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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Winbond Electronics Corporation W9751G6NB25I TR

Name: W9751G6NB25I TR
Brand: Winbond Electronics Corporation
SKU: W9751G6NB25I TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9751G6NB25I TR

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 84-VFBGA

Datasheet:: W9751G6NB25I TR.pdf

Description:: IC DRAM 512MBIT PAR 84VFBGA

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Product details

Overview

W9751G6NB25I TR from Winbond is a 512 Mbit DDR2 SDRAM organized as 8,388,608 words × 4 banks × 16 bits, supporting DDR2-800 (5-5-5 or 6-6-6) operation at up to 400 MHz clock frequency with CL=5/6, tRCD/tRP ≥12.5 ns, and industrial temperature range (−40°C to +95°C). It delivers 1.6 Gbps data rate per pin using SSTL_18 interface, integrated ODT and OCD calibration, and is used in embedded networking, industrial HMIs, and legacy SoC memory subsystems.

For engineers reviewing the W9751G6NB25I TR datasheet, W9751G6NB25I TR pinout, W9751G6NB25I TR application, or W9751G6NB25I TR equivalent, key selection criteria include verified DDR2-800 timing compliance, VDD/VDDQ = 1.8 V ±0.1 V operation, 84-ball VFBGA (8×12.5 mm, 1.0 mm height) package compatibility, and support for auto-precharge, self-refresh, and differential DQS strobes.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with DLL-aligned DQ/DQS timing and source-synchronous read/write data capture. It supports programmable CAS latency (CL=3–7), additive latency (AL=0–2), burst lengths of 4 or 8, and posted CAS for improved command bus efficiency.

Functional control includes on-die termination (ODT) enabled via dedicated ODT pin, off-chip driver impedance adjustment (OCD) calibrated through EMR(1), and bank-select addressing via BA0/BA1. The device integrates four independent 128-Mbit banks with shared address/command bus and separate DQ/DQS lanes per byte group (DQ0–7/LDQS, DQ8–15/UDQS).

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mbit (8M × 4 banks × 16-bit)
Data Rate	800 Mbps per pin (DDR2-800, 400 MHz clock)
CAS Latency	Programmable CL=5 or CL=6 - determines minimum read access delay after column address
tRCD / tRP	≥12.5 ns - minimum delay between ACTIVE and READ/WRITE or PRECHARGE commands
Supply Voltage	VDD = VDDQ = 1.8 V ± 0.1 V - strict rail tolerance required for signal integrity and JEDEC compliance
Operating Temperature	−40°C to +95°C - qualified for industrial environments without derating
Package	VFBGA-84 (8 mm × 12.5 mm, 1.0 mm height, RoHS-compliant lead-free)
Interface Standard	SSTL_18 - defines input thresholds, drive strength, and termination requirements

Pinout & Package

VFBGA-84 package (8 mm × 12.5 mm, 1.0 mm thickness), RoHS-compliant, lead-free construction with isolated VSSQ/VDDL/VSSDL grounds for noise suppression and signal integrity.

Pin/Terminal	Circuit Role	Design Meaning
A0–A12	Address Input	Row/column address bus; A10 controls auto-precharge on read/write
BA0, BA1	Bank Select	Selects one of four internal banks for ACTIVE/READ/WRITE/PRECHARGE
DQ0–DQ15	Bidirectional Data I/O	16-bit data bus; split into lower (DQ0–7) and upper (DQ8–15) bytes
LDQS, LDQS	Lower-Byte Differential Strobe	Source-synchronous edge-aligned read / center-aligned write strobe for DQ0–7
UDQS, UDQS	Upper-Byte Differential Strobe	Source-synchronous edge-aligned read / center-aligned write strobe for DQ8–15
ODT	On-Die Termination Control	Active-HIGH enables internal termination resistors (75 Ω or 150 Ω) on DQ/DQS lines
CKE	Clock Enable	Gates internal clocking; LOW forces power-down modes (precharged/active)
CS, RAS, CAS, WE	Command Inputs	Encoded command bus (e.g., CS+RAS+CAS+WE = PRECHARGE ALL)
CLK, CLK	Differential Clock Input	Sampling edge defined by crossing of CLK rising and CLK falling; all commands latched here
VREF	Input Reference Voltage	Reference for address/control input thresholds; must track VDDQ/2 ±300 mV
VDD, VDDQ, VDDL	Power Supplies	VDD/VDDQ = 1.8 V ±0.1 V core/I/O; VDDL = 1.8 V ±0.1 V for DLL circuitry
VSS, VSSQ, VSSDL	Ground Planes	Separate analog/digital/power grounds reduce crosstalk and improve timing margin

