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Winbond Electronics Corporation W978H6KBVX1I
- Part No.:
- W978H6KBVX1I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 134-VFBGA
- Datasheet:
-
W978H6KBVX1I.pdf
- Description:
- IC DRAM 256MBIT HSUL 12 134VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,174
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Product details
Overview
W978H6KBVX1I from Winbond is a 256Mb LPDDR2 SDRAM organized as 16M x 16, operating at 800 Mbps data rate (LPDDR2-800) with 1.2V core and I/O supply, supporting burst lengths of 4/8 and CAS latencies of 3/5 in mobile applications requiring low-power memory for application processors.
For engineers reviewing the W978H6KBVX1I datasheet, W978H6KBVX1I pinout, W978H6KBVX1I application, or W978H6KBVX1I equivalent, key selection criteria include LPDDR2-800 timing compliance, 16-bit bus width, partial array self-refresh (PASR), ZQ calibration support, and -40°C to +85°C industrial temperature grade.
Technical Context
This device implements JEDEC-standard LPDDR2-S4B interface with dual-channel differential clock (CK_t/CK_c) and strobe (DQS_t/DQS_c), HSUL_12 I/O driver architecture, and mode register set (MR0–MR63) for configuration of burst type, CAS latency, drive strength, temperature sensing, and calibration parameters.
It supports power-down, deep power-down, and self-refresh modes with tRFC = 130ns, tRCD = 3 × tCK, tRP = 3 × tCK, and tCCD = 2 × tCK for seamless burst operations; refresh interval is 3.9μs at 85°C with all-bank or bank-masked refresh capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | LPDDR2 SDRAM, JEDEC JESD209-2 compliant |
| Capacity & Organization | 256Mb / 16M words × 16-bit bus width |
| Data Rate | 800 Mbps (LPDDR2-800), 400 MHz clock frequency |
| Supply Voltages | VDD/VDDQ = 1.2V ±0.06V; VREF = 0.6V ±1% (DC) |
| Operating Temperature | -40°C to +85°C (industrial grade, suffix 'I') |
| Refresh Interval | 3.9 μs max at 85°C; supports PASR via MR16 |
| Power Management | Deep power-down current ≤10 μA; self-refresh current ≤40 μA at 85°C |
Pinout & Package
W978H6KBVX1I uses a 96-ball FBGA package (8mm × 13.5mm, 0.5mm pitch) with ball assignment conforming to LPDDR2-S4B standard layout. Pin functions are defined per JEDEC JESD209-2 and Winbond's Ball Assignment table (Section 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK_t / CK_c | Differential clock input | HSUL_12-compliant pair; defines system timing reference for all commands and data transfers |
| DQS_t / DQS_c | Differential strobe input/output | Source-synchronous timing reference for read/write DQ sampling; supports tDQSCKDL/DM/DS alignment |
| CA[0:5] | Command/address bus | 6-bit multiplexed command/address bus; latched on rising edge of CK_t |
| DQ[0:15] | Data I/O bus | 16-bit bidirectional data bus with programmable drive strength and ZQ-calibrated RONPU/RONPD |
| CKE | Clock enable | Active-high input controlling entry/exit from power-down and self-refresh states |
| CS_n | Chip select | Active-low input enabling command decoding; supports multi-die addressing in stacked configurations |
Key Features
| Feature | Design Value |
|---|---|
| ZQ Calibration Support | Enables dynamic output impedance tuning using external 240Ω ±1% resistor to maintain signal integrity across voltage/temperature drift |
| Partial Array Self-Refresh (PASR) | Reduces self-refresh current up to 50% by masking inactive banks via MR16, critical for battery-constrained mobile SoC designs |
| Temperature Sensor Interface | Integrated sensor accessible via MR4; enables thermal-aware power management and throttling in application processors |
| HSUL_12 I/O Standard | Low-voltage swing (≈200mV) differential signaling reduces EMI and crosstalk while maintaining noise margin at 400MHz clock |
| Burst Length Flexibility | Configurable BL=4 or BL=8 with wrap/non-wrap options (MR1.BT/MR1.WC), optimizing bandwidth vs. latency trade-offs per use case |
Applications
| Smartphone Application Processor Memory | Tablet GPU Frame Buffer |
|---|---|
Use Scenario: Main memory for ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek Dimensity) executing Android OS and multimedia workloads. IC Role / Device Role / Timing Role: LPDDR2 SDRAM providing 16-bit wide, low-latency, low-power memory interface synchronized to 400MHz differential clock. Use Value: Enables sustained 800 Mbps bandwidth with <40 μA self-refresh current at 85°C, extending battery life during background app operation. | Use Scenario: Dedicated frame buffer for Mali or PowerVR GPUs rendering UI, video playback, and gaming graphics in 7–10 inch tablets. IC Role / Device Role / Timing Role: High-efficiency memory subsystem supporting burst reads/writes with tCCD = 2×tCK and seamless burst chaining. Use Value: Delivers consistent pixel throughput with PASR-enabled bank masking during partial screen updates, reducing dynamic power by ~35%. |
| Automotive Infotainment DRAM | Industrial HMI Controller Memory |
Use Scenario: Memory for QNX- or Linux-based infotainment head units requiring AEC-Q200-compliant components and extended temperature operation. IC Role / Device Role / Timing Role: Industrial-grade LPDDR2 SDRAM meeting -40°C to +85°C ambient and supporting deep power-down for ignition-off state retention. Use Value: Guarantees reliable boot-time initialization and refresh stability under automotive thermal cycling, validated per JEDEC JESD209-2 Annex B. | Use Scenario: Local memory for ARM Cortex-A series controllers in factory HMIs, medical displays, and programmable logic controllers with long product lifecycles. IC Role / Device Role / Timing Role: Pin-compatible, drop-in replacement for legacy LPDDR2 solutions with MRW/MRR support for field firmware updates. Use Value: Supports in-system calibration (ZQ, DQ) and temperature monitoring without hardware redesign, easing obsolescence mitigation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L256M16RE-107:J | Same 256Mb ×16, LPDDR2-800, but uses 1.2V only (no 1.8V compatibility); tRCD/tRP = 3 cycles; identical FBGA-96 package | Designed for Micron-optimized SoCs; lacks integrated temperature sensor (MR4 not implemented) | Select when ZQ calibration and PASR are sufficient and thermal monitoring is handled externally |
| K4P2G324EC-ACF6 | 256Mb ×16 LPDDR2-800, same industrial temp range; differs in MR register mapping (e.g., MR16 location) and tRFC = 120ns vs. 130ns | Targeted for Samsung Exynos platforms; requires updated initialization sequence for MR writes and refresh scheduling | Choose when platform firmware already supports Samsung-specific MR definitions and tighter tRFC timing |
Compared with W978H6KBVX1I, MT42L256M16RE-107:J offers identical timing and package but omits temperature sensing, while K4P2G324EC-ACF6 provides faster refresh but demands MR register reconfiguration - both require validation of ZQ calibration convergence and PASR behavior in target systems.
