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Winbond Electronics Corporation W9751G6KB-25 TR

Part No.:
W9751G6KB-25 TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
84-TFBGA
Datasheet:
AetrixW9751G6KB-25 TR.pdf
Description:
IC DRAM 512MBIT PARALLEL 84WBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,043

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Product details

Overview

W9751G6KB-25 TR from Winbond is a 512Mbit DDR2 SDRAM organized as 8M × 4 banks × 16-bit, operating at DDR2-800 speed (tCK = 2.5 ns min, CL = 5/6), with 1.8 V ±0.1 V core and I/O supply, SSTL_18 interface, and on-die termination (ODT) for high-speed memory subsystems in embedded networking and industrial control applications.

For engineers reviewing the W9751G6KB-25 TR datasheet, W9751G6KB-25 TR pinout, W9751G6KB-25 TR application, or W9751G6KB-25 TR equivalent, this page delivers verified DDR2 timing parameters (tRCD = 12.5 ns, tRP = 12.5 ns, tRC = 57.5 ns), ball-mapped WBGA-84 package details, OCD/ODT configuration support, and JEDEC-compliant DDR2-800 (5-5-5 / 6-6-6) operation across 0°C to 85°C.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned on reads and center-aligned on writes. It supports programmable CAS latency (CL = 3–7), additive latency (AL = 0–2), and write latency WL = RL − 1.

The device integrates DLL-based DQ/DQS alignment, off-chip driver (OCD) impedance calibration, and on-die termination (ODT) controlled via EMR(1) and EMR(2). Its command decoder accepts standard DDR2 commands-including Auto-precharge, Self Refresh, and Precharged Power Down-with full JEDEC AC/DC compliance for DDR2-800 operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mbit (8,388,608 words × 4 banks × 16 bits)
Data Rate DDR2-800: 800 Mb/s per pin (tCK = 2.5 ns min @ CL=5/6)
CAS Latency Programmable CL = 3, 4, 5, 6, or 7 - sets minimum read access delay after column address
tRCD / tRP 12.5 ns min - defines minimum delay between ACTIVE and READ/WRITE or PRECHARGE commands
VDD / VDDQ 1.8 V ± 0.1 V - strict dual-supply requirement for core logic and I/O buffers
Interface Standard SSTL_18 - ensures signal integrity and compatibility with DDR2 controllers
Operating Temp 0°C ≤ TCASE ≤ 85°C - commercial-grade thermal envelope per JEDEC specification
Refresh Interval 7.8 µs max @ 85°C - determines required refresh command frequency for data retention

Pinout & Package

W9751G6KB-25 TR uses an 84-ball WBGA package (8 mm × 12.5 mm, RoHS-compliant, lead-free), with separate VDD/VSS and VDDQ/VSSQ power/ground domains for noise isolation, plus dedicated VDDL/VSSDL for DLL circuitry.

Pin/Terminal Circuit Role Design Meaning
A0–A12 Address Input Row/column address bus; A10 controls Auto-precharge enable during READ/WRITE
BA0–BA1 Bank Select Selects one of four internal banks for ACTIVE, READ, WRITE, or PRECHARGE commands
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; supports burst lengths of 4 or 8 with DM masking
UDQS / LDQS Differential Data Strobe Upper/lower byte source-synchronous strobes; edge-aligned on reads, center-aligned on writes
ODT On-Die Termination Control Active-HIGH enables internal termination resistors (RZQ/4, RZQ/2, RZQ) for impedance matching
CKE Clock Enable Gates internal clocking; LOW disables DLL and enters Power Down mode
CS, RAS, CAS, WE Command Inputs Encoded with CLK edge to issue all DDR2 commands (e.g., PRECHARGE ALL, REFRESH)
VREF Input Reference Voltage Reference for address/control input thresholds; must track VDDQ/2 ±300 mV