Key Features

Feature	Design Value
On-Die Termination (ODT)	Configurable 75 Ω or 150 Ω termination on DQ/DQS pins reduces external component count and improves signal integrity
Off-Chip Driver (OCD) Calibration	EMR(1)-based impedance tuning ensures precise output drive strength matching across voltage/temperature
Auto-Precharge	Automatic bank precharge triggered by burst read/write with auto-precharge bit - eliminates explicit PRECHARGE command overhead
Self-Refresh Mode	Autonomous refresh during CKE-low; IDD6 ≤ 6 mA at TCASE ≤ 85°C - enables low-power standby in battery-backed systems
Differential DQS Strobes	Separate LDQS/UDQS pairs per byte lane enable robust source-synchronous timing with <10 ps skew tolerance
Industrial Temp Grade	Rated −40°C to +95°C with full AC/DC specification compliance - no derating required for extended thermal environments

Applications

Industrial HMI Controllers	Legacy Networking Switches
Use Scenario: Touch-enabled panel PCs and programmable logic controllers requiring deterministic memory response under thermal stress. IC Role / Device Role / Timing Role: Primary system memory interfaced to ARM9/ARM11 SoCs with synchronous DDR2 controller, providing 16-bit wide data path and burst-8 reads for GUI frame buffers. Use Value: Stable operation at −40°C to +95°C avoids thermal throttling; ODT and OCD ensure signal integrity across long PCB traces in DIN-rail mounted enclosures.	Use Scenario: Layer 2 Ethernet switches with legacy MIPS-based packet processors needing cost-optimized, JEDEC-compliant DDR2 memory. IC Role / Device Role / Timing Role: External program/data memory for switch fabric ASICs, supporting burst-4 writes for packet descriptor tables and burst-8 reads for forwarding lookups. Use Value: DDR2-800 (5-5-5) timing meets throughput requirements for 100 Mbps switching; VFBGA-84 footprint allows high-density routing on 4-layer backplanes.
Medical Diagnostic Terminals	Automated Test Equipment (ATE)
Use Scenario: Portable ultrasound and ECG analyzers where memory reliability must be maintained during repeated thermal cycling. IC Role / Device Role / Timing Role: Frame buffer and acquisition memory for FPGA-based image pipelines, operating in conjunction with dual-channel DDR2 controllers. Use Value: Self-refresh current ≤6 mA extends battery life during idle; industrial temp rating eliminates need for active cooling in sealed chassis.	Use Scenario: Benchtop test instruments requiring deterministic memory access for real-time waveform capture and pattern generation. IC Role / Device Role / Timing Role: High-speed acquisition buffer for ADC/DAC co-processors, leveraging posted CAS and AL=1 to minimize command bus contention during burst transfers. Use Value: CL=5/6 and tRCD/tRP=12.5 ns guarantee sub-30 ns read latency; differential DQS strobes suppress jitter in mixed-signal PCB layouts.

Industrial HMI Controllers

Legacy Networking Switches

Use Scenario: Touch-enabled panel PCs and programmable logic controllers requiring deterministic memory response under thermal stress.

IC Role / Device Role / Timing Role: Primary system memory interfaced to ARM9/ARM11 SoCs with synchronous DDR2 controller, providing 16-bit wide data path and burst-8 reads for GUI frame buffers.

Use Value: Stable operation at −40°C to +95°C avoids thermal throttling; ODT and OCD ensure signal integrity across long PCB traces in DIN-rail mounted enclosures.

Use Scenario: Layer 2 Ethernet switches with legacy MIPS-based packet processors needing cost-optimized, JEDEC-compliant DDR2 memory.

IC Role / Device Role / Timing Role: External program/data memory for switch fabric ASICs, supporting burst-4 writes for packet descriptor tables and burst-8 reads for forwarding lookups.

Use Value: DDR2-800 (5-5-5) timing meets throughput requirements for 100 Mbps switching; VFBGA-84 footprint allows high-density routing on 4-layer backplanes.

Medical Diagnostic Terminals

Automated Test Equipment (ATE)

Use Scenario: Portable ultrasound and ECG analyzers where memory reliability must be maintained during repeated thermal cycling.

IC Role / Device Role / Timing Role: Frame buffer and acquisition memory for FPGA-based image pipelines, operating in conjunction with dual-channel DDR2 controllers.

Use Value: Self-refresh current ≤6 mA extends battery life during idle; industrial temp rating eliminates need for active cooling in sealed chassis.

Use Scenario: Benchtop test instruments requiring deterministic memory access for real-time waveform capture and pattern generation.

IC Role / Device Role / Timing Role: High-speed acquisition buffer for ADC/DAC co-processors, leveraging posted CAS and AL=1 to minimize command bus contention during burst transfers.