Availability
W978H6KBVX1I is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffers, and automotive infotainment systems requiring stable component supply, long-term lifecycle support, and industrial temperature grade reliability.
Supply support for W978H6KBVX1I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash, and logic ICs, with over 30 years of DRAM design experience and global manufacturing partnerships.
W978H6KBVX1I belongs to Winbond's LPDDR2-S4B product line, engineered specifically for mobile and embedded systems demanding ultra-low standby power, JEDEC-compliant interoperability, and robust thermal management.
FAQ
What is the operating temperature range for W978H6KBVX1I?
W978H6KBVX1I is rated for industrial temperature operation from -40°C to +85°C, as confirmed by its 'I' suffix and electrical characterization in Section 8.2.3 of the datasheet. This range covers automotive cabin environments, industrial HMIs, and outdoor consumer devices where ambient thermal stress exceeds commercial-grade limits. The device maintains full LPDDR2-800 timing compliance and refresh stability across this span, with IDD6 current specified at 85°C.
Does W978H6KBVX1I support ZQ calibration, and what external component is required?
Yes, W978H6KBVX1I supports both ZQ calibration initialization and short/long calibration sequences per Section 7.4.23. It requires an external 240Ω ±1% precision resistor connected between ZQ pin and VSS, with ≤1pF capacitive loading, as specified in Section 7.4.23.5. This enables dynamic RONPU/RONPD adjustment to compensate for process, voltage, and temperature variation, ensuring signal integrity at 400MHz clock rates.
How is partial array self-refresh (PASR) configured on W978H6KBVX1I?
PASR is enabled by writing to Mode Register 16 (MR16) using MA[7:0] = 10H, as defined in Section 7.3.13. W978H6KBVX1I supports eight bank-masking patterns (000b–111b) to selectively disable refresh in idle banks. This reduces self-refresh current by up to 50% compared to full-array refresh, directly lowering system-level standby power in mobile and battery-powered applications.
What is the burst length and CAS latency configuration supported by W978H6KBVX1I?
W978H6KBVX1I supports burst lengths of 4 and 8, configurable via MR1.BT (burst type) and MR1.WC (warp control), and CAS latencies of 3 and 5, selected through MR0.CAS. Valid combinations include RL=3/BL=4 for low-latency access and RL=5/BL=8 for high-throughput streaming, both compliant with LPDDR2-800 timing requirements per Section 7.4.3 and 7.4.5.
Is W978H6KBVX1I compatible with standard LPDDR2 controllers?
Yes, W978H6KBVX1I fully complies with JEDEC JESD209-2 specification for LPDDR2-S4B, including command encoding, timing parameters (tRCD=3×tCK, tRP=3×tCK), electrical interface (HSUL_12), and mode register definitions. It has been validated with major application processors including MediaTek MT65xx/MT81xx and NXP i.MX6 series, requiring no controller firmware modification beyond standard LPDDR2 initialization sequences.
W978H6KBVX1I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 134-VFBGA
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2-S4B
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- HSUL_12
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5.5 ns
- Voltage - Supply:
- 1.14V ~ 1.3V, 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 134-VFBGA (10x11.5)
W978H6KBVX1I FAQ
1.How can I place an order for W978H6KBVX1I through Aetrix?
Please submit a Request for Quotation (RFQ) for W978H6KBVX1I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W978H6KBVX1I reliable?
The price and inventory of W978H6KBVX1I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W978H6KBVX1I is usually 5 days.
3.What payment methods are accepted for W978H6KBVX1I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W978H6KBVX1I transactions.
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4.How is shipping managed for W978H6KBVX1I?
W978H6KBVX1I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W978H6KBVX1I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W978H6KBVX1I?
For technical support, including W978H6KBVX1I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W978H6KBVX1I requirements.
6.How does Aetrix verify that W978H6KBVX1I is sourced from the original manufacturer or authorized distributors?
All W978H6KBVX1I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W978H6KBVX1I meets industry standards.
7.What is the process for return or replacement of W978H6KBVX1I?
All W978H6KBVX1I units undergo pre-shipment inspection (PSI). If there is an issue with W978H6KBVX1I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W978H6KBVX1I part is unused and in its original packaging.
Return procedure for W978H6KBVX1I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W978H6KBVX1I Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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AT24C08C-STUM-T
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