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Winbond Electronics Corporation W9751G8KB25I

Part No.:
W9751G8KB25I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW9751G8KB25I.pdf
Description:
IC DRAM 512MBIT PARALLEL 60WBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,407

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Product details

Overview

W9751G8KB25I from Winbond Electronics is a 512M-bit DDR2 SDRAM organized as 16M words × 4 banks × 8 bits, operating at DDR2-800 speed (5-5-5 or 6-6-6 timing), with 1.8 V ±0.1 V supply, industrial temperature range (−40°C to +95°C), and WBGA-60 package. It serves as main memory in embedded controllers, network processors, and industrial HMIs requiring reliable high-bandwidth data buffering.

For engineers reviewing the W9751G8KB25I datasheet, W9751G8KB25I pinout, W9751G8KB25I application, or W9751G8KB25I equivalent, key selection criteria include CAS latency support (CL=3–7), on-die termination (ODT) programmability, OCD impedance calibration, differential clock interface (CLK/CLK), and industrial-grade thermal stability.

Technical Context

This DDR2 SDRAM implements a double-data-rate architecture synchronized to differential CLK/CLK inputs, with bi-directional DQS/DQS strobes edge-aligned for reads and center-aligned for writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 400 MHz operation (200 MHz clock, 800 MT/s).

It supports programmable additive latency (AL=0–2), auto-precharge, burst lengths of 4 or 8, and on-die termination controlled via ODT pin and EMR(1). Power management includes precharged power down, self-refresh (IDD6 ≤ 6 mA), and burst refresh (IDD5B ≤ 80 mA).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mbit (16M × 4 banks × 8 bits) - defines total addressable storage capacity
Data RateDDR2-800 (800 MT/s) - enables 6.4 GB/s peak bandwidth across 8-bit bus
CAS LatencyCL = 3, 4, 5, 6, or 7 - determines minimum read access delay in clock cycles
Burst Length4 or 8 - sets number of consecutive data transfers per read/write command
Supply VoltageVDD/VDDQ/VDDL = 1.8 V ± 0.1 V - requires tight-regulated 1.8 V rail for signal integrity
Operating Temp−40°C to +95°C case temperature - validated for extended industrial environments
PackageWBGA-60 (8 mm × 12.5 mm) - surface-mount ball grid array with RoHS-compliant lead-free finish
Interface StandardSSTL_18 - mandates 1.8 V I/O signaling compatible with DDR2 controllers

Pinout & Package

W9751G8KB25I uses a 60-ball WBGA package (8 mm × 12.5 mm) with lead-free, RoHS-compliant construction. Ball pitch is 0.8 mm, and balls are arranged in an 8×8 grid with corner omissions.

Pin/TerminalCircuit RoleDesign Meaning
A0–A13Address InputsRow/column address bus; A10 controls auto-precharge on read/write commands
BA0, BA1Bank SelectSelects one of four internal banks for active, read, write, or precharge operations
DQ0–DQ7Data I/O8-bit bidirectional data bus; shares pins for input and output with DQS-synchronized timing
DQS, DQSDifferential Data StrobeSource-synchronous strobe; edge-aligned with read data, center-aligned with write data
CKEClock EnableAsynchronous enable/disable of internal clock circuitry; LOW halts all operations
CS, RAS, CAS, WECommand ControlEncoded command inputs; define active, read, write, precharge, refresh, and mode register operations
CLK, CLKDifferential ClockPrimary timing reference; all address/control sampled at crossing of CLK rising and CLK falling
ODTOn-Die Termination EnableActive-HIGH control of internal termination resistors to reduce stub reflections on DQ/DQS lines
DM/RDQSData Mask / Read StrobeInput mask for write data (DM); outputs read strobe when RDQS enabled via EMR(1)
VREFInput Reference VoltageMid-supply reference (VDDQ/2) for SSTL_18 input threshold; must track VDDQ within ±300 mV

Key Features

FeatureDesign Value
Programmable CAS LatencyCL = 3–7 supports flexible timing tuning for varying controller capabilities and PCB trace lengths
On-Die Termination (ODT)Configurable pull-up/pull-down termination reduces signal reflections without external resistors
Off-Chip Driver (OCD) CalibrationDynamic impedance matching of DQ outputs improves signal integrity under voltage/temperature drift
Auto-PrechargeAutomatic bank precharge after burst completes - eliminates explicit precharge command overhead
Differential Clock InterfaceCLK/CLK differential pair rejects common-mode noise and enables precise edge sampling
Industrial Temperature Range−40°C to +95°C case rating ensures reliability in uncontrolled enclosures and outdoor deployments

Applications

Industrial HMI SystemsNetwork Edge Routers

Use Scenario: Touch-enabled operator panels in factory automation require fast frame buffer updates and persistent memory retention during ambient temperature swings.

IC Role / Device Role / Timing Role: W9751G8KB25I serves as primary graphics and system memory buffer, interfacing directly with ARM-based SoC via DDR2 controller.

Use Value: Industrial temperature rating (−40°C to +95°C) and self-refresh current ≤6 mA ensure uninterrupted operation during thermal cycling and standby modes.

Use Scenario: Packet buffering in Layer 3 switches handling 1 Gbps traffic with real-time QoS scheduling and deep packet inspection.

IC Role / Device Role / Timing Role: W9751G8KB25I provides low-latency, high-throughput packet memory for ingress/egress queues and forwarding tables.

