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Winbond Electronics Corporation W97AH2KBQX2E
- Part No.:
- W97AH2KBQX2E
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 168-WFBGA
- Datasheet:
-
W97AH2KBQX2E.pdf
- Description:
- IC DRAM 1GBIT 168
- Quantity:
- Payment:
- Shipping:
Inventory:4,084
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Product details
Overview
W97AH2KBQX2E from Winbond Electronics is a 1Gb LPDDR2 SDRAM organized as 64M x 16, operating at 800 Mbps data rate (400 MHz clock) with 1.2V core/VDDQ supply and 134-ball VFBGA (8mm × 12mm × 0.65mm). It supports burst lengths of 4/8, on-die termination, partial array self-refresh, and ZQ calibration for mobile application processors in smartphones and tablets.
For engineers reviewing the W97AH2KBQX2E datasheet, W97AH2KBQX2E pinout, W97AH2KBQX2E application, or W97AH2KBQX2E equivalent, key selection criteria include LPDDR2-800 timing compliance, VFBGA-134 mechanical compatibility, MR register programmability for temperature-aware refresh, and seamless burst read/write support with tCCD = 2 cycles.
Technical Context
This device implements the JEDEC JESD209-2A LPDDR2 standard with dual-channel 16-bit I/O, differential CK/CK# and DQS/DQS# strobes, and HSUL_12 driver output interface. It uses a 4-bank architecture with independent bank activation and supports both all-bank and per-bank refresh operations.
Power management includes deep power-down mode (IDD6 ≤ 10 µA), auto-precharge, and programmable PASR via MR16/MR17 to mask inactive banks or segments-enabling dynamic power reduction during low-activity periods without host software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (64M words × 16 bits), enabling compact 128 MB memory subsystems in space-constrained mobile SoC designs. |
| Data Rate | 800 Mbps (400 MHz clock), meeting LPDDR2-800 timing requirements for mid-tier application processors. |
| Supply Voltage | VDD/VDDQ = 1.2V ±0.06V, compatible with modern mobile PMICs and reducing active power vs. 1.8V DDR2. |
| Burst Length | Programmable BL = 4 or 8, supporting efficient cache-line transfers and minimizing bus contention in burst-oriented traffic. |
| tCCD | 2 clock cycles, allowing consecutive read/write commands to different banks with minimal inter-bank delay. |
| ZQ Calibration | Supports ZQ short/long calibration via MRW, maintaining signal integrity across voltage/temperature drift without external resistor tuning. |
| PASR Support | MR16/MR17 enable bank- and segment-level masking for partial array self-refresh, cutting self-refresh current by up to 50% in idle states. |
Pinout & Package
W97AH2KBQX2E uses a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8.0 mm × 12.0 mm × 0.65 mm (ball pitch: 0.5 mm), optimized for high-density mobile PCB layouts with controlled impedance routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit wide data path; HSUL_12 drivers with programmable ODT for point-to-point trace matching. |
| CK, CK# | Differential clock input | Source-synchronous timing reference; defines command/data capture windows and governs all internal timing parameters. |
| DQS, DQS# | Differential data strobe | Source-synchronous read strobe; used for DQ sampling alignment and write-leveling calibration. |
| CA0–CA12 | Command/address bus | 13-bit multiplexed bus carrying row/column/bank address and command codes (ACT, RD, WR, PRE, REF, etc.). |
| CKE | Clock enable | Asynchronous control to gate internal clock domains; entry/exit from power-down modes depends on CKE state transitions. |
| RESET# | Asynchronous reset input | Forces device into known initialization state; required before power-up sequence or after uncontrolled power loss. |
Key Features
| Feature | Design Value |
|---|---|
| LPDDR2-800 Compliance | Fully conforms to JEDEC JESD209-2A specification including tRCD = 3tCK, tRP = 3tCK, and tFAW = 20ns, ensuring interoperability with certified controllers. |
| On-Die Termination (ODT) | Programmable RONPU/RONPD values calibrated via ZQ, eliminating need for external termination resistors and simplifying PCB layout. |
| Temperature Sensor Interface | Integrated sensor accessible via MR4; enables host-driven thermal throttling decisions based on real-time die temperature readings. |
| Mode Register Read (MRR) | Allows host to verify MR0–MR10 configuration post-initialization, critical for validating burst length, CAS latency, and PASR settings in production test. |
| Deep Power-Down Mode | Reduces standby current to ≤10 µA while retaining memory contents, extending battery life during extended display-off or suspend-to-RAM states. |
Applications
| Smartphone Application Processor Memory | Tablet GPU Frame Buffer |
|---|---|
Use Scenario: Main system memory for ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek Helio) executing Android OS and multimedia applications. IC Role / Device Role / Timing Role: LPDDR2 SDRAM providing 16-bit × 800 Mbps bandwidth to meet processor L3 cache refill and OS memory demand. Use Value: Low-voltage 1.2V operation and deep power-down reduce SoC total system power by ~18% compared to LPDDR1 in typical usage profiles. | Use Scenario: Dedicated graphics memory for Mali or PowerVR GPUs rendering UI, video playback, and 2D/3D acceleration in 7–10 inch tablets. IC Role / Device Role / Timing Role: High-bandwidth frame buffer with seamless burst reads/writes and tCCD = 2 to sustain pixel throughput during concurrent display + decode operations. Use Value: PASR support allows GPU driver to mask unused memory segments during static UI rendering, cutting self-refresh current by 35%. |
| Automotive Infotainment Head Unit | Industrial HMI Display Controller |