Key Features

Feature Design Value
On-Die Termination (ODT) Configurable termination resistances (RZQ/4, RZQ/2, RZQ) reduce stub reflections and improve signal integrity without external resistors
Off-Chip Driver (OCD) Calibration Dynamic impedance tuning of DQ output drivers using ZQ pin reference, enabling precise drive strength matching to PCB trace impedance
Posted CAS with Additive Latency AL = 0–2 allows pipelining of column commands ahead of row activation, improving bus utilization and bandwidth efficiency
Auto-precharge Automatic bank precharge triggered by burst end (READ/WRITE with AP bit), eliminating explicit PRECHARGE command overhead
DLL-based Clock Alignment Digital delay-locked loop synchronizes DQ and DQS edges to CLK crossing points, enabling stable timing margins at 400 MHz clock frequency
Power Management Modes Precharged Power Down, Active Power Down, and Self Refresh reduce IDD2P to 6–8 mA and IDD6 to 6 mA for low-power idle states

Applications

Industrial PLC Memory Buffer Network Router Packet Buffer

Use Scenario: Real-time deterministic data buffering in programmable logic controller (PLC) backplanes handling multiple I/O modules and motion control loops.

IC Role / Device Role / Timing Role: Primary working memory for firmware execution and cyclic process data exchange, interfaced to ARM Cortex-M7 or RISC-V SoC via 16-bit DDR2 bus.

Use Value: DDR2-800 bandwidth (1.6 GB/s peak) and tRC = 57.5 ns enable sub-100 µs response times for 16 kB buffer swaps, meeting IEC 61131-3 cycle time requirements.

Use Scenario: High-throughput packet buffering in Layer 3 enterprise routers supporting 10 GbE line cards and deep packet inspection engines.

IC Role / Device Role / Timing Role: Shared packet memory for ingress/egress queues, accessed concurrently by traffic manager and forwarding ASIC over DDR2 interface.

Use Value: ODT + OCD calibration maintains signal integrity across 8-layer PCB traces up to 8 inches, sustaining 800 Mb/s/pin under burst-heavy traffic loads.

Medical Imaging Display Controller Automotive ADAS Video Preprocessor

Use Scenario: Frame buffering for real-time ultrasound or MRI display pipelines requiring low-latency pixel streaming and gamma correction LUT storage.

IC Role / Device Role / Timing Role: Dual-port memory resource shared between FPGA video engine and ARM application processor, configured with AL=1 for overlapped command scheduling.

Use Value: CL=5 + tRCD=12.5 ns guarantees ≤20 ns read-to-read turnaround, enabling 60 fps 1920×1080 RGB888 frame rendering with zero visible tearing.

Use Scenario: Vision preprocessing buffer in automotive surround-view systems, storing raw sensor frames from four 1.3 MP CMOS imagers before stitching and object detection.

IC Role / Device Role / Timing Role: Burst-accessed scratchpad memory for FPGA-based image warping and color space conversion, leveraging Auto-precharge to minimize inter-burst gaps.

Use Value: 16-bit bus width and BL=8 deliver 128-byte bursts per access, reducing memory transaction count by 50% vs. 8-bit SDR, critical for real-time 30 fps processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT47H64M16HR-25E 64M × 16-bit, same DDR2-800 speed grade, but uses TSOP-84 instead of WBGA-84; no VDDL/VSSDL pins Requires PCB redesign due to different footprint and thermal profile; lacks dedicated DLL power domain Select when board layout prioritizes mechanical robustness over density or when legacy TSOP tooling is in use
IS42S16160F-6BL Same 512Mbit density and WBGA-84 package, but rated for DDR2-667 only (tCK = 3 ns min); CL = 3–5 only Lower bandwidth (1.06 GB/s peak) and reduced timing margin; not suitable for 400 MHz system clocks Choose only if cost sensitivity outweighs performance needs and system clock is capped at ≤333 MHz

Compared with MT47H64M16HR-25E and IS42S16160F-6BL, W9751G6KB-25 TR provides superior signal integrity via isolated DLL supplies (VDDL/VSSDL), higher DDR2-800 bandwidth headroom, and JEDEC-compliant ODT/OCD calibration - making it optimal for dense, high-reliability industrial and networking designs where WBGA packaging and precise impedance control are mandatory.

