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Winbond Electronics Corporation W97BH2KBVX2I
- Part No.:
- W97BH2KBVX2I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 134-VFBGA
- Datasheet:
-
W97BH2KBVX2I.pdf
- Description:
- IC DRAM 2GBIT PARALLEL 134VFBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
W97BH2KBVX2I from Winbond Electronics is a 2Gb LPDDR2-S4B synchronous DRAM with 1.2V core/VDDQ supply, 800 Mbps/pin data rate (LPDDR2-800), and 134-ball VFBGA (8mm × 10.5mm × 0.6mm) package. It supports burst lengths of 4/8, on-die termination, partial array self-refresh, and ZQ calibration for mobile SoC memory subsystems in smartphones and tablets.
For engineers reviewing the W97BH2KBVX2I datasheet, W97BH2KBVX2I pinout, W97BH2KBVX2I application, or W97BH2KBVX2I equivalent, key selection criteria include LPDDR2-800 timing compliance (tRCD = 3, tRP = 3, tRRD = 2), MR10-based DQ calibration support, PASR bank/segment masking capability, and VFBGA-134 mechanical compatibility with space-constrained mobile PCB layouts.
Technical Context
This device implements the JEDEC LPDDR2 S4B standard with dual-channel 16-bit I/O architecture, supporting both single-ended CA/CS_n signaling and differential CK_t/CK_c and DQS_t/DQS_c interfaces. It uses HSUL_12 I/O drivers with programmable RONPU/RONPD and ZQ calibration for impedance matching.
Functional operation includes mode register configuration (MR0–MR63), temperature-sensing via MR4, seamless burst reads/writes (tCCD = 2), and power management states: active, precharge, power-down, deep power-down, and self-refresh with bank- or segment-level masking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256M × 8-bit organization) |
| Data Rate | 800 Mbps/pin (LPDDR2-800, 400 MHz clock) |
| Supply Voltage | VDD/VDDQ = 1.2V ± 0.06V - defines core logic and I/O voltage tolerance for battery-powered systems |
| Burst Length | Configurable BL = 4 or 8 - determines minimum read/write transaction size per command |
| tRCD / tRP / tRRD | 3/3/2 clock cycles - critical timing constraints for activate-to-read/write and row precharge sequencing |
| Package | 134-ball VFBGA (8.0mm × 10.5mm × 0.6mm, 0.5mm pitch) - enables high-density mobile PCB routing |
| Operating Temp | -40°C to +95°C (Industrial grade) - supports extended thermal environments in handheld devices |
Pinout & Package
W97BH2KBVX2I is housed in a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package with 0.5 mm ball pitch, 8.0 mm × 10.5 mm body size, and 0.6 mm maximum height. Pin assignments follow JEDEC-standard LPDDR2 S4B layout for 16-bit data bus, 14-bit address/command bus, and dedicated differential clocks/strobes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (bidirectional) | 16-bit data bus using HSUL_12 drivers; supports write data mask (DM) and DQS-strobed reads/writes |
| CK_t / CK_c | Differential clock input | True LVDS-style clock pair; defines system timing reference with 50% duty cycle requirement |
| DQS_t / DQS_c | Differential strobe (bidirectional) | Source-synchronous strobe for DQ capture; toggles on read, driven by controller on write |
| CA0–CA13 | Command/address bus | 14-bit single-ended bus carrying commands (ACT, PRE, REF), addresses, and mode register codes |
| CS_n | Chip select | Active-low enable controlling command decoding; required for all valid operations |
| CKE | Clock enable | Controls entry/exit from power-down and self-refresh; must be stable during critical timing windows |
| ZQ | Calibration reference | Connects to external 240Ω ±1% resistor for on-die RONPU/RONPD calibration and output impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| On-die termination (ODT) | Programmable ODT resistance (75Ω/150Ω) reduces signal reflections on high-speed DQ/DQS lines without external resistors |
| ZQ calibration | Supports ZQ short/long calibration cycles (MR24) to maintain output driver impedance accuracy across voltage/temperature drift |