Use Value: DDR2-800 speed (800 MT/s) and burst length 8 deliver 6.4 GB/s bandwidth needed for concurrent multi-stream buffering without bottlenecking the MAC interface.

Medical Diagnostic ImagingAutomated Test Equipment (ATE)

Use Scenario: Ultrasound and digital X-ray systems capture high-resolution image frames requiring rapid bulk memory writes and deterministic read latency.

IC Role / Device Role / Timing Role: W9751G8KB25I acts as frame buffer memory for FPGA-accelerated image processing pipelines.

Use Value: Programmable CL=3–7 and AL=0–2 allow fine-grained timing alignment with FPGA DDR2 PHY, minimizing setup/hold violations on long traces.

Use Scenario: High-speed digital pattern generators and logic analyzers need deterministic memory access for waveform capture and stimulus replay at >200 MHz sampling rates.

IC Role / Device Role / Timing Role: W9751G8KB25I functions as acquisition memory, synchronized to system clock via differential CLK/CLK inputs.

Use Value: Differential DQS strobing and DLL alignment ensure sub-nanosecond timing margin for accurate data capture at 400 MHz effective rate.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR2 SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT47H64M4HQ-25E64M × 4 organization (256 Mbit), same DDR2-800 speed grade, but -25E industrial temp (−40°C to +95°C) and FBGA-60 packageLower density; suitable where memory footprint or cost constraints limit to 256 MbitSelect if system design targets lower memory capacity and requires Micron's qualification documentation and long-term supply assurance
IS42S16400F-25BLI16M × 16 organization (256 Mbit), DDR2-800, industrial temp, TFBGA-60; differs in data bus width (16-bit vs 8-bit) and bank addressing16-bit interface reduces pin count but requires controller reconfiguration; not drop-in compatibleChoose only when redesigning for wider data path and accepting layout changes to accommodate different ball map and signal routing

Compared with MT47H64M4HQ-25E and IS42S16400F-25BLI, W9751G8KB25I offers higher 512 Mbit density in an 8-bit configuration, making it optimal for space-constrained designs needing maximum storage per byte-lane while retaining industrial thermal robustness.

Availability

W9751G8KB25I is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical imaging subsystems, and automated test equipment requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9751G8KB25I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W9751G8KB series belongs to Winbond's industrial-grade DDR2 SDRAM product line, designed specifically for embedded systems demanding extended temperature operation, low-power self-refresh, and robust signal integrity in electrically noisy environments.

FAQ

What is the maximum data rate supported by W9751G8KB25I?

W9751G8KB25I supports DDR2-800 operation at 800 MT/s (400 MHz clock frequency), compliant with both 5-5-5 and 6-6-6 timing specifications. This delivers a peak bandwidth of 6.4 GB/s across its 8-bit data bus. The device achieves this using differential CLK/CLK inputs and DLL-aligned DQS strobes to maintain timing margins under industrial temperature variation.

Does W9751G8KB25I support on-die termination (ODT)?

Yes, W9751G8KB25I supports programmable on-die termination (ODT) controlled via the ODT pin and extended mode register EMR(1). When ODT is asserted HIGH, internal termination resistors are enabled on DQ and DQS lines to suppress signal reflections. This eliminates the need for external termination resistors and simplifies PCB layout for high-speed DDR2 interfaces.

What is the operating temperature range for W9751G8KB25I?

W9751G8KB25I is rated for industrial operation from −40°C to +95°C case temperature (TCASE). This specification is explicitly confirmed in the order information table for the "25I" speed grade suffix and validated across all AC/DC electrical characteristics in the datasheet, making it suitable for deployment in unheated enclosures, outdoor kiosks, and factory-floor equipment.

How many banks and what organization does W9751G8KB25I use?

W9751G8KB25I is organized as 16,777,216 words × 4 banks × 8 bits, totaling 512 Mbits. It contains four independent memory banks (Bank 0–3), each selectable via BA0/BA1, enabling interleaved access to improve effective bandwidth and hide row activation latency during sequential operations.

Can W9751G8KB25I be used with a single-ended clock instead of differential CLK/CLK?

No, W9751G8KB25I requires differential clock inputs (CLK and CLK) as specified in the general description and functional sections. All address and control signals are latched at the crossing of CLK rising and CLK falling edges. Using a single-ended clock violates the device's timing architecture and will result in undefined behavior or initialization failure.

W9751G8KB25I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR2
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
57.5 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 95°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-WBGA (8x12.5)

W9751G8KB25I FAQ

1.How can I place an order for W9751G8KB25I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9751G8KB25I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9751G8KB25I reliable?

The price and inventory of W9751G8KB25I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9751G8KB25I is usually 5 days.

3.What payment methods are accepted for W9751G8KB25I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9751G8KB25I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9751G8KB25I?

W9751G8KB25I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9751G8KB25I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9751G8KB25I?

For technical support, including W9751G8KB25I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9751G8KB25I requirements.

6.How does Aetrix verify that W9751G8KB25I is sourced from the original manufacturer or authorized distributors?

All W9751G8KB25I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9751G8KB25I meets industry standards.

7.What is the process for return or replacement of W9751G8KB25I?

All W9751G8KB25I units undergo pre-shipment inspection (PSI). If there is an issue with W9751G8KB25I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9751G8KB25I part is unused and in its original packaging.

Return procedure for W9751G8KB25I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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