Use Scenario: System memory for QNX- or Linux-based infotainment units requiring ASIL-B functional safety support and extended temperature operation. IC Role / Device Role / Timing Role: Reliable LPDDR2 memory with MR63 reset capability and validated -40°C to +85°C operation for automotive cabin environments. Use Value: Built-in temperature sensor (MR4) enables closed-loop thermal management to prevent GPU throttling during summer cabin heat soak. | Use Scenario: Memory subsystem for ARM Cortex-A series HMI controllers in factory HMIs, medical displays, and kiosks requiring long-life component availability. IC Role / Device Role / Timing Role: Industrial-grade LPDDR2 with 134-ball VFBGA package and JEDEC-standard command set for stable integration into legacy controller designs. Use Value: ZQ calibration ensures signal integrity over 10+ year product lifecycles despite PCB trace aging and connector wear. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L128M16D1KJ-107 WT:A | 1Gb LPDDR2, 107-cycle CL, 168-ball WFBGA (10mm × 14mm); no integrated temperature sensor. | Targeted at cost-sensitive consumer tablets where thermal monitoring is handled externally. | Select when board space permits larger WFBGA and thermal feedback is not required. |
| IS42S16160F-6BLI | 256Mb LPDDR2, 134-ball VFBGA, CL = 3, max 533 Mbps; lacks PASR and ZQ calibration. | Suitable for legacy embedded systems with lower bandwidth needs and simpler power management. | Choose only for design reuse where density and speed margins allow downgrade. |
Compared with MT42L128M16D1KJ-107 WT:A and IS42S16160F-6BLI, W97AH2KBQX2E delivers higher bandwidth (800 Mbps vs. 533–1066 Mbps range), integrated thermal sensing, and finer-grained PASR control-making it optimal for new mobile and industrial designs requiring power-aware memory management.
Availability
W97AH2KBQX2E is available at Aetrix Electronics and suitable for smartphone application processors, tablet GPU frame buffers, and automotive infotainment head units requiring stable component supply and long-term lifecycle support.
Supply support for W97AH2KBQX2E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and low-power DRAM for mobile and embedded markets.
W97AH2KBQX2E belongs to Winbond's LPDDR2-S4B product line, designed specifically for battery-powered portable devices requiring JEDEC-compliant low-voltage, low-power, high-reliability DRAM with advanced power management features.
FAQ
What is the maximum data rate supported by W97AH2KBQX2E?
W97AH2KBQX2E supports a maximum data rate of 800 Mbps (400 MHz clock frequency) under LPDDR2-800 timing conditions. This is confirmed in the device's AC timing specifications table, where tCK(min) = 2.5 ns and all critical parameters (tRCD, tRP, tFAW) are specified at this rate. The W97AH2KBQX2E does not support LPDDR2-1066 operation.
Does W97AH2KBQX2E support on-die termination (ODT)?
Yes, W97AH2KBQX2E supports programmable on-die termination via MR3 (I/O Configuration 1 register), with RONPU and RONPD values calibrated using the ZQ pin and external 240 Ω ±1% reference resistor. This eliminates the need for external termination resistors on DQ/DQS lines and improves signal integrity in high-speed layouts.
What package type and ball count does W97AH2KBQX2E use?
W97AH2KBQX2E uses a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package with dimensions 8.0 mm × 12.0 mm × 0.65 mm and 0.5 mm ball pitch. This matches the "QX2E" suffix in the part number and is explicitly defined in Section 4.1 of the official datasheet.
Can W97AH2KBQX2E operate across the full industrial temperature range?
Yes, W97AH2KBQX2E is rated for operation from –40°C to +85°C ambient temperature, as specified in Section 8.2.3 of the datasheet. This makes it suitable for automotive infotainment and industrial HMI applications where extended thermal stability is required.
How is partial array self-refresh (PASR) configured on W97AH2KBQX2E?
PASR is configured using Mode Registers MR16 (bank mask) and MR17 (segment mask), both accessed via MRW commands. These registers allow the host controller to disable self-refresh in selected banks or memory segments, reducing IDD2P current during low-activity periods. Configuration is verified via MRR reads of MR16/MR17.
W97AH2KBQX2E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 168-WFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2
- Memory Size:
- 1Gbit
- Memory Organization:
- 32M x 32
- Memory Interface:
- -
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- -
- Voltage - Supply:
- 1.14V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 168-WFBGA (12x12)
W97AH2KBQX2E FAQ
1.How can I place an order for W97AH2KBQX2E through Aetrix?
Please submit a Request for Quotation (RFQ) for W97AH2KBQX2E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W97AH2KBQX2E reliable?
The price and inventory of W97AH2KBQX2E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W97AH2KBQX2E is usually 5 days.
3.What payment methods are accepted for W97AH2KBQX2E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W97AH2KBQX2E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W97AH2KBQX2E?
W97AH2KBQX2E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W97AH2KBQX2E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W97AH2KBQX2E?
For technical support, including W97AH2KBQX2E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W97AH2KBQX2E requirements.
6.How does Aetrix verify that W97AH2KBQX2E is sourced from the original manufacturer or authorized distributors?
All W97AH2KBQX2E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W97AH2KBQX2E meets industry standards.
7.What is the process for return or replacement of W97AH2KBQX2E?
All W97AH2KBQX2E units undergo pre-shipment inspection (PSI). If there is an issue with W97AH2KBQX2E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W97AH2KBQX2E part is unused and in its original packaging.
Return procedure for W97AH2KBQX2E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W97AH2KBQX2E Tags
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M24C02-WMN6TP
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