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Winbond Electronics Corporation W978H6KBVX2I TR
- Part No.:
- W978H6KBVX2I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 134-VFBGA
- Datasheet:
-
W978H6KBVX2I TR.pdf
- Description:
- IC DRAM 256MBIT HSUL 12 134VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,964
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Product details
Overview
W978H6KBVX2I TR from Winbond is a 256Mb LPDDR2-S4B SDRAM organized as 16M x 16, operating at 800 Mbps data rate (LPDDR2-800) with 1.2V core/VDDQ supply and -40°C to +85°C industrial temperature grade. It supports burst lengths of 4/8, on-die termination, ZQ calibration, and partial array self-refresh for mobile and embedded applications requiring low-power memory.
For engineers reviewing the W978H6KBVX2I TR datasheet, W978H6KBVX2I TR pinout, W978H6KBVX2I TR application, or W978H6KBVX2I TR equivalent, key selection criteria include LPDDR2-800 timing compliance (tRCD = 3, tRP = 3), HSUL_12 I/O interface, 96-ball VFBGA package, and MR10-based DQ calibration support.
Technical Context
This LPDDR2 SDRAM implements dual-channel 16-bit wide I/O architecture with differential CK/CK# and DQS/DQS# strobes, supporting both single-ended CA signals and HSUL_12 output drivers. It uses mode registers MR0–MR63 for configuration including burst type, read/write latency (RL=3/5, WL=1), PASR bank masking, and temperature-sensing calibration.
Power management includes deep power-down, auto-precharge, and controlled power-up initialization sequences compliant with JEDEC JESD209-2A. The device integrates on-die termination (ODT) with programmable RZQ values and supports seamless burst transitions with tCCD = 2 cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | LPDDR2-S4B SDRAM, 256Mb density (16M × 16 organization) |
| Data Rate | 800 Mbps per pin (LPDDR2-800), tCK = 2.5 ns minimum clock period |
| Supply Voltage | VDD/VDDQ = 1.2V ±0.06V; supports industrial temperature range (-40°C to +85°C) |
| Interface Standard | JEDEC JESD209-2A compliant; HSUL_12 I/O with differential CK/DQS pairs |
| Timing Parameters | tRCD = tRP = 3 × tCK; tRRD = 2 × tCK; RL = 3 or 5; WL = 1 |
| Calibration Support | ZQ calibration (MR23), DQ calibration via MR32/MR40, and temperature-sensing MR4 |
| Power Modes | Active, Power-Down, Deep Power-Down, Self-Refresh, Partial Array Self-Refresh (PASR) |
Pinout & Package
W978H6KBVX2I TR is housed in a 96-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 9.0 mm × 12.0 mm × 1.0 mm (ball pitch: 0.5 mm), RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Edge-triggered system clock pair; defines all timing windows (tCK = 2.5 ns min) |
| DQS / DQS# | Differential data strobe | Source-synchronous read/write capture; tDQSCKmin/tDQSCKmax timing critical for setup/hold |
| CA[0:11] | Command/address bus | Single-ended inputs carrying row/column/bank commands; sampled on CK rising edge |
| DQ[0:15] | Data I/O lines | 16-bit bidirectional HSUL_12 interface; supports BL4/BL8 bursts with DM masking |
| CKE | Clock enable | Asynchronous control for power-down entry/exit and clock gating |
| RESET# | Hardware reset input | Active-low asynchronous reset; initiates initialization sequence without full power ramp |
Key Features
| Feature | Design Value |
|---|---|
| On-Die Termination (ODT) | Programmable RZQ-based ODT resistance enables impedance-matched signaling without external resistors |
| ZQ Calibration | MR23-triggered calibration adjusts output driver strength (RONPU/RONPD) to maintain signal integrity across voltage/temperature |
| Partial Array Self-Refresh (PASR) | MR16-configurable bank masking reduces current draw during self-refresh by refreshing only active banks |
| Temperature Sensor | Integrated sensor feeds MR4 register; enables dynamic refresh rate adjustment based on die temperature |
| HSUL_12 I/O Standard | Low-voltage swing (≈0.4V) differential interface minimizes EMI and power vs. SSTL while maintaining noise margin |
Applications
| Smartphone Application | Automotive Infotainment |
|---|---|
Use Scenario: Main application memory in mid-tier Android smartphones with ARM Cortex-A series SoCs. IC Role / Device Role / Timing Role: LPDDR2-800 SDRAM providing 1.28 GB/s peak bandwidth to SoC memory controller. Use Value: Low standby current (IDD6 ≤ 35 µA) and PASR extend battery life during display-off states. | Use Scenario: Graphics frame buffer and OS runtime memory in automotive head units with ASIL-B compatible SoCs. IC Role / Device Role / Timing Role: Industrial-grade LPDDR2 memory interfacing via HSUL_12 to NXP i.MX8 or Renesas R-Car H3. Use Value: -40°C to +85°C operation and MR4 temperature-aware refresh ensure reliability under cabin thermal cycling. |
| Industrial HMI Panel | Medical Portable Monitor |
Use Scenario: Real-time UI rendering and data logging buffer in factory-floor HMIs with ARM-based controllers. IC Role / Device Role / Timing Role: Dual-channel 16-bit LPDDR2 memory supporting concurrent graphics and application execution. Use Value: Deep power-down mode (IDD7 ≤ 10 µA) enables rapid wake-from-sleep response while meeting IEC 62368-1 power limits. | Use Scenario: Patient monitoring device requiring certified component lifetime and deterministic memory access. IC Role / Device Role / Timing Role: Certified LPDDR2 memory for FDA-regulated devices with traceable lot-level qualification. Use Value: MR10-based DQ calibration ensures consistent signal integrity across production batches and field temperature ranges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L256M16RE-125:E | Same 256Mb x16 LPDDR2-1066, but rated for -30°C to +85°C; higher speed grade (tCK = 1.875 ns) | Requires tighter timing margins; not drop-in for LPDDR2-800 designs using tRCD = 3 | Select when bandwidth >1.7 GB/s is required and controller supports RL=5/WL=2 |
| IS42S16160J-6BLI | Legacy LPDDR1 (not LPDDR2); 256Mb x16, 400 Mbps, 1.8V VDDQ; no ZQ/PASR/temperature sensor | Not JEDEC JESD209-2A compliant; incompatible command set and timing model | Only for legacy redesigns where LPDDR2 features are unused and voltage tolerance allows 1.8V interface |
Compared with MT42L256M16RE-125:E and IS42S16160J-6BLI, W978H6KBVX2I TR delivers optimal balance of industrial temperature support, LPDDR2-800 timing compliance, and advanced power management-making it suitable for cost-sensitive, thermally demanding embedded systems without over-specifying speed or sacrificing calibration capability.
