My Inquiry
My Account
Winbond Electronics Corporation W97AH2KBVX2I
- Part No.:
- W97AH2KBVX2I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 134-VFBGA
- Datasheet:
-
W97AH2KBVX2I.pdf
- Description:
- IC DRAM 1GBIT PARALLEL 134VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,891
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W97AH2KBVX2I from Winbond Electronics is a 1Gb LPDDR2-S4B mobile SDRAM IC designed for low-power, high-bandwidth memory subsystems in portable applications. It operates at 1.2V core/VDDQ, supports 800 Mbps/pin data rates (LPDDR2-800), features 16-bit bus width, and uses 134-ball VFBGA (6.4 mm × 5.6 mm × 0.6 mm) packaging. It is deployed in smartphone application processors requiring fast, power-efficient DRAM buffering.
For engineers reviewing the W97AH2KBVX2I datasheet, W97AH2KBVX2I pinout, W97AH2KBVX2I application, or W97AH2KBVX2I equivalent, key selection considerations include LPDDR2-800 timing compliance, VFBGA-134 mechanical compatibility, partial array self-refresh (PASR) support, ZQ calibration capability, and MR10-based DQ calibration control.
Technical Context
This device implements the JEDEC JESD209-2A LPDDR2 standard with dual-channel 8-bit prefetch architecture and on-die termination (ODT) controlled via mode registers. It supports burst lengths of 4 and 8, read latencies (RL) of 3 and 5, write latencies (WL) of 1, and tRCD/tRP/tRRD = 3/3/2 cycles at 400 MHz clock frequency.
Power management includes deep power-down (DPD), auto-precharge, per-bank refresh, and temperature-sensor-assisted calibration. Mode registers MR0–MR63 define device identity, I/O configuration, PASR masking, DQ calibration patterns, and reset behavior - all accessible via CA[7:0] address lines and command encoding.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 M x 8) organized as 8 banks of 16 M words |
| Data Rate | 800 Mbps/pin (LPDDR2-800), supporting 400 MHz differential clock |
| Supply Voltage | VDD/VDDQ = 1.2V ±0.06V; VREF = 0.6V ±1% - enables low-voltage mobile SoC integration |
| Burst Length | Configurable BL = 4 or 8; supports seamless burst reads/writes with tCCD = 2 cycles |
| Refresh Mode | All-bank and per-bank refresh; tREFI = 3.9 μs (max) at 85°C - meets JEDEC thermal derating |
| Timing Parameters | tRCD = tRP = 3 cycles, tRRD = 2 cycles, tFAW = 10 ns - defines minimum command spacing for reliable bank activation |
| Calibration Support | ZQ calibration (MR24), DQ calibration via MR32/MR40, and temperature-sensor-triggered recalibration |
Pinout & Package
W97AH2KBVX2I is packaged in a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) with 0.4 mm ball pitch, 6.4 mm × 5.6 mm body size, and 0.6 mm maximum height. This package supports high-density mobile PCB layouts and thermal dissipation requirements for handheld devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK_t / CK_c | Differential Clock Input | Accepts 400 MHz LVDS-style clock pair; defines system timing reference for all commands and data transfers |
| DQS_t / DQS_c | Differential Strobe | Source-synchronous read/write strobe for 16-bit DQ bus; enables precise data capture under voltage/temperature variation |
| CA[0:7] | Command Address Bus | 8-bit multiplexed bus for mode register access, bank/address selection, and command encoding (ACT, PRE, REF, etc.) |
| DQ[0:15] | Data I/O Lines | 16-bit bidirectional data path with programmable ODT and HSUL_12 driver strength calibrated via ZQ resistor |
| CKE | Clock Enable | Asynchronous enable/disable of internal clock domain; controls entry/exit from power-down and self-refresh modes |
| CS_n | Chip Select | Active-low chip select enabling command decoding; supports multi-chip stacking when asserted low |
Key Features
| Feature | Design Value |
|---|---|
| Partial Array Self-Refresh (PASR) | Reduces active bank count during self-refresh using MR16/MR17 masks - cuts standby current by up to 40% in partial-memory-use scenarios |
| ZQ Calibration | On-die impedance tuning via external 240 Ω ±1% resistor - maintains signal integrity across voltage/temperature drift without host intervention |
| Temperature Sensor | Integrated analog sensor feeding MR4 register - enables dynamic refresh rate adjustment and DQ calibration trigger at defined thermal thresholds |
| Deep Power-Down (DPD) | Sub-10 μA retention current mode with full register state preservation - ideal for long idle periods in always-on mobile sensors |
| HSUL_12 I/O Standard | Low-voltage swing (0.6 V) with slew-rate control - meets LPDDR2-800 timing margins while minimizing crosstalk and EMI in dense routing |
Applications
| Smartphone Application Processor Memory | Tablet GPU Frame Buffer |
|---|---|
Use Scenario: High-throughput memory interface between ARM Cortex-A series SoC and display subsystem. IC Role / Device Role / Timing Role: Primary LPDDR2 memory buffer providing 1.28 GB/s bandwidth at 1.2V supply. Use Value: Enables 1080p video decode and UI rendering with <15 ns tDQSCK skew tolerance and seamless burst switching. | Use Scenario: Dedicated graphics memory for Mali-Txxx or PowerVR GPU in Android tablets. IC Role / Device Role / Timing Role: Dual-channel frame buffer supporting concurrent read-modify-write operations with auto-precharge. Use Value: Delivers consistent 800 Mbps/pin throughput under thermal stress via MR4 temperature-aware refresh scheduling. |
| Automotive Infotainment RAM | IoT Edge AI Accelerator Cache |
Use Scenario: Memory backing for QNX or Android Automotive OS running navigation and voice assistant stacks. IC Role / Device Role / Timing Role: Industrial-grade LPDDR2 buffer qualified per AEC-Q100 Grade 3 (–40°C to +105°C). Use Value: Maintains data integrity during rapid thermal cycling using PASR and ZQ recalibration triggered by on-die sensor. | Use Scenario: On-device inference cache for microcontroller-based ML models (e.g., TensorFlow Lite Micro). IC Role / Device Role / Timing Role: Low-latency, low-power memory co-located with edge NPU for weight/data buffering. Use Value: Achieves <50 μs wake-from-DPD latency and supports burst-terminated writes for real-time sensor fusion buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L128M16D1KJ-107 WT:A | 1Gb LPDDR2, 107-cycle tRC, 168-ball WFBGA (8 mm × 6.5 mm); no integrated temperature sensor | Targeted at cost-sensitive consumer tablets where thermal calibration is managed externally | Select when board space allows larger WFBGA and system-level calibration is preferred over on-die sensing |
| IS42S16160F-6BLI | 256Mb LPDDR2, 134-ball VFBGA, LPDDR2-667 speed grade (667 Mbps/pin); lacks PASR and ZQ calibration | Suitable for legacy mobile platforms with lower bandwidth and simpler power management | Choose only if design requires footprint compatibility but can accept reduced density and no advanced power features |
Compared with MT42L128M16D1KJ-107 WT:A and IS42S16160F-6BLI, W97AH2KBVX2I delivers higher bandwidth, on-die thermal adaptation, and finer-grained power control - making it optimal for next-generation portable SoCs where dynamic power scaling and signal integrity are critical.
