Winbond Electronics Corporation W97BH6MBVA1I

Overview

W97BH6MBVA1I from Winbond Electronics is a 2Gb LPDDR2-S4B mobile SDRAM in 136-ball VFBGA package, operating at 1066 Mbps data rate (533 MHz clock), with 1.2V core/VDDQ supply, 8-bit prefetch architecture, and support for partial array self-refresh (PASR) and ZQ calibration. It serves as main memory in power-constrained mobile SoC platforms such as LTE smartphones and embedded tablets.

For engineers reviewing the W97BH6MBVA1I datasheet, W97BH6MBVA1I pinout, W97BH6MBVA1I application, or W97BH6MBVA1I equivalent, key selection criteria include LPDDR2-1066 timing compliance (tRCD = 3, tRP = 3, RL = 3/WL = 1), HSUL_12 I/O interface, temperature-sensor-enabled thermal management, and VFBGA-136 mechanical compatibility with mobile PCB stack-ups.

Technical Context

This LPDDR2 device implements dual-channel 16-bit × 16M organization (2Gb total), with four internal banks and programmable burst lengths (BL = 4/8). Its command interface uses CA[0:9] address/command bus, CK/CK#, DQS/DQS# differential strobes, and HSUL_12-compatible DQ/DM signals.

Power management includes deep power-down (DPD), auto-precharge, per-bank refresh, and PASR via MR16/MR17 mode registers. Calibration relies on internal ZQ resistor (RZQ = 240 Ω ±1%) and supports DQ timing adjustment through MR32/MR40 patterns.

Key Specifications

Pinout & Package

W97BH6MBVA1I is housed in a 136-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 10.5 mm × 12.5 mm × 0.8 mm (ball pitch = 0.5 mm), optimized for high-density mobile PCB layouts with strict height constraints.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR2 memory applications.

Compared with MT42L256M16RE-125:E and K4P2G324EC-ACF6, W97BH6MBVA1I offers tighter tRCD = 3 timing, broader VDDQ tolerance, integrated temperature sensing, and granular PASR - making it optimal for thermally adaptive, power-budget-constrained mobile SoCs.

Availability

W97BH6MBVA1I is available at Aetrix Electronics and suitable for smartphone baseband memory, tablet application processor cache, and automotive infotainment RAM requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W97BH6MBVA1I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and low-power DRAM for mobile and embedded markets.

The W97BH series targets LPDDR2 memory applications in battery-powered devices, emphasizing power efficiency, thermal awareness, and JEDEC-compliant interoperability with leading mobile SoCs.

FAQ

What is the maximum data rate supported by the W97BH6MBVA1I?

The W97BH6MBVA1I supports a maximum data rate of 1066 Mbps, achieved at a clock frequency of 533 MHz with read latency (RL) = 3 and write latency (WL) = 1. This performance level complies with JEDEC LPDDR2-1066 specifications and is validated under VDD/VDDQ = 1.2 V ±0.06 V and industrial temperature range (-40°C to +85°C). The W97BH6MBVA1I achieves this speed using HSUL_12 I/O drivers and precise ZQ calibration.

Does the W97BH6MBVA1I include an on-die temperature sensor?

Yes, the W97BH6MBVA1I integrates an on-die temperature sensor accessible via Mode Register MR4 (MA[7:0] = 04H). The sensor provides real-time junction temperature readings used by host SoCs for dynamic thermal management. This feature is confirmed in Section 7.4.21 of the official datasheet and distinguishes W97BH6MBVA1I from many competing LPDDR2 devices lacking embedded thermal monitoring.

What package type and ball count does the W97BH6MBVA1I use?

The W97BH6MBVA1I uses a 136-ball Very Fine Pitch Ball Grid Array (VFBGA) package with dimensions of 10.5 mm × 12.5 mm × 0.8 mm and 0.5 mm ball pitch. This package is explicitly documented in Section 4 (Ball Assignment) and Section 5 (Ball Configuration) of the Winbond datasheet revision A01-002. The VFBGA-136 footprint ensures compatibility with high-density mobile PCB layouts and automated assembly processes.

How does the W97BH6MBVA1I implement partial array self-refresh (PASR)?

The W97BH6MBVA1I implements PASR using two dedicated mode registers: MR16 (PASR_Bank Mask) and MR17 (PASR_Segment Mask). These registers allow selective disabling of inactive memory banks or segments during self-refresh, reducing current draw by up to 50%. This capability is detailed in Sections 7.3.13–7.3.14 of the datasheet and is enabled only when configured via MRW commands - not automatic.

What is the purpose of ZQ calibration in the W97BH6MBVA1I?

ZQ calibration in the W97BH6MBVA1I adjusts output driver impedance (RONPU/RONPD) to match an external 240 Ω ±1% reference resistor, ensuring consistent signal integrity across voltage and temperature variations. Supported via MRW commands to MR24, ZQ calibration is mandatory before high-speed operation and directly impacts tDQSCK timing margins. This function is specified in Sections 7.4.24 and 8.2.6 of the official datasheet.