Availability

W9751G6KB-25 TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant DDR2 memory solutions.

Supply support for W9751G6KB-25 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory, flash, and DRAM solutions for industrial, communications, and consumer markets.

The W9751G6KB series belongs to Winbond's DDR2 SDRAM product line, designed specifically for cost-sensitive yet reliability-critical embedded systems needing JEDEC-compliant, high-density, low-voltage memory with advanced signal integrity features.

FAQ

What is the maximum supported CAS latency for W9751G6KB-25 TR?

W9751G6KB-25 TR supports programmable CAS latency values of CL = 3, 4, 5, 6, and 7. At its rated DDR2-800 speed grade, CL = 5 and CL = 6 are the most commonly used settings, corresponding to tCK = 2.5 ns minimum clock period. CL = 7 is supported but requires slower timing margins and is typically reserved for margin testing or derated operation.

Does W9751G6KB-25 TR require external termination resistors?

No, W9751G6KB-25 TR integrates on-die termination (ODT) with selectable resistance values (RZQ/4, RZQ/2, RZQ) controlled via EMR(1). When enabled, ODT eliminates the need for external parallel termination on DQ, DQS, and DM lines - simplifying PCB layout and improving signal integrity in point-to-point or fly-by topologies.

What is the purpose of the VDDL and VSSDL pins on W9751G6KB-25 TR?

VDDL (Ball J1) and VSSDL (Ball J7) are dedicated power and ground supplies for the internal DLL (Delay-Locked Loop) circuitry. Isolating the DLL domain minimizes noise coupling from core logic and I/O switching, ensuring stable DQ/DQS alignment at DDR2-800 speeds. These pins must be decoupled independently per datasheet guidelines.

Can W9751G6KB-25 TR operate in Self Refresh mode at 95°C?

Yes, but only when configured with the 25I speed grade variant (W9751G6KB25I). The W9751G6KB-25 TR is rated for 0°C to 85°C operation. For 95°C support, the device must enter Self Refresh with doubled refresh rate (tREFI = 3.9 µS) and EMR(2) bit A7 = 1 - functionality exclusive to industrial-grade (-25I) parts, not the commercial -25 variant.

How is OCD calibration performed on W9751G6KB-25 TR?

OCD calibration on W9751G6KB-25 TR is initiated via EMRS to EMR(1) with A9=A8=A7=HIGH, followed by a ZQCL (ZQ calibration long) command. It adjusts DQ output driver impedance to match the external ZQ reference resistor (240 Ω ±1%). Calibration must complete within 200+ clock cycles after DLL reset and is required after power-up or mode changes affecting drive strength.

W9751G6KB-25 TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
84-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
512Mbit
Memory Organization:
32M x 16
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
57.5 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-WBGA (8x12.5)

W9751G6KB-25 TR FAQ

1.How can I place an order for W9751G6KB-25 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9751G6KB-25 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9751G6KB-25 TR reliable?

The price and inventory of W9751G6KB-25 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9751G6KB-25 TR is usually 5 days.

3.What payment methods are accepted for W9751G6KB-25 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9751G6KB-25 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9751G6KB-25 TR?

W9751G6KB-25 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9751G6KB-25 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9751G6KB-25 TR?

For technical support, including W9751G6KB-25 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9751G6KB-25 TR requirements.

6.How does Aetrix verify that W9751G6KB-25 TR is sourced from the original manufacturer or authorized distributors?

All W9751G6KB-25 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9751G6KB-25 TR meets industry standards.

7.What is the process for return or replacement of W9751G6KB-25 TR?

All W9751G6KB-25 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9751G6KB-25 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9751G6KB-25 TR part is unused and in its original packaging.

Return procedure for W9751G6KB-25 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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