| Partial array self-refresh (PASR) | MR16/MR17 enable selective refresh of active banks or segments - cuts self-refresh current by up to 50% in idle memory regions |
| Temperature sensor | Integrated sensor (accessed via MR4) provides real-time die temperature for dynamic refresh rate adjustment (tREFI scaling) |
| HSUL_12 I/O standard | Low-voltage swing (0.6V) differential interface compatible with LPDDR2-800 timing and mobile SoC PHYs |
Applications
| Smartphone Application | Tablet Memory Subsystem |
|---|---|
Use Scenario: Main system memory for application processors in mid-tier Android smartphones with 2GB RAM configuration. IC Role / Device Role / Timing Role: LPDDR2-800-compliant DRAM providing 1.28 GB/s bandwidth to ARM Cortex-A series CPUs. Use Value: VFBGA-134 footprint enables compact motherboard layout; PASR reduces standby power to <15 µA per bank during display-off states. | Use Scenario: Shared memory pool for GPU and CPU in 7–10 inch Android tablets with integrated LTE modems. IC Role / Device Role / Timing Role: Dual-channel 16-bit LPDDR2 interface synchronized to 400 MHz clock with tRCD = 3 cycles for low-latency graphics frame buffering. Use Value: ZQ calibration maintains signal integrity across wide temperature range (-40°C to +95°C); MR10 DQ calibration ensures setup/hold margin at 800 Mbps. |
| Automotive Infotainment | IoT Gateway Buffer |
Use Scenario: Application memory in automotive-grade infotainment head units requiring AEC-Q200 stress reliability. IC Role / Device Role / Timing Role: Industrial-temperature LPDDR2 DRAM interfacing with NXP i.MX6/8 SoCs under ASIL-B functional safety constraints. Use Value: Deep power-down mode (tDPD = 100 ns exit) enables rapid wake-up from navigation idle; MR4 temperature reporting supports thermal throttling. | Use Scenario: Local buffer memory for edge AI inference engines in industrial IoT gateways with intermittent cloud connectivity. IC Role / Device Role / Timing Role: Low-power DRAM storing neural network weights and intermediate tensors during offline inference bursts. Use Value: Partial array self-refresh (PASR) reduces average current to 25 µA when only 25% of memory is active - extends battery life in battery-backed deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR2 memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT42L256M16LX-107:J | 2Gb LPDDR2-1066 (533 MHz), 168-ball WFBGA, higher speed but wider package (10mm × 12.5mm) | Requires PCB redesign for larger footprint and tighter routing; suited for performance-critical designs needing >1.7 GB/s bandwidth | Select if system clock supports 533 MHz and board area allows 168-ball WFBGA |
| IS42S16160F-6BLI | 2Gb LPDDR2-667 (333 MHz), 134-ball VFBGA, same package but lower data rate and no PASR or ZQ calibration | Lacks advanced power management features; suitable for cost-sensitive, thermally stable consumer electronics | Select if design targets ≤667 Mbps and does not require dynamic refresh or impedance calibration |
Compared with MT42L256M16LX-107:J and IS42S16160F-6BLI, W97BH2KBVX2I delivers optimal balance of LPDDR2-800 speed, industrial temperature range, VFBGA-134 compactness, and feature-rich power management - making it ideal for space-constrained mobile and embedded platforms where thermal and layout constraints dominate.
Availability
W97BH2KBVX2I is available at Aetrix Electronics and suitable for smartphone memory subsystems, tablet application buffers, and automotive infotainment modules requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.
Supply support for W97BH2KBVX2I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and low-power DRAM for mobile and embedded markets.
W97BH2KBVX2I belongs to Winbond's LPDDR2-S4B product line, designed specifically for energy-efficient, high-bandwidth memory interfaces in battery-powered portable devices with strict PCB area and thermal constraints.