Use Value: CL=5/6 and tRCD/tRP=12.5 ns guarantee sub-30 ns read latency; differential DQS strobes suppress jitter in mixed-signal PCB layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MT47H64M16HR-25E IT:J	64M × 16-bit, DDR2-800, same VDD/VDDQ, but 96-ball FBGA (11×13 mm); higher IDD0 (110 mA vs. 90 mA)	Requires PCB redesign due to larger footprint and different ball map; better suited for new designs with space margin	Select if migrating to newer Micron platform with extended lifecycle support and broader speed bin availability
IS42S16160F-6BLI	64M × 16-bit, DDR2-667 only (CL=5, tRCD/tRP=15 ns); same 84-ball VFBGA; lower max frequency limits bandwidth	Compatible pinout but cannot meet DDR2-800 timing - suitable only for cost-sensitive, lower-throughput upgrades	Select only when existing design operates below 400 MHz and requires lowest-cost drop-in replacement with identical mechanical fit

Compared with MT47H64M16HR-25E IT:J and IS42S16160F-6BLI, the W9751G6NB25I TR offers optimal balance of industrial temperature support, DDR2-800 performance, and 84-ball VFBGA compatibility - enabling direct replacement in legacy Winbond-based designs without layout change or timing revalidation.

Availability

W9751G6NB25I TR is available at Aetrix Electronics and suitable for industrial HMI controllers, legacy networking switches, and medical diagnostic terminals requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9751G6NB25I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory, flash storage, and microcontrollers, with over 30 years of DRAM design heritage and JEDEC-compliant product validation.

The W9751G6NB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, engineered for long-lifecycle deployment in embedded systems where thermal robustness, JEDEC compliance, and supply chain stability are critical.

FAQ

What is the maximum supported data rate for W9751G6NB25I TR?

The W9751G6NB25I TR supports DDR2-800 operation at 400 MHz clock frequency, delivering 800 Mbps per data pin. This is confirmed by its -25I speed grade designation and compliance with JEDEC DDR2-800 (5-5-5 or 6-6-6) timing specifications. The device achieves this rate using SSTL_18 signaling and DLL-aligned DQ/DQS timing, with CL=5 or CL=6 programmable via mode register.

Does W9751G6NB25I TR support differential DQS strobes?

Yes, W9751G6NB25I TR supports differential DQS strobes via LDQS/LDQS and UDQS/UDQS pins. These are enabled through EMR(1) configuration and provide source-synchronous, edge-aligned read and center-aligned write timing for DQ0–7 and DQ8–15 respectively - improving timing margin and reducing skew in high-speed layouts.

What is the operating temperature range of W9751G6NB25I TR?

W9751G6NB25I TR is rated for industrial operation from −40°C to +95°C, with full AC and DC parameter compliance across this range. This is specified in the order information table and validated by doubled auto-refresh rate (tREFI = 3.9 µS) and EMR(2) A7=1 configuration at high temperature - distinguishing it from commercial-grade -25 variants.

Can W9751G6NB25I TR be used as a direct replacement for W9751G6NB-25?

W9751G6NB25I TR is functionally and electrically identical to W9751G6NB-25 except for extended temperature qualification. Both share identical pinout, timing parameters, and electrical specs at 0°C to +85°C. However, W9751G6NB25I TR adds guaranteed operation up to +95°C with full JEDEC compliance - making it a drop-in upgrade for thermal-critical applications.

What package type does W9751G6NB25I TR use?

W9751G6NB25I TR uses an 84-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 8 mm × 12.5 mm with 1.0 mm height. It is RoHS-compliant and lead-free, with separate VSSQ, VSSDL, and VSS grounds to isolate I/O noise from core logic - as documented in the package specification and ball configuration diagrams.

W9751G6NB25I TR Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 84-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM - DDR2

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: 400 MHz

Write Cycle Time - Word, Page:: 15ns

Access Time:: 57.5 ns

Voltage - Supply:: 1.7V ~ 1.9V

Operating Temperature:: -40°C ~ 95°C (TC)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 84-VFBGA (8x12.5)

W9751G6NB25I TR FAQ

1.How can I place an order for W9751G6NB25I TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9751G6NB25I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9751G6NB25I TR reliable?

The price and inventory of W9751G6NB25I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9751G6NB25I TR is usually 5 days.

3.What payment methods are accepted for W9751G6NB25I TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9751G6NB25I TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9751G6NB25I TR?

W9751G6NB25I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9751G6NB25I TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9751G6NB25I TR?

For technical support, including W9751G6NB25I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9751G6NB25I TR requirements.

6.How does Aetrix verify that W9751G6NB25I TR is sourced from the original manufacturer or authorized distributors?

All W9751G6NB25I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9751G6NB25I TR meets industry standards.

7.What is the process for return or replacement of W9751G6NB25I TR?

All W9751G6NB25I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9751G6NB25I TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9751G6NB25I TR part is unused and in its original packaging.

Return procedure for W9751G6NB25I TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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