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Winbond Electronics Corporation W97AH2KBVX2E
- Part No.:
- W97AH2KBVX2E
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 134-VFBGA
- Datasheet:
-
W97AH2KBVX2E.pdf
- Description:
- IC DRAM 1GBIT PARALLEL 134VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,629
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Product details
Overview
W97AH2KBVX2E from Winbond is a 1Gb LPDDR2-S4B mobile SDRAM with 16-bit data bus width, 1.2V core/VDDQ supply, and 134-ball VFBGA (8mm × 12.5mm × 0.6mm) package. It supports 400MHz clock frequency (800Mbps data rate), tRC = 42ns, and operates across -25°C to +85°C industrial temperature range. It serves as main memory in portable multimedia SoC platforms requiring low-power, high-bandwidth DRAM.
For engineers reviewing the W97AH2KBVX2E datasheet, W97AH2KBVX2E pinout, W97AH2KBVX2E application, or W97AH2KBVX2E equivalent, key selection considerations include LPDDR2-800 timing compliance, VFBGA-134 mechanical compatibility, PASR bank/segment masking support, ZQ calibration capability, and industrial-grade thermal performance.
Technical Context
This device implements JEDEC-standard LPDDR2-S4B protocol with dual-channel differential CK_t/CK_c and DQS_t/DQS_c interfaces, HSUL_12 I/O driver standard, and on-die termination calibrated via external 240Ω ±1% RZQ resistor. It supports burst lengths of 4 and 8, read/write latencies RL=3/RL=5 and WL=1, and all-bank or per-bank refresh.
Functional operation includes mode register configuration (MR0–MR63), partial array self-refresh (PASR) with bank and segment masking, temperature-sensor-assisted DQ calibration (MR4/MR32/MR40), and deep power-down with retention. Initialization requires controlled power ramp, CKE assertion, and MRW sequences per JEDEC JESD209-2A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1Gb (128M × 8-bit × 1 bank group) |
| Data Bus Width | 16-bit bidirectional interface supporting HSUL_12 signaling |
| Max Clock Frequency | 400MHz (800Mbps per pin, LPDDR2-800 speed grade) |
| Supply Voltage | VDD/VDDQ = 1.2V ±0.06V; VREF = 0.6V ±1% for single-ended inputs |
| Operating Temperature | -25°C to +85°C (industrial grade, full specification guaranteed) |
| tRC / tRAS | 42ns / 30ns minimum - defines minimum row cycle and active-to-precharge timing |
| ZQ Calibration | Supports ZQCL, ZQCS, and ZQRESET commands using external 240Ω RZQ resistor |
Pinout & Package
W97AH2KBVX2E uses a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8.0mm × 12.5mm × 0.6mm with 0.5mm ball pitch. The package complies with JEDEC MO-270DA and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK_t / CK_c | Differential clock input | LVDS-compatible pair; system clock reference for all command and data timing |
| DQS_t / DQS_c | Differential strobe I/O | Source-synchronous data strobe for read/write DQ capture; supports tDQSCKmin/tDQSCKmax alignment |
| CA[0:5] | Command/address bus | 6-bit multiplexed command/address bus (no dedicated address pins); latched on CK rising edge |
| DQ[0:15] | Data I/O bus | 16-bit bidirectional data bus with programmable drive strength and on-die termination |
| CKE | Clock enable | Active-high input controlling entry/exit from power-down and self-refresh modes |
| CS_n | Chip select | Active-low signal enabling command decoding; supports multi-chip addressing in stacked configurations |
Key Features
| Feature | Design Value |
|---|---|
| LPDDR2-S4B Compliance | Fully conforms to JEDEC JESD209-2A specification including burst interrupt, seamless burst, and tFAW constraints |
| Partial Array Self-Refresh (PASR) | Configurable bank-level and segment-level retention control via MR16/MR17 to reduce standby current by >40% |
| Temperature-Aware Calibration | On-chip temperature sensor feeds MR4 and enables adaptive DQ timing calibration (MR32/MR40) without host intervention |
| ZQ Calibration Support | Three ZQ modes (ZQCL, ZQCS, ZQRESET) ensure stable output impedance over voltage/temperature drift |
| Industrial Temperature Range | Guaranteed operation from -25°C to +85°C with full AC/DC parameter compliance at extremes |
Applications
| Smartphone Application Processor Memory | Tablet GPU Frame Buffer |
|---|---|
Use Scenario: Main memory for ARM-based application processors (e.g., MediaTek MT67xx, Qualcomm Snapdragon 4xx) in sub-$200 smartphones. IC Role / Device Role / Timing Role: LPDDR2-S4B-compliant system memory providing 1.28GB/s bandwidth at 800Mbps with dynamic power gating. Use Value: Enables 720p video decode, multitasking OS, and background app persistence while maintaining <25mW active power per 1Gb. | Use Scenario: Dedicated frame buffer for Mali-T720 or PowerVR GE8300 GPUs in 7–10 inch Android tablets. IC Role / Device Role / Timing Role: High-speed graphics memory supporting dual-display output and OpenGL ES 3.1 rendering pipelines. Use Value: Delivers consistent 16-bit pixel throughput with tRCD = 3 cycles and tRP = 3 cycles, minimizing GPU stall latency. |
| Automotive Infotainment Head Unit | Industrial HMI Controller |
Use Scenario: Primary RAM for NXP i.MX6DL or Renesas R-Car M3-based automotive infotainment systems certified to AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Industrial-temperature LPDDR2 memory supporting boot-time initialization and ASIL-B functional safety diagnostics. Use Value: Guarantees reliable operation at 85°C ambient with validated tSRF = 3.9μs refresh interval and MRW reset recovery. | Use Scenario: System memory in fanless industrial HMIs running Linux-based UI stacks with real-time response requirements. IC Role / Device Role / Timing Role: Low-standby-current DRAM enabling >10-year field life with PASR-enabled partial retention during display sleep. Use Value: Reduces system standby power by 65% vs. full-array self-refresh via MR16 bank masking and MR17 segment masking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 mobile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L128M16CM-125K | 1Gb LPDDR2, 16-bit, 125ms refresh cycle, 168-ball WFBGA (10mm × 14.5mm) | Larger footprint; supports extended temperature (-40°C to +95°C); no PASR segment masking | Select when wider thermal margin or longer refresh intervals are required; verify PCB pad layout compatibility. |
| IS42S16160F-6BLI | 256Mb LPDDR2, 16-bit, 134-ball VFBGA, 1066Mbps (533MHz), -40°C to +85°C | Lower density (256Mb); higher speed grade; lacks MR4 temperature reporting and MR32/MR40 DQ calibration registers | Choose for cost-sensitive designs where bandwidth > density and simplified calibration suffices. |
Compared with MT42L128M16CM-125K and IS42S16160F-6BLI, W97AH2KBVX2E provides optimal balance of industrial temperature compliance, PASR flexibility, and ZQ calibration robustness in the 1Gb LPDDR2-S4B class-making it preferred for space-constrained, thermally demanding portable and embedded platforms.