FAQ
What is the operating temperature range for W97BH2KBVX2I?
W97BH2KBVX2I is rated for industrial temperature operation from -40°C to +95°C. This range is confirmed in Section 8.2.3 of the official datasheet and validated across AC/DC electrical tests. The device includes an integrated temperature sensor (accessible via MR4) to support dynamic refresh rate adjustment within this full range. W97BH2KBVX2I maintains LPDDR2-800 timing compliance and signal integrity across the entire span without derating.
Does W97BH2KBVX2I support ZQ calibration, and how is it implemented?
Yes, W97BH2KBVX2I supports both ZQ short and long calibration cycles per JEDEC LPDDR2 specification. Calibration is initiated via MR24 command and references an external 240Ω ±1% resistor connected to the ZQ pin. The device adjusts its output driver pull-up (RONPU) and pull-down (RONPD) impedances to match target values, ensuring consistent signal integrity across voltage and temperature variations. This function is mandatory for stable 800 Mbps operation and is documented in Sections 7.4.24 and 8.2.6.
What package type and ball count does W97BH2KBVX2I use?
W97BH2KBVX2I uses a 134-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8.0 mm × 10.5 mm × 0.6 mm with 0.5 mm ball pitch. This matches the "VX" suffix in the part number and is explicitly defined in Section 4.1 of the datasheet. It is distinct from the 168-ball WFBGA option used in the W97BH6KB variant and is optimized for compact mobile PCB layouts.
Can W97BH2KBVX2I operate at LPDDR2-1066 speed?
No, W97BH2KBVX2I is specified only for LPDDR2-800 operation (400 MHz clock, 800 Mbps/pin). Its timing parameters - including tRCD = 3, tRP = 3, and tRRD = 2 - are validated exclusively at this data rate. The datasheet does not list AC characteristics or timing margins for 533 MHz operation, and attempting LPDDR2-1066 may result in setup/hold violations or data corruption. For 1066 Mbps, Winbond offers the W97BH6KB variant in 168-ball WFBGA.
How does partial array self-refresh (PASR) work in W97BH2KBVX2I?
W97BH2KBVX2I implements PASR through Mode Registers MR16 (bank mask) and MR17 (segment mask), allowing selective refresh of only active memory regions. When enabled, unused banks or segments are excluded from periodic refresh cycles, reducing self-refresh current by up to 50%. This feature is controlled entirely via MR writes and requires no external hardware. PASR behavior is fully defined in Sections 7.4.18–7.4.19 and validated across the -40°C to +95°C range.
W97BH2KBVX2I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 134-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR2
- Memory Size:
- 2Gbit
- Memory Organization:
- 64M x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- -
- Voltage - Supply:
- 1.14V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 134-VFBGA (10x11.5)
W97BH2KBVX2I FAQ
1.How can I place an order for W97BH2KBVX2I through Aetrix?
Please submit a Request for Quotation (RFQ) for W97BH2KBVX2I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W97BH2KBVX2I reliable?
The price and inventory of W97BH2KBVX2I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W97BH2KBVX2I is usually 5 days.
3.What payment methods are accepted for W97BH2KBVX2I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W97BH2KBVX2I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W97BH2KBVX2I?
W97BH2KBVX2I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W97BH2KBVX2I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W97BH2KBVX2I?
For technical support, including W97BH2KBVX2I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W97BH2KBVX2I requirements.
6.How does Aetrix verify that W97BH2KBVX2I is sourced from the original manufacturer or authorized distributors?
All W97BH2KBVX2I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W97BH2KBVX2I meets industry standards.
7.What is the process for return or replacement of W97BH2KBVX2I?
All W97BH2KBVX2I units undergo pre-shipment inspection (PSI). If there is an issue with W97BH2KBVX2I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W97BH2KBVX2I part is unused and in its original packaging.
Return procedure for W97BH2KBVX2I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W97BH2KBVX2I Tags
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