Availability
W978H6KBVX2I TR is available at Aetrix Electronics and suitable for smartphone memory subsystems, automotive infotainment modules, and industrial HMI panels requiring stable component supply, long-term lifecycle assurance, and industrial temperature grade performance.
Supply support for W978H6KBVX2I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, RAM, and trusted computing ICs, serving consumer, industrial, and automotive markets since 1987.
The W978H6KB series belongs to Winbond's LPDDR2-S4B product line, designed specifically for space-constrained, low-power embedded systems needing JEDEC-compliant mobile DRAM with extended temperature operation and integrated calibration features.
FAQ
What is the ball count and package type of W978H6KBVX2I TR?
W978H6KBVX2I TR uses a 96-ball Very Fine Pitch Ball Grid Array (VFBGA) package with 0.5 mm ball pitch, measuring 9.0 mm × 12.0 mm × 1.0 mm. This compact footprint supports high-density PCB layouts typical in mobile and portable electronics where board space is constrained.
Does W978H6KBVX2I TR support ZQ calibration, and how is it initiated?
Yes, W978H6KBVX2I TR supports ZQ calibration per JEDEC JESD209-2A. Calibration is triggered by writing to Mode Register MR23 (MA[7:0] = 17H) using the MRW command. The device performs internal resistor adjustment to calibrate RONPU and RONPD output driver strengths against the external ZQ reference resistor.
What is the maximum supported burst length for W978H6KBVX2I TR, and how is it configured?
W978H6KBVX2I TR supports burst lengths of 4 and 8, selected via MR1 (MA[7:0] = 01H) bit [2:1] (Burst Length field). BL=4 is default; BL=8 requires MR1[2:1]=10b. Both modes operate with fixed burst type (sequential) and support seamless transitions with tCCD = 2 cycles.
Can W978H6KBVX2I TR operate in deep power-down mode, and what is its typical current draw?
Yes, W978H6KBVX2I TR supports deep power-down mode (IDD7), entered via EMRS command with MRS[12] = 1. Typical IDD7 is ≤10 µA at +25°C, enabling ultra-low standby power in battery-powered devices. Exit requires CKE high and tDPD ≥ 100 ns before valid commands.
Is W978H6KBVX2I TR compatible with LPDDR2-1066 controllers?
No, W978H6KBVX2I TR is specified for LPDDR2-800 operation (tCK = 2.5 ns min, 800 Mbps). While some timing parameters overlap, its tRCD/tRP = 3 cycles and RL/WL settings are optimized for 800 Mbps. Using it with a 1066 Mbps controller risks timing violations unless the controller supports down-binned LPDDR2-800 mode.
W978H6KBVX2I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 134-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- HSUL_12
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- -
- Voltage - Supply:
- 1.14V ~ 1.3V, 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 134-VFBGA (10x11.5)
W978H6KBVX2I TR FAQ
1.How can I place an order for W978H6KBVX2I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W978H6KBVX2I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W978H6KBVX2I TR reliable?
The price and inventory of W978H6KBVX2I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W978H6KBVX2I TR is usually 5 days.
3.What payment methods are accepted for W978H6KBVX2I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W978H6KBVX2I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W978H6KBVX2I TR?
W978H6KBVX2I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W978H6KBVX2I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W978H6KBVX2I TR?
For technical support, including W978H6KBVX2I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W978H6KBVX2I TR requirements.
6.How does Aetrix verify that W978H6KBVX2I TR is sourced from the original manufacturer or authorized distributors?
All W978H6KBVX2I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W978H6KBVX2I TR meets industry standards.
7.What is the process for return or replacement of W978H6KBVX2I TR?
All W978H6KBVX2I TR units undergo pre-shipment inspection (PSI). If there is an issue with W978H6KBVX2I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W978H6KBVX2I TR part is unused and in its original packaging.
Return procedure for W978H6KBVX2I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W978H6KBVX2I TR Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
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Microchip Technology
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AT24C04C-SSHM-T
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Microchip Technology
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