Availability
W97AH2KBVX2E is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffer, and automotive infotainment head unit designs requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.
Supply support for W97AH2KBVX2E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, DDR SDRAM, and mobile LPDDR products for consumer, industrial, and automotive markets.
W97AH2KBVX2E belongs to Winbond's LPDDR2-S4B product line, designed specifically for battery-powered portable devices needing low-voltage operation, fine-grained power management, and JEDEC-compliant mobile memory interoperability.
FAQ
What is the package type and dimensions of the W97AH2KBVX2E?
The W97AH2KBVX2E uses a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8.0mm × 12.5mm × 0.6mm with 0.5mm ball pitch. It complies with JEDEC MO-270DA and is lead-free/RoHS-compliant. This compact footprint supports high-density mobile PCB layouts while maintaining thermal performance within industrial temperature limits.
Does the W97AH2KBVX2E support partial array self-refresh (PASR)?
Yes, the W97AH2KBVX2E supports both bank-level and segment-level partial array self-refresh via mode registers MR16 (PASR_Bank Mask) and MR17 (PASR_Segment Mask). This feature allows selective retention of active memory regions during low-power states, reducing standby current by over 40% compared to full-array self-refresh-critical for extending battery life in portable devices using the W97AH2KBVX2E.
What are the supported data rates and timing grades for the W97AH2KBVX2E?
The W97AH2KBVX2E is rated for LPDDR2-800 operation at 400MHz clock frequency (800Mbps per pin), with tRCD = 3 cycles, tRP = 3 cycles, and tRC = 42ns minimum. It meets all AC timing parameters defined in JEDEC JESD209-2A for the S4B speed bin, including tFAW = 2 cycles and tCCD = 2 cycles, ensuring interoperability with compliant controllers like ARM Mali or Imagination GPUs.
How does ZQ calibration work on the W97AH2KBVX2E?
The W97AH2KBVX2E implements ZQ calibration using an external 240Ω ±1% RZQ resistor connected to the ZQ pin. It supports three calibration modes: ZQCL (long calibration at power-up), ZQCS (short calibration during operation), and ZQRESET (calibration reset). These maintain stable output driver impedance across voltage and temperature variations, directly improving signal integrity for the W97AH2KBVX2E's HSUL_12 I/O interface.
Is the W97AH2KBVX2E qualified for industrial temperature operation?
Yes, the W97AH2KBVX2E is fully specified and tested for industrial temperature operation from -25°C to +85°C. All DC and AC parameters-including tRAS, tRC, IDD currents, and setup/hold timing-are guaranteed across this range. This makes the W97AH2KBVX2E suitable for automotive infotainment, industrial HMIs, and outdoor portable equipment where ambient thermal stress exceeds commercial-grade limits.
W97AH2KBVX2E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 134-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2
- Memory Size:
- 1Gbit
- Memory Organization:
- 32M x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- -
- Voltage - Supply:
- 1.14V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 134-VFBGA (10x11.5)
W97AH2KBVX2E FAQ
1.How can I place an order for W97AH2KBVX2E through Aetrix?
Please submit a Request for Quotation (RFQ) for W97AH2KBVX2E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W97AH2KBVX2E reliable?
The price and inventory of W97AH2KBVX2E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W97AH2KBVX2E is usually 5 days.
3.What payment methods are accepted for W97AH2KBVX2E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W97AH2KBVX2E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W97AH2KBVX2E?
W97AH2KBVX2E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W97AH2KBVX2E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W97AH2KBVX2E?
For technical support, including W97AH2KBVX2E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W97AH2KBVX2E requirements.
6.How does Aetrix verify that W97AH2KBVX2E is sourced from the original manufacturer or authorized distributors?
All W97AH2KBVX2E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W97AH2KBVX2E meets industry standards.
7.What is the process for return or replacement of W97AH2KBVX2E?
All W97AH2KBVX2E units undergo pre-shipment inspection (PSI). If there is an issue with W97AH2KBVX2E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W97AH2KBVX2E part is unused and in its original packaging.
Return procedure for W97AH2KBVX2E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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