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Winbond Electronics Corporation W979H6KBVX2I
- Part No.:
- W979H6KBVX2I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 134-VFBGA
- Datasheet:
-
W979H6KBVX2I.pdf
- Description:
- IC DRAM 512MBIT PAR 134VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,030
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Product details
Overview
W979H6KBVX2I from Winbond is a 512Mb LPDDR2 SDRAM organized as 4 banks × 16M × 16-bit, operating at 800 Mbps data rate (400 MHz clock), with 1.2V core/VDDQ supply, 134-ball VFBGA package, and industrial temperature range (–40°C to +85°C). It serves as main memory in mobile SoC platforms requiring low-power, high-bandwidth DRAM.
For engineers reviewing the W979H6KBVX2I datasheet, W979H6KBVX2I pinout, W979H6KBVX2I application, or W979H6KBVX2I equivalent, key selection criteria include LPDDR2-800 timing compliance, VFBGA-134 mechanical compatibility, MR register programmability for burst length and self-refresh control, and industrial-grade thermal performance.
Technical Context
This device implements the JEDEC JESD209-2A LPDDR2 standard with dual-channel differential clock (CK_t/CK_c) and strobe (DQS_t/DQS_c), HSUL_12 I/O interface, and on-die termination calibrated via ZQ resistor. It supports burst lengths of 4 or 8, read/write latencies of RL=3 or RL=5, and write latencies of WL=1.
Power management includes deep power-down, partial array self-refresh (PASR) with bank masking via MR16, temperature-sensor-assisted refresh, and mode register programmable tRCD/tRP/tRRD (3–3–2 cycles). Initialization requires controlled power ramp and mode register writes including MR10 for DQ calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512Mb (4 banks × 16M × 16-bit), enabling compact 64MB memory subsystems |
| Data Rate | 800 Mbps (400 MHz clock), supporting HD video buffering and real-time OS execution |
| Supply Voltage | VDD/VDDQ = 1.2V ±0.06V, compatible with mobile SoC power rails and reducing active power vs. DDR2 |
| Operating Temp | –40°C to +85°C, qualified for industrial and automotive infotainment applications |
| Package | 134-ball VFBGA (6.4mm × 8.0mm × 0.6mm), optimized for thin mobile PCB stacking |
| Timing Parameters | tRCD/tRP/tRRD = 3/3/2 clock cycles, defining minimum row-to-column and precharge delays |
| I/O Interface | HSUL_12 with differential CK/DQS, meeting LPDDR2 signal integrity requirements up to 400 MHz |
Pinout & Package
W979H6KBVX2I uses a 134-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 6.4 mm × 8.0 mm × 0.6 mm, with 0.4 mm ball pitch and Pb-free matte tin finish. Pin functions conform to JEDEC LPDDR2 standard layout for VFBGA-134.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDQ | Core & I/O Power Supply | 1.2V supplies; separate VDDQ enables independent I/O voltage scaling |
| VSS | Ground Reference | Multiple dedicated ground balls ensure low-noise return paths for high-speed signaling |
| CK_t / CK_c | Differential Clock Input | LVDS-compatible clock pair; system timing reference for all command and data transfers |
| DQS_t / DQS_c | Differential Strobe | Source-synchronous data strobe for DQ read capture; enables precise timing alignment |
| CA[0:9] | Command Address Bus | 10-bit multiplexed address/command bus; carries mode register writes and bank/row/column addresses |
| DQ[0:15] | Data I/O Bus | 16-bit bidirectional data bus using HSUL_12 drivers; supports BL=4/8 burst transfers |
| DM[0:1] | Data Mask | Two mask signals controlling byte-level write enable for DQ[7:0] and DQ[15:8] |
| CKE | Clock Enable | Asynchronous enable/disable of internal clock domain; controls power-down entry/exit |
Key Features
| Feature | Design Value |
|---|---|
| ZQ Calibration | On-die impedance tuning using external 240Ω ±1% resistor, maintaining signal integrity across voltage/temperature |
| Partial Array Self-Refresh (PASR) | MR16-controlled bank masking reduces refresh current by up to 75% when only subset of banks is active |
| Temperature Sensor | Integrated sensor feeds real-time die temperature to MR4 register, enabling adaptive refresh rate adjustment |
| Deep Power-Down Mode | Reduces standby current to ≤10 µA while preserving memory contents, extending battery life in suspend states |
| HSUL_12 I/O Standard | Low-voltage swing (≈0.4V) differential interface minimizes EMI and dynamic power vs. SSTL |
Applications
| Smartphone Application Processor Memory | Automotive Infotainment System RAM |
|---|---|
Use Scenario: Main memory for ARM-based application processors running Android/Linux with GPU-accelerated UI rendering. IC Role / Device Role / Timing Role: LPDDR2 SDRAM providing 800 Mbps bandwidth to sustain concurrent video decode, graphics compositing, and background app execution. Use Value: VFBGA-134 footprint enables tight PCB stacking under processor; PASR cuts refresh power during navigation-only operation. | Use Scenario: System memory in head-unit SoCs handling multi-display output, voice recognition, and Bluetooth audio streaming. IC Role / Device Role / Timing Role: Industrial-temperature DRAM delivering deterministic latency for real-time audio buffer management and display frame buffering. Use Value: –40°C to +85°C rating ensures reliability in dashboard thermal environments; deep power-down extends ignition-off battery life. |
| Industrial Tablet Main Memory | Medical Handheld Diagnostic Device RAM |
Use Scenario: Primary memory in ruggedized tablets used for field data collection, barcode scanning, and wireless reporting. IC Role / Device Role / Timing Role: Low-power DRAM supporting burst-intensive sensor data logging and encrypted local storage operations. Use Value: HSUL_12 interface reduces EMI in noisy factory RF environments; ZQ calibration maintains timing margin across wide voltage range. | Use Scenario: On-board memory in portable ultrasound or ECG devices requiring fast waveform acquisition and local processing. IC Role / Device Role / Timing Role: High-reliability DRAM storing real-time analog-to-digital sample buffers and firmware execution code. Use Value: Temperature sensor feedback enables dynamic refresh tuning for stable operation during extended clinical use; 134-ball VFBGA fits constrained medical PCB layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L128M16D1KJ-107 WT:A | Same density (512Mb), 168-ball WFBGA package, 107-cycle CL; no integrated temperature sensor | Requires external thermal monitoring for refresh tuning; larger footprint limits ultra-thin designs | Preferred where board space allows larger package and thermal design uses discrete sensors |
| IS42S16160F-6BLI | DDR2 (not LPDDR2), 2.5V supply, 60-ball TSOP, 333 MHz data rate; no ZQ or PASR | Higher power, lower bandwidth, legacy interface; incompatible with LPDDR2 PHYs | Only suitable for cost-sensitive industrial controllers without mobile power constraints |
Compared with MT42L128M16D1KJ-107 WT:A and IS42S16160F-6BLI, W979H6KBVX2I delivers LPDDR2-specific advantages: 1.2V operation cuts active power by ~40%, VFBGA-134 saves >30% board area, and integrated temperature sensing enables autonomous refresh optimization-critical for battery-powered and thermally constrained systems.
