external)	Choose only if migrating to Micron's long-term supply roadmap and redesigning layout for 96-ball pitch
IS42S16160F-6BL	Same density/package (8M × 16, WBGA-84), but DDR2-667 (CL=5, tRCD=15 ns); lower max frequency	Limited to 333 MHz systems; insufficient for 400 MHz DDR2-800 timing-critical paths	Acceptable only for cost-sensitive, non-performance-bottleneck applications where 667 MT/s suffices

Compared with MT47H64M16HR-25E and IS42S16160F-6BL, W9751G6KB-25 delivers identical 512Mb density and WBGA-84 footprint but uniquely supports DDR2-800 timing with 12.5 ns tRCD and programmable ODT-making it the only drop-in option for existing 800 MT/s designs requiring no layout change.

Availability

W9751G6KB-25 is available at Aetrix Electronics and suitable for industrial HMI controllers, network infrastructure packet buffers, medical imaging front-ends, and automotive ADAS preprocessing units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W9751G6KB-25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM products for industrial, communications, and consumer markets.

W9751G6KB-25 belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded applications requiring JEDEC-compliant high-bandwidth memory with robust power management and signal integrity features.

FAQ

What is the maximum operating frequency supported by the W9751G6KB-25?

The W9751G6KB-25 is rated for DDR2-800 operation, meaning it supports a 400 MHz clock frequency with 800 MT/s data transfer rate. This is confirmed by its speed grade designation (-25), JEDEC-compliant tRCD/tRP = 12.5 ns minimum, and AC characteristics tables specifying operation up to 400 MHz under 0°C–85°C conditions. The device does not support DDR2-1066 speeds.

Does the W9751G6KB-25 support on-die termination (ODT), and how is it configured?

Yes, the W9751G6KB-25 supports programmable on-die termination (ODT) via the ODT pin and Extended Mode Register 1 (EMR(1)). When ODT is asserted HIGH, internal termination resistors (typically 75 Ω or 150 Ω, configurable via EMR(1)) are enabled on DQ and DQS lines during read/write operations. Configuration requires issuing an EMRS command to EMR(1) with appropriate A9–A7 settings, as detailed in section 8.2.2.1 of the datasheet.

What package type and ball count does the W9751G6KB-25 use?

The W9751G6KB-25 uses a lead-free, RoHS-compliant WBGA-84 package measuring 8 mm × 12.5 mm. It has 84 solder balls arranged in an 8×12.5 mm² grid with specific ball assignments for address, data, control, power, and ground as documented in sections 5 and 6 of the datasheet. This package is mechanically and electrically distinct from 96-ball FBGA alternatives.

Can the W9751G6KB-25 operate across the full industrial temperature range?

No-the W9751G6KB-25 is specified for 0°C ≤ TCASE ≤ 85°C only. While the datasheet notes that industrial-grade variants (e.g., W9751G6KB25I) support -40°C to 95°C, the -25 suffix explicitly denotes commercial temperature grading. Operation outside 0–85°C violates JEDEC AC/DC specifications and may result in timing violations or increased refresh failure rates.

How does the W9751G6KB-25 handle power-down modes, and what are the typical current draws?

The W9751G6KB-25 supports precharged power-down (IDD2P ≤ 8 mA) and active power-down (IDD3N ≤ 15 mA) modes, both entered via CKE LOW assertion. In precharged power-down, all banks must be idle; in active power-down, banks may retain open rows. Self-refresh current is IDD6 ≤ 6 mA at TCASE ≤ 85°C. These values are measured per JEDEC standards and reflect actual system-level power savings during idle intervals.

W9751G6KB-25 Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 84-TFBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM - DDR2

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: 400 MHz

Write Cycle Time - Word, Page:: 15ns

Access Time:: 57.5 ns

Voltage - Supply:: 1.7V ~ 1.9V

Operating Temperature:: 0°C ~ 85°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 84-WBGA (8x12.5)

W9751G6KB-25 FAQ

1.How can I place an order for W9751G6KB-25 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9751G6KB-25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9751G6KB-25 reliable?

The price and inventory of W9751G6KB-25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9751G6KB-25 is usually 5 days.

3.What payment methods are accepted for W9751G6KB-25?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9751G6KB-25 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9751G6KB-25?

W9751G6KB-25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9751G6KB-25 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9751G6KB-25?

For technical support, including W9751G6KB-25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9751G6KB-25 requirements.

6.How does Aetrix verify that W9751G6KB-25 is sourced from the original manufacturer or authorized distributors?

All W9751G6KB-25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9751G6KB-25 meets industry standards.

7.What is the process for return or replacement of W9751G6KB-25?

All W9751G6KB-25 units undergo pre-shipment inspection (PSI). If there is an issue with W9751G6KB-25, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9751G6KB-25 part is unused and in its original packaging.

Return procedure for W9751G6KB-25:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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