Winbond Electronics Corporation W97BH6MBVA2I

Overview

W97BH6MBVA2I from Winbond Electronics is a 2Gb LPDDR2-S4B mobile SDRAM in 136-ball VFBGA package, operating at 1.2V core/VDDQ with 800 Mbps/pin data rate (LPDDR2-800), supporting 16-bit bus width and burst lengths of 4 or 8 for smartphone application processors and baseband SoCs.

For engineers reviewing the W97BH6MBVA2I datasheet, W97BH6MBVA2I pinout, W97BH6MBVA2I application, or W97BH6MBVA2I equivalent, key selection criteria include LPDDR2-800 timing compliance (tRCD = 3, tRP = 3, RL = 3/WL = 1), partial array self-refresh (PASR) support, ZQ calibration capability, and industrial temperature range (–40°C to +85°C).

Technical Context

This LPDDR2 device implements dual-bank architecture with 16M × 16 organization, supports both single-ended CA/CS_n signaling and differential CK/DQS pairs, and uses HSUL_12 I/O standard for DQ/DM lines. It features mode register programmability across MR0–MR63, including temperature-sensing (MR4), PASR bank/segment masking (MR16/MR17), and DQ calibration patterns (MR32/MR40).

Power management includes deep power-down (DPD), auto-precharge, and controlled power-off sequences with tSRF = 3.9 μs refresh interval. Initialization requires precise CKE ramp timing and MRW-based configuration, with tDQSCKmin = –0.25×tCK and tDQSCKmax = +0.5×tCK for read capture window alignment.

Key Specifications

Pinout & Package

Package: 136-ball Very Fine Pitch Ball Grid Array (VFBGA), 8 mm × 12.5 mm × 0.8 mm, 0.5 mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR2 mobile SDRAM applications.

Compared with W97BH6MBVA2I, MT42L128M16D1KJ-107 WT:A offers higher speed at increased layout complexity, while K4P2G324EC-AC20 matches timing and package but omits integrated temperature sensing-making W97BH6MBVA2I optimal for thermally adaptive mobile and industrial edge use cases.

Availability

W97BH6MBVA2I is available at Aetrix Electronics and suitable for smartphone application processors, mobile baseband modems, and automotive infotainment systems requiring stable component supply, long-lifecycle support, and industrial temperature compliance.

Supply support for W97BH6MBVA2I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, SLNAND, and low-power mobile DRAM products since 1987.

The W97BH series targets mobile and embedded platforms demanding LPDDR2-800 performance with industrial temperature range, ZQ calibration, and advanced power management-designed specifically for space-constrained, battery-sensitive applications.

FAQ

What is the maximum data rate supported by W97BH6MBVA2I?

W97BH6MBVA2I supports LPDDR2-800 operation at 800 Mbps per pin, corresponding to a 400 MHz clock frequency. This is confirmed in the AC timing specifications section of the datasheet, where tCK(min) = 2.5 ns defines the maximum clock rate. The device does not support LPDDR2-1066 or higher speeds, and attempting to exceed 400 MHz violates guaranteed timing parameters including tRCD and tRP.

Does W97BH6MBVA2I include an on-die temperature sensor?

Yes, W97BH6MBVA2I includes an integrated temperature sensor accessible via Mode Register MR4 (MA[7:0] = 04H). This sensor provides junction temperature data used for thermal-aware refresh rate adjustment and system-level thermal management decisions, distinguishing it from non-sensor LPDDR2 variants like K4P2G324EC-AC20.

What package type and ball count does W97BH6MBVA2I use?

W97BH6MBVA2I uses a 136-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8 mm × 12.5 mm × 0.8 mm with 0.5 mm ball pitch. This is explicitly defined in Section 4 ("Ball Assignment") and Section 5 ("Ball Configuration") of the official Winbond datasheet revision A01-002.

Can W97BH6MBVA2I operate in deep power-down mode?

Yes, W97BH6MBVA2I supports Deep Power-Down (DPD) mode with IDD7 ≤ 10 μA, as specified in Section 7.4.26 and Table 8.3.2. Entry requires specific command sequences with CKE low and CS_n high, and exit latency is fixed at tXPDLL = 100 ns. This mode retains full memory content while minimizing system standby power.

Is ZQ calibration required for W97BH6MBVA2I operation?

ZQ calibration is not mandatory for basic functionality but is strongly recommended for signal integrity across voltage and temperature variations. W97BH6MBVA2I uses the ZQ pin to calibrate RONPU and RONPD output drivers against a 240 Ω ±1% external resistor, as detailed in Section 7.4.24 and Table 8.2.6.6. Omitting ZQ may cause timing margin degradation above 300 Mbps/pin.