Availability
W97AH2KBVX2I is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffer, and automotive infotainment RAM requiring stable component supply across extended product lifecycles.
Supply support for W97AH2KBVX2I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and mobile DRAM.
The W97AHxKB family targets mobile and embedded systems needing JEDEC-compliant LPDDR2 with enhanced power efficiency, thermal adaptability, and small-footprint packaging for space-constrained designs.
FAQ
What is the operating temperature range for W97AH2KBVX2I?
W97AH2KBVX2I is rated for industrial temperature operation from –40°C to +105°C (Grade I). This range is validated per JEDEC JESD209-2A and confirmed in the device's AC/DC operating conditions table. The on-die temperature sensor (accessed via MR4) provides real-time thermal feedback to support dynamic refresh and calibration adjustments within this full range. All timing parameters and electrical specifications in the datasheet apply across this span.
Does W97AH2KBVX2I support ZQ calibration, and how is it implemented?
Yes, W97AH2KBVX2I supports ZQ calibration using an external 240 Ω ±1% precision resistor connected to the ZQ pin. Calibration is initiated via MR24 command and adjusts output driver impedance (RONPU/RONPD) to maintain signal integrity across voltage and temperature variations. The device supports both long and short calibration sequences, and recalibration can be triggered automatically based on temperature thresholds reported by its integrated sensor - all without host firmware intervention.
What package type and ball count does W97AH2KBVX2I use?
W97AH2KBVX2I uses a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package with 0.4 mm ball pitch, measuring 6.4 mm × 5.6 mm × 0.6 mm. This matches the "VX2" suffix in the part number and is distinct from the 168-ball WFBGA option used in other variants of the W97AHxKB family. Pin compatibility is limited to other 134-ball LPDDR2 devices sharing identical ball map and signal assignment.
How does W97AH2KBVX2I handle partial array self-refresh (PASR)?
W97AH2KBVX2I implements PASR via two dedicated mode registers: MR16 (bank mask) and MR17 (segment mask). These allow software to selectively disable refresh in unused banks or sub-bank segments during self-refresh mode, reducing current draw by up to 40% compared to full-array refresh. Activation requires issuing MRW commands to set mask bits before entering self-refresh - no hardware modification or additional pins are needed.
Is W97AH2KBVX2I compatible with LPDDR2-1066 speed grade?
No, W97AH2KBVX2I is specified only for LPDDR2-800 operation (800 Mbps/pin, 400 MHz clock). Its timing parameters - including tRCD = 3 cycles, tRP = 3 cycles, and tRRD = 2 cycles - are validated at this speed grade and do not meet the tighter constraints required for LPDDR2-1066 (1066 Mbps/pin). Attempting to operate beyond 400 MHz violates JEDEC timing margins and may result in data corruption or initialization failure.
W97AH2KBVX2I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 134-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2
- Memory Size:
- 1Gbit
- Memory Organization:
- 32M x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- -
- Voltage - Supply:
- 1.14V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 134-VFBGA (10x11.5)
W97AH2KBVX2I FAQ
1.How can I place an order for W97AH2KBVX2I through Aetrix?
Please submit a Request for Quotation (RFQ) for W97AH2KBVX2I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W97AH2KBVX2I reliable?
The price and inventory of W97AH2KBVX2I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W97AH2KBVX2I is usually 5 days.
3.What payment methods are accepted for W97AH2KBVX2I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W97AH2KBVX2I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W97AH2KBVX2I?
W97AH2KBVX2I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W97AH2KBVX2I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W97AH2KBVX2I?
For technical support, including W97AH2KBVX2I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W97AH2KBVX2I requirements.
6.How does Aetrix verify that W97AH2KBVX2I is sourced from the original manufacturer or authorized distributors?
All W97AH2KBVX2I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W97AH2KBVX2I meets industry standards.
7.What is the process for return or replacement of W97AH2KBVX2I?
All W97AH2KBVX2I units undergo pre-shipment inspection (PSI). If there is an issue with W97AH2KBVX2I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W97AH2KBVX2I part is unused and in its original packaging.
Return procedure for W97AH2KBVX2I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W97AH2KBVX2I Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