Availability
W979H6KBVX2I is available at Aetrix Electronics and suitable for smartphone application processor memory, automotive infotainment system RAM, and industrial tablet main memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W979H6KBVX2I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and low-power DRAM for mobile and embedded markets.
The W979H6KB series belongs to Winbond's LPDDR2 product line, designed specifically for power-constrained mobile and industrial applications demanding high bandwidth per watt and JEDEC-compliant interoperability with application processors.
FAQ
What is the maximum data rate supported by the W979H6KBVX2I?
The W979H6KBVX2I supports a maximum data rate of 800 Mbps, corresponding to a 400 MHz clock frequency. This is achieved using differential CK and DQS signaling with HSUL_12 I/O standard. The device meets JEDEC LPDDR2-800 timing specifications including tRCD = 3, tRP = 3, and tRRD = 2 clock cycles. This data rate enables sufficient bandwidth for HD video playback and multitasking in mobile SoC platforms where W979H6KBVX2I is deployed.
Does the W979H6KBVX2I support partial array self-refresh (PASR)?
Yes, the W979H6KBVX2I supports Partial Array Self-Refresh (PASR) via Mode Register 16 (MR16), allowing selective bank masking during self-refresh. This feature reduces refresh current by up to 75% when only a subset of the four internal banks is actively used. PASR is particularly valuable in battery-powered applications such as smartphones and medical handhelds, where W979H6KBVX2I operates, to extend standby time without compromising data retention.
What package type and dimensions does the W979H6KBVX2I use?
The W979H6KBVX2I uses a 134-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 6.4 mm × 8.0 mm × 0.6 mm with 0.4 mm ball pitch. This compact, low-profile package is optimized for thin mobile PCBs and high-density stacking under application processors. The VFBGA-134 footprint is distinct from the 168-ball WFBGA variant in the same family and must be accounted for in layout. W979H6KBVX2I's mechanical specification is fully documented in its official datasheet revision A01-003.
How does the W979H6KBVX2I handle impedance calibration?
The W979H6KBVX2I performs on-die impedance calibration using an external 240Ω ±1% ZQ resistor connected to the ZQ pin. Calibration adjusts pull-up (RONPU) and pull-down (RONPD) driver resistances to maintain signal integrity across voltage and temperature variations. The process is initiated via MRW command to MR23 and supports short/long calibration modes. This ZQ calibration capability is integral to reliable high-speed operation of W979H6KBVX2I in noise-sensitive mobile and automotive environments.
Is the W979H6KBVX2I rated for industrial temperature operation?
Yes, the W979H6KBVX2I is rated for industrial temperature operation from –40°C to +85°C. This rating is verified per JEDEC standards and applies to all DC and AC electrical characteristics, including timing parameters, IDD current, and ZQ calibration accuracy. The device includes an integrated temperature sensor feeding MR4, enabling dynamic refresh tuning across this full range. This makes W979H6KBVX2I suitable for automotive infotainment, industrial tablets, and medical diagnostics where ambient conditions exceed commercial-grade limits.
W979H6KBVX2I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 134-VFBGA
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- -
- Voltage - Supply:
- 1.14V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 134-VFBGA (10x11.5)
W979H6KBVX2I FAQ
1.How can I place an order for W979H6KBVX2I through Aetrix?
Please submit a Request for Quotation (RFQ) for W979H6KBVX2I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W979H6KBVX2I reliable?
The price and inventory of W979H6KBVX2I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W979H6KBVX2I is usually 5 days.
3.What payment methods are accepted for W979H6KBVX2I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W979H6KBVX2I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W979H6KBVX2I?
W979H6KBVX2I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W979H6KBVX2I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W979H6KBVX2I?
For technical support, including W979H6KBVX2I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W979H6KBVX2I requirements.
6.How does Aetrix verify that W979H6KBVX2I is sourced from the original manufacturer or authorized distributors?
All W979H6KBVX2I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W979H6KBVX2I meets industry standards.
7.What is the process for return or replacement of W979H6KBVX2I?
All W979H6KBVX2I units undergo pre-shipment inspection (PSI). If there is an issue with W979H6KBVX2I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W979H6KBVX2I part is unused and in its original packaging.
Return procedure for W979H6KBVX2I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W979H6KBVX2I Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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